LED PACKAGE AND METHOD OF THE SAME
LED package includes a substrate with pre-formed P-type through-hole and N-type through-hole through the substrate; a reflective layer formed on an upper surface of the substrate; a LED die having P-type pad and N-type pad aligned with the P-type through-hole and the N-type through-hole; wherein the LED die is formed on the upper surface of the substrate; a refilling material within the P-type through-hole and the N-type through-hole thereby forming electrical connection from the P-type pad and the N-type pad; and a lens formed over the upper surface of the substrate.
1 . A LED package comprising:
a substrate with pre-formed P-type through-hole and N-type through-hole through said substrate;
a reflective layer formed on an upper surface of said substrate; a LED die having P-type pad and N-type pad aligned with said P-type through-hole and said N-type through-hole; said P-type pad and N-type pad being formed on a first surface of said LED die; wherein said LED die is formed on said upper surface of said substrate; and
a refilling material within said P-type through-hole and said N-type through-hole thereby forming electrical connection from said P-type pad and said N-type pad.
2 . The LED package of claim 1 , further comprising a lens formed over said upper surface of said substrate.
3 . The LED package of claim 1 , further comprising a P-type terminal pad under said substrate and coupled to said P-type pad through said P-type through hole. a N-type terminal pad under said substrate and coupled to said N-type pad through said N-type through hole.
4 . The LED package of claim 1 , further comprising an active area terminal pad under said substrate and coupled to said active area of said LED device.
5 . The LED structure of claim 1 , further comprising a transparent adhesive layer formed on said reflective layer.
6 . The LED package of claim 5 , wherein said reflective layer is formed by sputtering, or E-plating Ag or Al or Au.
7 . The LED package of claim 1 , wherein said LED die includes sapphire substrate without reflection layer on said second surface.
8 . The LED package of claim 7 , wherein a phosphor material is formed on a second surface of said LED die; said first surface is different from said second surface.
9 . The LED package of claim 1 , wherein refilling material is formed by Aluminum, Titanium, Copper, Nicole or Silver.
10 . The LED package of claim 9 , wherein refilling material is formed by Cu/Ni/Au.