System with a high power chip and a low power chip having low interconnect parasitics
An IC system includes low-power chips, e.g., memory chips, located proximate one or more higher power chips, e.g., logic chips, without suffering the effects of overheating. The IC system may include a high-power chip disposed on a packaging substrate and a low-power chip embedded in the packaging substrate to form a stack. Because portions of the packaging substrate thermally insulate the low-power chip from the high-power chip, the low-power chip can be embedded in the IC system in close proximity to the high-power chip without being over heated by the high-power chip. Such close proximity between the low-power chip and the high-power chip advantageously shortens the path length of interconnects therebetween, which improves device performance and reduces interconnect parasitics in the IC system.
1. A system, comprising:
a first high-power chip disposed on a first side of a chip-packaging substrate;
a first thermally insulating layer and a second thermally insulating layer;
a first low-power chip embedded in the chip-packaging substrate between the first thermally insulating layer and the second thermally insulating layer and electrically connected to the first high-power chip, and
a heat-distribution layer that includes one or more layers of metallic foil and is embedded in the chip-packaging substrate between the first thermally insulating layer and the second thermally insulating layer and adjacent to the first low-power chip, wherein the heat-distribution layer extends from a first edge of the chip-packaging substrate to a second edge of the chip packaging substrate and does not substantially vary in depth,
wherein the high-power chip generates at least 10 W of heat and the low-power chip generates less than 5 W of heat.
2. The system of claim 1 , wherein the first low-power chip is electrically connected to the first high-power chip by a through-silicon via formed in the first low-power chip.
3. The system of claim 1 , wherein at least one of the first thermally insulating layer and the second thermally insulating layer comprises a thermally insulating material having a thermal conductivity of less than about 0.5 W/(° C.-m).
4. The system of claim 1 , wherein the first low-power chip comprises a memory chip.
5. The system of claim 1 , wherein the first low-power chip is disposed between the first high-power chip and a plurality of electrical leads that are configured to electrically connect the system to a printed circuit board.
6. The system of claim 1 , further comprising a second low-power chip that is embedded in the chip-packaging substrate.
7. The system of claim 1 , wherein the heat-distribution layer is positioned between the first high-power chip and the first low-power chip.
8. The system of claim 2 , wherein the heat-distribution layer includes a plurality of through-holes, and the through-silicon via passes through one of the plurality of through-holes.
9. The system of claim 1 , wherein the heat-distribution layer is disposed between the first low-power chip and the first thermally insulating layer.
10. The system of claim 9 , wherein the second thermally insulating layer is disposed between the first low-power chip and a second low-power chip.