Film forming method, semiconductor device, manufacturing method thereof and substrate processing apparatus therefor
In a method for forming a stacked substrate of a MOS (Metal Oxide Semiconductor) structure including an oxide film serving as a gate insulating film formed on a semiconductor material layer having a film or substrate shape; and a conductive film serving as a gate electrode formed on the oxide film, a polysilane film on the semiconductor material layer is formed by coating a polysilane solution on a surface of a substrate to which the semiconductor material layer is exposed. A film containing metal ions is formed on the polysilane film by coating a metal salt solution thereon, and the polysilane film and the film containing metal ions are respectively modified into a polysiloxane film and a film containing fine metal particles to form the stacked substrate.
1. A method for forming a stacked substrate of a MOS (Metal Oxide Semiconductor) structure including an oxide film serving as a gate insulating film formed on a semiconductor material layer having a film or substrate shape; and a conductive film serving as a gate electrode formed on the oxide film, the method comprising:
forming a polysilane film on the semiconductor material layer by coating a polysilane solution on a surface of a substrate to which the semiconductor material layer is exposed; and
forming a film containing metal ions on the polysilane film by coating a metal salt solution thereon and modifying respectively the polysilane film and the film containing metal ions into a polysiloxane film and a film containing fine metal particles to form the stacked substrate.
2. The method of claim 1 , further comprising:
forming a metal film on the film containing fine metal particles by a plating by using the film containing fine metal particles as a plating catalyst.
3. The method of claim 1 , further comprising:
heating the substrate.
4. A method for forming a stacked substrate of a MOS structure including a gate insulating film having a first and a second insulating film formed on a semiconductor material layer having a film or substrate shape; and a conductive film serving as a gate electrode formed on the gate insulating film, the method comprising:
forming the first insulating film on the semiconductor material layer;
forming a polysilane film on the first insulating film by coating a polysilane solution on a surface of a substrate to which the first insulating film is exposed; and
forming a film containing metal ions on the polysilane film by coating a metal salt solution thereon and modifying respectively the polysilane film and the film containing metal ions into a polysiloxane film serving as the second insulating film and a film containing fine metal particles to form the stacked substrate.
5. The method of claim 4 , further comprising:
forming a metal film on the film containing fine metal particles by a plating by using the film containing fine metal particles as a plating catalyst.
6. The method of claim 4 , further comprising:
heating the substrate.
7. A method for manufacturing a semiconductor device of a MOS structure including an oxide film serving as a gate insulating film formed on a semiconductor material layer having a film or substrate shape; and a conductive film serving as a gate electrode formed on the oxide film, the method comprising:
forming a first polysilane film on the semiconductor material layer by coating a polysilane solution on a surface of a substrate to which the semiconductor material layer is exposed;
forming a monomolecular film in a pattern on the first polysilane film;
forming a film containing metal ions on the first polysilane film and the monomolecular film by coating a metal salt solution thereon and modifying respectively the first polysilane film, which is in contact with the film containing metal ions, and the film containing metal ions into a first polysiloxane film and a film containing fine metal particles to form a stacked substrate of a MOS structure; and
removing an unmodified portion of the film containing metal ions, the monomolecular film and an unmodified portion of the first polysilane film by an etching.
8. The method of claim 7 , further comprising:
forming a metal film on the film containing fine metal particles by a plating by using the film containing fine metal particles as a plating catalyst.
9. The method of claim 8 , further comprising:
heating the substrate.
10. The method of claim 8 , further comprising:
forming a second polysilane film to cover the first polysilane film, the metal film and the film containing fine metal particles by coating the poly silane solution thereon;
modifying partially the second polysilane film into a second polysiloxane film by partially irradiating ultraviolet rays to the second polysilane film; and
forming openings on the second polysiloxane film by etching unmodified portions of the second polysilane film, the openings reaching the semiconductor material layer or the metal film.
11. The method of claim 10 , further comprising:
removing an oxide film formed at portions on a surface of the semiconductor material layer or the metal film, the portions being exposed through the openings.
12. The method of claim 10 , wherein the etching of the second polysilane film is performed by a wet etching.
13. The method of claim 7 , wherein the etching of the monomolecular film and the first polysilane film is performed by a wet etching.