IP Library Granted Patent US 8,565,280
Granted Patent B2
US 8,565,280 · App. 13/232,272 · Granted Oct 22, 2013

Semiconductor laser element, semiconductor laser device, and optical apparatus employing the same

Inventors: Shingo Kameyama (Ibaraki, JP); Hiroyuki Yukawa (Kishiwada, JP)
Assignee: Sanyo Electric Co., Ltd.
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Quick Facts
Patent No.
US 8,565,280
App. No.
13/232,272
Granted
Oct 22, 2013
Kind
B2
Abstract

This semiconductor laser element includes a semiconductor element layer including an active layer and having an emitting side cavity facet and a reflecting side cavity facet, and a facet coating film on a surface of the emitting side cavity facet. The facet coating film includes a photocatalytic layer arranged on an outermost surface of the facet coating film and a dielectric layer arranged between the photocatalytic layer and the emitting side cavity facet. A thickness of the dielectric layer is set to a thickness defined by m×λ/(2×n) (m is an integer), where a wavelength of a laser beam emitted from the active layer is λ and a refractive index of the dielectric layer is n, and at least 1 μm.

Claims (57)

1. A semiconductor laser element comprising:

a semiconductor element layer including an active layer and having an emitting side cavity facet and a reflecting side cavity facet; and

a facet coating film on a surface of said emitting side cavity facet, wherein

said facet coating film includes a photocatalytic layer arranged on an outermost surface of said facet coating film and a dielectric layer arranged between said photocatalytic layer and said emitting side cavity facet, and

a thickness of said dielectric layer is at least 1 μm,

said facet coating film further includes an oxidation preventing layer preventing oxidation of said emitting side cavity facet, and

said oxidation preventing layer has a nitride film coming into contact with said emitting side cavity facet.

2. The semiconductor laser element according to claim 1 , wherein

a thickness of said photocatalytic layer is smaller than said thickness of said dielectric layer.

3. The semiconductor laser element according to claim 2 , wherein

said photocatalytic layer is set to a thickness defined by m×λ/(2×n) (m is an integer).

4. The semiconductor laser element according to claim 2 , wherein

a refractive index of said photocatalytic layer is larger than a refractive index of said dielectric layer.

5. The semiconductor laser element according to claim 1 , wherein

said photocatalytic layer and said dielectric layer are in contact with each other.

6. The semiconductor laser element according to claim 1 , wherein

said photocatalytic layer is formed on said dielectric layer through a nitride film.

7. The semiconductor laser element according to claim 1 , wherein

said dielectric layer is made of a SiO 2 film.

8. The semiconductor laser element according to claim 1 , wherein

said dielectric layer has a multi-layer film structure made of a plurality of dielectric films.

9. The semiconductor laser element according to claim 8 , wherein

said dielectric layer has said multi-layer film structure obtained by stacking a first dielectric film of SiO 2 and a second dielectric film of AlON, and

a thickness of said first dielectric film is larger than a thickness of said second dielectric film.

10. The semiconductor laser element according to claim 9 , wherein

at least two said first dielectric films and at least two said second dielectric films are alternately stacked in said dielectric layer.

11. The semiconductor laser element according to claim 1 , wherein

said facet coating film further includes a reflectance control layer controlling a reflectance of said emitting side cavity facet.

12. The semiconductor laser element according to claim 11 , wherein

a high refractive index layer having a refractive index larger than a refractive index of said dielectric layer and a low refractive index layer having a refractive index smaller than said refractive index of said high refractive index layer are stacked in said reflectance control layer, and

said dielectric layer and said reflectance control layer are arranged through said high refractive index layer of said reflectance control layer.

13. The semiconductor laser element according to claim 1 , wherein

said oxidation preventing layer is a dielectric film made of a plurality of layers.

14. The semiconductor laser element according to claim 1 , wherein

said semiconductor element layer is made of a nitride-based semiconductor.

15. A semiconductor laser device comprising:

a semiconductor laser element including a semiconductor element layer including an active layer and having an emitting side cavity facet and a reflecting side cavity facet, and a facet coating film on a surface of said emitting side cavity facet; and

an open-to-atmosphere-type package mounting with said semiconductor laser element, wherein

said facet coating film includes a photocatalytic layer arranged on an outermost surface of said facet coating film and a dielectric layer arranged between said photocatalytic layer and said emitting side cavity facet, and

a thickness of said dielectric layer is at least 1 μm,

said facet coating film further includes an oxidation preventing layer preventing oxidation of said emitting side cavity facet, and

said oxidation preventing layer has a nitride film coming into contact with said emitting side cavity facet.

16. An optical apparatus comprising:

a semiconductor laser device including a semiconductor laser element having a semiconductor element layer including an active layer and having an emitting side cavity facet and a reflecting side cavity facet, and a facet coating film on a surface of said emitting side cavity facet, and an open-to-atmosphere-type package mounting with said semiconductor laser element; and

an optical system controlling a beam emitted from said semiconductor laser element, wherein

said facet coating film includes a photocatalytic layer arranged on an outermost surface of said facet coating film and a dielectric layer arranged between said photocatalytic layer and said emitting side cavity facet, and

a thickness of said dielectric layer is at least 1 μm,

said facet coating film further includes an oxidation preventing layer preventing oxidation of said emitting side cavity facet, and

said oxidation preventing layer has a nitride film coming into contact with said emitting side cavity facet.

17. The semiconductor laser element according to claim 11 , wherein

said reflectance control layer is made of a plurality of dielectric films, at least one film of said dielectric films has a thickness of λ/(4×n) or approximately λ/(4×n), where a wavelength of a laser beam emitted from said active layer is λ and a refractive index of said one film of said dielectric films is n.

18. The semiconductor laser element according to claim 1 , wherein

said dielectric layer has a dielectric film having a thickness of at least 1 μm.

19. The semiconductor laser element according to claim 1 , wherein

said photocatalytic layer is made of a TiO 2 film.

20. The semiconductor laser element according to claim 19 , wherein

a portion of said photocatalytic layer corresponding to said active layer has a crystalline substance of TiO 2 .

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 26, 2020
From: SANYO ELECTRIC CO., LTD.
To: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
Reel/Frame 052744/0685 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2011
From: KAMEYAMA, SHINGO; YUKAWA, HIROYUKI
To: SANYO ELECTRIC CO., LTD.
Reel/Frame 026907/0635 →
Priority Claims (2)
JP 2010-205447 · Sep 14, 2010 · national
JP 2010-214047 · Sep 24, 2010 · national
Continuity (1)
Related Publication 20120063483A1 · Mar 15, 2012