IP Library Granted Patent US 8,705,269
Granted Patent B2
US 8,705,269 · App. 13/232,782 · Granted Apr 22, 2014

Magnetoresistive element and magnetic memory

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Quick Facts
Patent No.
US 8,705,269
App. No.
13/232,782
Granted
Apr 22, 2014
Kind
B2
Abstract

A magnetoresistive element according to an embodiment includes: a first and second magnetic layers having an easy axis of magnetization in a direction perpendicular to a film plane; and a first nonmagnetic layer interposed between the first and second magnetic layers, at least one of the first and second magnetic layers including a structure formed by stacking a first and second magnetic films, the second magnetic film being located closer to the first nonmagnetic layer, the second magnetic film including a structure formed by repeating stacking of a magnetic material layer and a nonmagnetic material layer at least twice, the nonmagnetic material layers of the second magnetic film containing at least one element selected from the group consisting of Ta, W, Hf, Zr, Nb, Mo, Ti, V, and Cr, one of the first and second magnetic layers having a magnetization direction that is changed by applying a current.

Claims (55)

1. A magnetoresistive element comprising:

a first magnetic layer having an easy axis of magnetization in a direction perpendicular to a film plane;

a second magnetic layer having an easy axis of magnetization in a direction perpendicular to the film plane; and

a first nonmagnetic layer interposed between the first magnetic layer and the second magnetic layer,

at least one of the first magnetic layer and the second magnetic layer comprising a structure formed by stacking a first magnetic film and a second magnetic film, the second magnetic film located closer to the first nonmagnetic layer than the first magnetic film,

the second magnetic film comprising a stacked structure formed by alternating, at least twice, stacked layers of a magnetic material layer and a nonmagnetic material layer,

the nonmagnetic material layers of the second magnetic film comprising at least one element selected from the group consisting of Ta, W, Hf, Zr, Nb, Mo, Ti, V, and Cr, and

one of the first magnetic layer and the second magnetic layer having a magnetization direction that is capable of changing in response to applying a current between the first magnetic layer and the second magnetic layer via the first nonmagnetic layer,

wherein, among the magnetic material layers of the second magnetic film, the magnetic material layer farthest from the first nonmagnetic layer is a (Co 100-x Fe x ) 100-y B y (x<25 atomic %, 0≦y≦30 atomic %) layer.

2. The magnetoresistive element according to claim 1 , wherein, among the magnetic material layers of the second magnetic film, the magnetic material layer closest to the first nonmagnetic layer is a (Co 100-x Fe x ) 100-y B y (x≧25 atomic %, 0≦y≦30atomic %) layer.

3. The magnetoresistive element according to claim 1 , wherein each of the nonmagnetic material layers is 10 angstroms or less in film thickness.

4. The magnetoresistive element according to claim 1 , wherein the first magnetic film is one of a CoFePd film and a CoFePt film.

5. The magnetoresistive element according to claim 1 ,

wherein one of the first magnetic layer and the second magnetic layer is a fixed layer having a fixed magnetization, and

wherein the magnetoresistive element further comprises a third magnetic layer having a magnetization direction antiparallel to the magnetization direction of the fixed layer, the third magnetic layer formed on the opposite side of the fixed layer from the first nonmagnetic layer.

6. The magnetoresistive element according to claim 5 , wherein

a second nonmagnetic layer is interposed between the fixed layer and the third magnetic layer, and

the fixed layer and the third magnetic layer are antiferromagnetically coupled to each other.

7. A magnetoresistive element comprising:

a first magnetic layer having an easy axis of magnetization in a direction perpendicular to a film plane;

a second magnetic layer having, an easy axis of magnetization in a direction perpendicular to the film plane; and

a first nonmagnetic layer interposed between the first magnetic layer and the second magnetic layer,

at least one of the first magnetic layer and the second magnetic layer comprising a structure formed by stacking a first magnetic film and a second magnetic film, the second magnetic film located closer to the first nonmagnetic layer than the first magnetic layer,

the second magnetic film comprising a stacked structure formed by alternating, at least twice, stacked layers of a magnetic material layer and a nonmagnetic material layer,

the nonmagnetic material layer of the second magnetic film comprising at least one of element selected from the group consisting of Ta, w, Hf, Zr, Nb, Mo, Ti, V, and Cr, and

one of the first magnetic layer and the second magnetic layer having a magnetization direction that is capable of changing in response to applying a current between the first magnetic layer and the second magnetic layer via the first nonmagnetic layer,

wherein one of the first magnetic layer and the second magnetic layer is a fixed layer having a fixed magnetization,

wherein the magnetroresistive element further comprises a third magnetic layer Having a magnetization direction antiparallel to the magnetization direction of the fixed layer, the third magnetic layer formed on the opposite side of the fixed layer from the first nonmagnetic layer, and

wherein the following relationship is satisfied:

M S2 ×t 2 <M S22 ×t 22 ,

where t 2 and M S2 represent a film thickness and a saturation magnetization of the fixed layer, and t 22 and M 22 represent a film thickness and a saturation magnetization of the third magnetic layer.

8. The magnetoresistive element according to claim 1 , wherein the first nonmagnetic layer is an oxide layer having a NaCI structure.

9. A magnetic memory comprising:

a memory cell comprising a magnetoresistive element according to claim 1 ;

a first wire electrically connected to a first end of the magnetoresistive element; and

a second wire electrically connected to a second end of the magnetoresistive element.

10. The magnetic memory according to claim 9 , wherein the memory cell further comprises a select transistor provided between the first end of the magnetoresistive element and the first wire.

11. The magnetic memory according to claim 9 , wherein, among the magnetic material layers of the second magnetic film, the magnetic material layer closest to the first nonmagnetic layer is a (Co 100-x Fe x ) 100-y B y (x≧25 atomic %, 0≦y≦30atomic %) layer.

12. The magnetic memory according to claim 9 , wherein each of the nonmagnetic material layers is 10 angstroms or less in film thickness.

13. The magnetic memory according to claim 9 , wherein the first magnetic film is one of a CoFePd film and a CoFePt film.

14. The magnetic memory according to claim 9 , wherein

one of the first magnetic layer and the second magnetic layer is a fixed layer having a fixed magnetization, and

wherein the magnetoresistive element further comprises a third magnetic layer having a magnetization direction antiparallel to the magnetization direction of the fixed layer, the third magnetization layer formed on the opposite side of the fixed layer from the first nonmagnetic layer.

15. The magnetic memory according to claim 14 , wherein

a second nonmagnetic layer is interposed between the fixed layer and the third magnetic layer, and

the fixed layer and the third magnetic layer are antiferromagnetically coupled to each other.

16. The magnetic memory according to claim 9 ,

wherein one of the first magnetic layer and the second magnetic layer is a fixed layer having a fixed magnetization,

wherein the magnetoresistive element further comprises a third magnetic layer having a magnetization direction antiparallel to the magnetization direction of the fixed layer, the third magnetization layer formed on the opposite side of the fixed layer from the first nonmagnetic layer, and

wherein the following relationship is satisfied:

M S2 ×t 2 <M S22 ×t 22 ,

where t 2 and M S2 represent a film thickness and a saturation magnetization of the fixed layer, and t 22 and M S22 represent a film thickness and a saturation magnetization of the third magnetic layer.

17. The magnetic memory according to claim 9 , wherein the first nonmagnetic layer is an oxide layer having a NaCI structure.

18. The magnetoresistive element according to claim 1 , wherein

among the magnetic material layers of the second magnetic film, the magnetic material layer contacting the first nonmagnetic material layer includes a Co/Fe with a composition ratio differing from that of the magnetic material layer contacting the first magnetic film.

Assignments (4)
DE-MERGER Recorded Dec 12, 2019
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 051260/0291 →
MERGER Recorded Dec 12, 2019
From: TOSHIBA MEMORY CORPORATION; K.K PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 051262/0776 →
CHANGE OF NAME AND ADDRESS Recorded Dec 12, 2019
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 051262/0881 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 28, 2011
From: NAGASE, TOSHIHIKO; KAI, TADASHI; NAGAMINE, MAKOTO; NISHIYAMA, KATSUYA; KITAGAWA, EIJI; DAIBOU, TADAOMI; UEDA, KOJI; YODA, HIROAKI; YAKUSHIJI, KAY; YUASA, SHINJI; KUBOTA, HITOSHI; NAGAHAMA, TARO; FUKUSHIMA, AKIO; ANDO, KOJI
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 027282/0406 →