Integrated apparatus including driver chips, a power supply and LED chips on an isolative substrate
Disclosed is an integrated apparatus including an isolative substrate, a plurality of driver chips provided on a side of the isolative substrate, a power supply provided on the side of the isolative substrate and electrically connected to the driver chips, and LED chips provided on another side of the isolative substrate and electrically connected to the driver chips. Thus, the driver chips, the power supply and the LED chips are integrated on the isolative substrate. The production is easy. The integrated apparatus is not vulnerable to surges and lightning strikes. Electromagnetic interferences are reduced. Heat radiation of the integrated apparatus is excellent so that the LED chips are protected from thermal effect.
1. An integrated apparatus including:
an electrically insulative and thermally conductive substrate formed with a first side and an opposite second side and comprising a circuit layout layer provided on the first side of the electrically insulative and thermally conductive substrate, the circuit layout layer comprising through-silicon-vias;
a plurality of driver chips provided on the first side of the electrically insulative and thermally conductive substrate;
a power supply provided on the first side of the electrically insulative and thermally conductive substrate and electrically connected to the driver chips;
a heat radiation unit provided on the first side of the electrically insulative and thermally conductive substrate so as to overlie the circuit layout layer and such that the circuit layout layer is interposed between the heat radiation unit and the electrically insulative and thermally conductive substrate; and
a plurality of LED chips provided on the opposite second side of the electrically insulative and thermally conductive substrate opposite the heat radiation unit and electrically connected to the driver chips via the circuit layout layer.
2. The integrated apparatus in accordance with claim 1 , wherein the electrically insulative and thermally conductive substrate is an aluminum nitride substrate.
3. The integrated apparatus in accordance with claim 1 , wherein the heat radiation unit is made of a material selected from the group consisting of copper and aluminum.