Substrate processing apparatus and method of manufacturing a semiconductor device
A substrate processing apparatus includes a processing chamber configured to process a substrate, a substrate support member provided within the processing chamber to support the substrate, a microwave generator provided outside the processing chamber, a waveguide launch port configured to supply a microwave generated by the microwave generator into the processing chamber, wherein the central position of the waveguide launch port is deviated from the central position of the substrate supported on the substrate support member and the waveguide launch port faces a portion of a front surface of the substrate supported on the substrate support member, and a control unit configured to change a relative position of the substrate support member in a horizontal direction with respect to the waveguide launch port.
1. A substrate processing apparatus comprising:
a processing chamber configured to process a substrate;
a substrate support member provided within the processing chamber to support the substrate;
a microwave generator provided outside the processing chamber;
a waveguide launch port configured to supply a microwave generated by the microwave generator into the processing chamber, wherein a central position of the waveguide launch port is deviated from a central position of the substrate supported on the substrate support member, and the waveguide launch port faces a portion of a front surface of the substrate supported on the substrate support member; and
a control unit configured to change a relative position of the substrate support member in a horizontal direction with respect to the waveguide launch port.
2. The substrate processing apparatus of claim 1 , wherein the substrate support member is horizontally rotated around a rotation axis of the substrate support member and the waveguide launch port is fixed at a position deviated from the rotation axis of the substrate support member.
3. The substrate processing apparatus of claim 1 , wherein a distance between the waveguide launch port and the substrate supported on the substrate support member is shorter than a wavelength of the supplied microwave.
4. The substrate processing apparatus of claim 1 , wherein a distance between the waveguide launch port and the substrate supported on the substrate support member corresponds to an odd multiple of ¼ wavelength of the microwave supplied from the waveguide launch port.
5. The substrate processing apparatus of claim 1 , wherein the substrate support member comprises substrate support pins, on which the substrate is supported, and a conductive pedestal provided below the substrate support pins, and
wherein a distance between the top of the substrate support pins and the conductive pedestal corresponds to an odd multiple of ¼ wavelength of the microwave supplied when the substrate is processed.
6. The substrate processing apparatus of claim 5 , wherein the conductive pedestal is a metal pedestal including a coolant passage.
7. The substrate processing apparatus of claim 1 , wherein the control unit controls the microwave generator to supply the microwave into the processing chamber after starting the change of relative position of the substrate support member in a horizontal direction with respect to the waveguide launch port.
8. A substrate processing apparatus comprising:
a processing chamber configured to process a substrate;
a substrate support member provided within the processing chamber to support the substrate;
a microwave generator provided outside the processing chamber;
a waveguide launch port configured to supply a microwave generated by the microwave generator into the processing chamber, wherein a central position of the waveguide launch port is deviated from a central position of the substrate supported on the substrate support member and the waveguide launch port faces a portion of a front surface of the supported substrate; and
a control unit configured to change a relative position of the waveguide launch port in a horizontal direction with respect to the supported substrate such that the waveguide launch port intermittently faces the portion of the front surface of the supported substrate.
9. A method of manufacturing a semiconductor device using a substrate processing apparatus including a processing chamber configured to process a substrate, a substrate support member provided within the processing chamber to support the substrate, a microwave generator provided outside the processing chamber, a waveguide launch port configured to supply a microwave generated by the microwave generator into the processing chamber, wherein a central position of the waveguide launch port is deviated from a central position of the substrate supported on the substrate support member and the waveguide launch port faces a portion of a front surface of the substrate supported on the substrate support member, and a control unit configured to relatively rotate the substrate support member in a horizontal direction with respect to the waveguide launch port, the method comprising:
loading the substrate into the processing chamber;
supporting the substrate on the substrate support member provided in the processing chamber;
relatively rotating the substrate support member supported on the substrate support member in the horizontal direction with respect to the waveguide launch port;
irradiating the front surface of the substrate with the microwave after starting rotating the substrate; and
unloading the substrate out of the processing chamber.