IP Library Granted Patent US 8,610,048
Granted Patent B2
US 8,610,048 · App. 13/241,111 · Granted Dec 17, 2013

Photosensitive integrated circuit equipped with a reflective layer and corresponding method of production

Inventors: Jerome Alieu (L'isle d'Abeau, FR); Simon Guillaumet (Vaulnaveys-le-Haut, FR); Christophe Legendre (Allevard, FR); Hughes Leininger (Crolles, FR); Jean-Pierre Oddou (Grenoble, FR); Marc Vincent (Arvillard, FR)
Assignee: STMicroelectronics S.A.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,610,048
App. No.
13/241,111
Granted
Dec 17, 2013
Kind
B2
Abstract

A method for producing a photosensitive integrated circuit including producing circuit control transistors, producing, above the control transistors, and between at least one upper electrode and at least one lower electrode, at least one photodiode, by amorphous silicon layers into which photons from incident electromagnetic radiation are absorbed, producing at least one passivation layer, between the lower electrode and the control transistors, and producing, between the control transistors and the external surface of the integrated circuit, a reflective layer capable of reflecting photons not absorbed by the amorphous silicon layers.

Claims (32)

1. A method, comprising:

receiving electromagnetic energy that is incident on a non-metallic first surface of a photodiode of a photosensitive integrated circuit and propagating toward a second non-metallic surface of the photodiode, the second surface opposite to the first surface; and

redirecting the electromagnetic energy back toward the first surface;

wherein the photosensitive integrated circuit comprises:

a reflective layer on the photodiode;

a conductive element penetrates from the reflective layer to the photodiode.

2. The method of claim 1 wherein the electromagnetic energy comprises electromagnetic energy having a wavelength within a portion of the visible light spectrum.

3. The method of claim 1 wherein the electromagnetic energy comprises light.

4. The method of claim 1 wherein redirecting comprises redirecting the electromagnetic energy substantially at the second surface of the photodiode.

5. The method of claim 1 wherein redirecting comprises redirecting the electromagnetic energy at a location that is beyond the second surface of the photodiode such that the second surface is between the location and the first surface of the photodiode.

6. The method of claim 1 wherein redirecting comprises redirecting the electromagnetic energy at a location that is between the first and second surfaces of the photodiode.

7. The method of claim 1 , further comprising absorbing photons from the electromagnetic energy in an amorphous silicon layer disposed between the first non-metallic surface and the reflective layer.

8. The method of claim 1 , further comprising absorbing photons from the electromagnetic energy in an amorphous silicon layer disposed between the first non-metallic surface and the second non-metallic surface.

9. The method of claim 1 , further comprising generating an electric current that is proportional to the incident electromagnetic energy.

10. The method of claim 9 , wherein the electric current is generated on the conductive element.

11. A method, comprising:

receiving electromagnetic energy that is incident on a first surface of a photodiode of a photosensitive integrated circuit and propagating toward a second surface of the photodiode, the second surface opposite to the first surface;

redirecting, at a reflective surface, at least a portion of the electromagnetic energy back toward the first surface; and

generating an electric current proportional to the electromagnetic energy on a conductor element;

wherein the photosensitive integrated circuit comprises:

a reflective layer on the photodiode;

the conductive element penetrates from the reflective layer to the photodiode.

12. A method, comprising:

absorbing a portion of photons from incident light at a photodiode of a photosensitive integrated circuit such that at least some photons in the incident light remain unabsorbed and pass through the photodiode;

redirecting, at a reflective surface that bounds the photodiode, at least a portion of the unabsorbed photons from the incident light toward the photodiode; and absorbing a portion of the unabsorbed photons at the photodiode after the redirecting;

wherein the photosensitive integrated circuit comprises:

a reflective layer on the photodiode;

the conductive element penetrates from the reflective layer to the photodiode.

13. The method of claim 12 , further comprising generating a current signal on a conductor that is proportional to the absorbed photons.

14. The method of claim 13 , wherein the redirecting further comprises redirecting at a non-metallic surface.

15. The method of claim 14 , wherein the generating further comprises generating the current signal of the conductive element.

16. The method of claim 12 , further comprising focusing the incident light on the photodiode.

Assignments (1)
CHANGE OF NAME Recorded Jan 20, 2024
From: STMICROELECTRONICS SA
To: STMICROELECTRONICS FRANCE
Reel/Frame 066357/0128 →
Priority Claims (1)
FR 05 11755 · Nov 21, 2005 · national
Continuity (2)
Division 11603961 · Nov 21, 2006
Related Publication 20120006980A1 · Jan 12, 2012