Fabrication of substrates with a useful layer of monocrystalline semiconductor material

1. A method of making a semiconductor substrate which comprises:

providing an support that includes a barrier layer thereon for preventing loss by diffusion of elements derived from dissociation of the support at epitaxial growth temperatures;

providing a seed layer on the barrier layer, wherein the seed layer facilitates epitaxial growth of a single crystal III-nitride semiconductor layer thereon;

epitaxially growing a nitride working layer on the thin seed layer; and

removing the support to form the substrate.

2. The method of claim 1 , wherein the support is made of a sintered or polycrystalline material.

3. The method of claim 2 , wherein the support comprises a polycrystalline silicon carbide, monocrystalline silicon carbide, polycrystalline aluminum nitride, polycrystalline gallium nitride, or monocrystalline gallium nitride having a concentration of dislocation that is greater than 10 7 /cm 2 .

4. The method of claim 1 , wherein the barrier layer comprises silicon nitride.

5. The method of claim 1 , wherein the seed layer comprises sapphire, silicon carbide, zinc oxide, silicon, gallium nitride, neodymium gallate, or lithium gallate.

6. The method of claim 1 , wherein the seed layer comprises a material with a crystal lattice parameter selected so that the nitride working layer has a dislocation concentration less than about 10 7 /cm 2 .

7. The method of claim 1 , wherein the nitride working layer comprises one or more layers of GaN, AlN, AlGaN, GaAlN, InGaN, or GaInN.

8. The method of claim 7 , wherein the working layer is a stack of deposits of GaN with different types of doping.

9. The method of claim 8 , wherein the stack of GaN is self supporting.

10. The method of claim 1 , wherein the working layer is InGaN; the seed layer is GaN and the support substrate is sapphire.

11. The method of claim 1 , wherein the support and the working layer each have substantially the same thermal expansion coefficient.

12. The method of claim 1 , wherein the seed and nitride working layers are detached from the support by the application of stress at the intermediate layer.

13. The method of claim 1 , wherein the seed layer is provided on the support by implanting ions into a source substrate to form a zone of weakness at a depth that corresponds to the desired thickness of the seed layer, bonding the source substrate to the support, and detaching the seed layer at the zone of weakness by the application of a force to transfer the seed layer to the support substrate.

14. The method of claim 1 , which further comprises recycling the removed support for subsequent reuse.

15. The method of claim 1 which further comprises preparing the seed layer to receive the nitride working layer, wherein the preparation includes at least one of polishing, annealing, smoothing, oxidation, and etching.