Transponder inlay with antenna breaking layer for a document for personal identification, and a method for producing a transponder inlay
In various embodiments, a transponder inlay for a document for personal identification may include a cover; an adhesive layer arranged on the cover; a chip arranged on the adhesive layer; an antenna connected to the chip; and a top layer on the adhesive layer, wherein the top layer has a top and a bottom and wherein the bottom of the top layer is connected to the cover by means of the adhesive layer and wherein the antenna is arranged on the top of the top layer such that the antenna is at least to some extent physically separated from the adhesive layer by the top layer.
1. A transponder inlay for a document for personal
identification, the transponder inlay comprising:
a cover;
an adhesive layer arranged on the cover;
a chip arranged on the adhesive layer;
an antenna connected to the chip such that antenna connections are on the
adhesive layer; and
a first top layer on the adhesive layer,
wherein the first top layer has a top and a bottom arid wherein the bottom of the first top layer is connected to the cover by means of the adhesive layer and
wherein the antenna is arranged on the top of the first top layer such that the antenna is at least to some extent physically separated from the adhesive layer by the first top layer.
2. The transponder inlay as claimed in claim 1 ,
wherein a second top layer is arranged such that the antenna is at least to some extent arranged between the first top layer and the second top layer.
3. The transponder inlay as claimed in claim 2 ,
wherein the first top layer and the second top layer are connected to one another.
4. The transponder inlay as claimed in claim 2 ,
wherein the top of the second top layer is produced flush with the top of the chip.
5. The transponder inlay as claimed in claim 1 ,
wherein the adhesive layer is an adhesive film which has hotmelt.
6. The transponder inlay as claimed in claim 1 ,
wherein the adhesive layer has epoxy resin.
7. The transponder inlay as claimed in claim 1 ,
wherein the antenna has a coil having at least one turn.
8. The transponder inlay as claimed in claim 1 ,
wherein the at least one turn of the coil is arranged on the first top layer and the first top layer has cutouts which are suitable for holding the coil.
9. The transponder inlay as claimed in claim 1 ,
wherein the first top layer has a cutout for holding the chip.
10. The transponder inlay as claimed in claim 1 ,
wherein the first top layer is produced from foamed plastic.
11. The transponder inlay as claimed in claim 1 , comprising a second top layer on the first top layer, and
wherein the antenna is arranged on a top of the second top layer such that the antenna is at least to some extent physically separated from the adhesive layer by the first top layer and the second top layer.
12. A document for personal identification, comprising:
a transponder inlay, comprising:
a cover;
an adhesive layer arranged on the cover;
a chip arranged on the adhesive layer;
an antenna connected to the chip such that antenna connections are on
the adhesive layer; and
a first top layer on the adhesive layer, wherein the first top layer has a top and a bottom and wherein the bottom of the top layer is connected to the cover by means of the adhesive layer and wherein the antenna is arranged on the top of the first top layer such that the antenna is at least to some extent physically separated from the adhesive layer by the first top layer.
13. The document for personal identification as claimed in claim 12 ,
wherein the transponder inlay comprises
a second top layer on the first top layer, and
wherein the antenna is arranged on a top of the second top layer such that the antenna is at least to some extent physically separated from the adhesive layer by the first top layer and the second top layer.
14. A method for producing a transponder inlay, the method comprising:
providing a first elemental layer of a first top layer;
putting an antenna on the first element layer;
putting a second elemental layer of the first top layer on the first elemental layer such that the antenna is arranged between the first elemental layer and the second elemental layer;
connecting the antenna to a chip;
adhesively bonding the first top layer having the antenna arranged between the first elemental layer and the second elemental layer to a cover; and
adhesively bonding the chip to the cover such that antenna connections are on the adhesive layer.
15. The method as claimed in claim 14 ,
wherein a recess for holding the chip is produced in the first top layer by means of punching.
16. The method as claimed in claim 14 ,
wherein a recess is produced in the first top layer for the purpose of holding the chip by means of milling.
17. The method as claimed in claim 14 ,
wherein the first elemental layer of the first top layer and the second elemental layer of the first top layer are connected adhesively.
18. The method as claimed in claim 14 , comprising providing a second top layer on the first top layer, and
wherein the antenna is arranged on a top of the second top layer such that the antenna is at least to some extent physically separated from the adhesive layer by the first top layer and the second top layer.