Semiconductor device and method of manufacturing the same

1. A wireless communications device, comprising:

a flash memory comprising:

a plurality of stacked semiconductor chips, at least one of the semiconductor chips comprising:

a semiconductor substrate;

a first insulating layer on a top face and side faces of the semiconductor substrate with concavities on side faces thereof, wherein said concavities have planar side surfaces that extend vertically from a first edge at the top face of the semiconductor substrate to a second edge at the bottom face of the semiconductor substrate, wherein the first edge is beveled;

first metal layers that are provided in center portions of the concavities in a direction that is orthogonal to a direction of the top face and above the top face in a direction that is parallel to the direction of the top face; and

second metal layers that are provided in the concavities above and contacting the first metal layers and filling the concavities;

a processor;

a communications component;

a transmitter;

a receiver; and

an antenna connected to the transmitter circuit and the receiver circuit.

2. The wireless communications device of claim 1 , wherein said flash memory is NAND flash memory.

3. The wireless communications device of claim 1 , wherein said flash memory is NOR flash memory.

4. The wireless communications device of claim 1 , wherein said flash memory comprises at least one memory cell operable to store more than one bit.

5. A computing device comprising:

a processor;

an input component;

an output component;

a memory comprising:

a volatile memory; and

a flash memory comprising:

a plurality of stacked semiconductor chips, at least one of the semiconductor chips comprising:

a semiconductor substrate;

a first insulating layer on a top face and side faces of the semiconductor substrate with concavities formed on side faces thereof wherein said concavities have planar side surfaces that extend vertically from a first edge at the top face of the semiconductor substrate to a second edge at the bottom face of the semiconductor substrate, wherein the first edge is beveled;

first metal layers in center portions of the concavities in a direction that is orthogonal to a direction of the top face and above the top face in a direction that is parallel to the direction of the top face; and

second metal layers that are provided in the concavities above and contacting the first metal layers and filling the concavities.

6. The computing device of claim 5 , wherein said computing device is a personal computer (PC).

7. The computing device of claim 5 , wherein said computing device is a personal digital assistant (PDA).

8. The computing device of claim 5 , wherein said computing device is a gaming system.

9. A portable media player comprising:

a processor;

a cache;

a user input component;

a coder-decoder component; and

a memory comprising:

a flash memory comprising:

a plurality of stacked semiconductor chips, at least one of the semiconductor chips comprising:

a semiconductor substrate;

a first insulating layer on a top face and side faces of the semiconductor substrate with concavities on side faces thereof wherein said concavities have planar side surfaces that extend vertically from a first edge at the top face of the semiconductor substrate to a second edge at the bottom face of the semiconductor substrate, wherein the first edge is beveled;

first metal layers that are provided in center portions of the concavities in a direction that is orthogonal to a direction of the top face and above the top face in a direction that is parallel to the direction of the top face; and

second metal layers that are provided in the concavities above and contacting the first metal layers and filling the concavities.

10. The portable media player of claim 9 , wherein said portable media player is a portable music player.

11. The portable media player of claim 9 , wherein said portable media player is a portable video player.