Mounting system for applying an RFID chip module to a substrate, in particular a label
A mounting system for applying an RFID chip module having at least one electrical connection to a substrate having at least one conductor, in particular a label. The system includes a stamping device for stamping out the RFID chip module from a carrier strip having a plurality of chip modules. The stamping device comprises a stamping die having a stamping opening, by which an RFID chip module to be stamped out is received with accurate positioning, and a stamping punch is disposed above the stamping opening A support for receiving a substrate with accurate positioning is disposed below the stamping opening and the stamping punch can be moved up against the substrate. A suction device is provided for holding the RFID chip module on the stamping punch. A heating device for melting solder is present on the RFID chip module in order to establish a conductive connection between an electrical connection of the RFID chip module and a conductor of the substrate.
1. A mounting device for attaching an RFID chip module with at least one electrical connection to a substrate with at least one conductor, particularly onto a label, said mounting device comprising:
a punching device for punching out the RFID chip module from a carrier tape with a plurality of chip modules, wherein the punching device comprises a punching matrix with a punching aperture for positionally accurately receiving an RFID chip module to be punched out and a punching die arranged above the punching aperture,
wherein under the punching opening there is disposed a support for positionally accurately receiving a substrate and wherein the punching die is displaceable towards and against the substrate;
a suction device for holding the RFID chip module to the punching die and;
a heating device for melting any soldering means present on the RFID chip module for producing a conductive connection between each of an electrical connection of the RFID chip module and a respective conductor of the substrate.
2. The mounting device according to claim 1 , wherein the suction device comprises suction means for forming an underpressure at least at one point of the punching side of the punching die.
3. The mounting device according to claim 2 , wherein the heating device comprises thermodes configured to be fed towards the soldering area and retracted therefrom through guide channels formed in the punching die.
4. The mounting device according to claim 2 , wherein the heating device comprises a laser device which comprises, respectively, a laser beam source directed onto the location of the RFID chip module to be soldered.
5. The mounting device according to claim 2 , wherein the suction means comprise a punching aperture arranged at the punching side of the punching die for applying the underpressure.
6. The mounting device according to claim 5 , wherein the heating device comprises thermodes configured to be fed towards the soldering area and retracted therefrom through guide channels formed in the punching die.
7. The mounting device according to claim 5 , wherein the heating device comprises a laser device which comprises, respectively, a laser beam source directed onto the location of the RFID chip module to be soldered.
8. The mounting device according to claim 5 , wherein the punching aperture is connected with an underpressure supply by means of a suction channel extending through the punching die.
9. The mounting device according to claim 8 , wherein the heating device comprises thermodes configured to be fed towards the soldering area and retracted therefrom through guide channels formed in the punching die.
10. The mounting device according to claim 8 , wherein the heating device comprises a laser device which comprises, respectively, a laser beam source directed onto the location of the RFID chip module to be soldered.
11. The mounting device according to claim 1 , wherein the heating device comprises thermodes configured to be fed towards the soldering area and retracted therefrom through guide channels formed in the punching die.
12. The mounting device according to claim 11 , wherein the thermodes are supplied with heat by means of a laser beam source or a heating cartridge.
13. The mounting device according to claim 1 , wherein the heating device comprises a laser device which comprises, respectively, a laser beam source directed onto the location of the RFID chip module to be soldered.