Spacer for semiconductor structure contact

1. A method for forming a semiconductor structure, the method comprising:

forming an epitaxial region in a substrate, the epitaxial region having a facet between a top surface of the substrate and a top surface of the epitaxial region, the substrate having a gate structure on the top surface of the substrate, the gate structure comprising a gate electrode and a gate spacer along a sidewall of the gate electrode;

depositing a spacer material laterally between the facet and the gate structure, the spacer material adjoining an exterior sidewall of the gate spacer and adjoining the facet; and

depositing an etch stop layer over the spacer material and the epitaxial region, the etch stop layer adjoining each of the spacer material and the epitaxial region, a ratio of an etch selectivity of the spacer material to an etch selectivity of the etch stop layer being equal to or less than 3:1.

2. The method of claim 1 further comprising:

depositing an inter-layer dielectric layer on the etch stop layer;

forming an opening through the inter-layer dielectric layer to the epitaxial region; and

depositing a conductive material in the opening.

3. The method of claim 1 , wherein a hardmask is over the gate electrode, the spacer material being deposited along the exterior sidewall of the gate spacer, the hardmask being removed while the spacer material is along the exterior sidewall of the gate spacer.

4. The method of claim 1 further comprising removing a portion of the spacer material, a top surface of the spacer material being substantially coplanar with the top surface of the epitaxial region.

5. The method of claim 1 , wherein the spacer material and the etch stop layer are each silicon nitride.

6. The method of claim 1 , wherein the etch stop layer is further formed along a sidewall of the gate structure and over the gate structure.

7. A method for forming a semiconductor structure, the method comprising:

providing a substrate, a gate being over the substrate, a hardmask being over the gate, a gate spacer being along a sidewall of the gate;

forming a spacer material conformally along an exterior sidewall of the gate spacer and over a source/drain region in the substrate laterally disposed from the gate;

removing the hardmask while the spacer material is along the exterior sidewall of the gate spacer; and

after removing the hardmask, removing a first portion of the spacer material to expose the source/drain region, a second portion of the spacer material remaining laterally disposed between the gate spacer and the source/drain region.

8. The method of claim 7 further comprising depositing an etch stop layer over the source/drain region, the second portion of the spacer material, and the gate.

9. The method of claim 8 further comprising:

depositing an inter-layer dielectric layer over the etch stop layer;

etching an opening through the inter-layer dielectric layer to the source/drain region; and

depositing a conductive material in the opening.

10. The method of claim 7 further comprising epitaxially growing an epitaxial region in the source/drain region, the epitaxial region having a top surface displaced higher than a top surface of the substrate, a facet of the epitaxial region being between the top surface of the substrate and the top surface of the epitaxial region.

11. The method of claim 10 , wherein the second portion of the spacer material adjoins the facet and adjoins a sidewall of the gate spacer.

12. The method of claim 11 further comprising forming an etch stop layer over and adjoining the second portion of the spacer material and the top surface of the epitaxial region, the spacer material and the etch stop layer being a same material.

13. The method of claim 12 , wherein the spacer material and the etch stop layer are each silicon nitride.

14. A method comprising:

forming a gate structure on a substrate;

after forming the gate structure, forming an epitaxial region in the substrate proximate to the gate structure, the epitaxial region having a facet between a top surface of the substrate and a top surface of the epitaxial region;

after forming the epitaxial region, depositing a spacer material laterally between the facet and the gate structure; and

depositing an etch stop layer over the spacer material and the epitaxial region, the etch stop layer adjoining each of the spacer material and the epitaxial region, a ratio of an etch selectivity of the spacer material to an etch selectivity of the etch stop layer being equal to or less than 3:1.

15. The method of claim 14 further comprising:

depositing an inter-layer dielectric layer on the etch stop layer;

forming an opening through the inter-layer dielectric layer to the epitaxial region; and

depositing a conductive material in the opening.

16. The method of claim 14 , wherein the gate structure comprises a gate electrode and a gate spacer along a sidewall of the gate electrode, a hardmask being over the gate electrode, the spacer material being deposited along an exterior sidewall of the gate spacer, the hardmask being removed while the spacer material is along the exterior sidewall of the gate spacer.

17. The method of claim 14 further comprising removing a portion of the spacer material, a top surface of the spacer material being substantially coplanar with the top surface of the epitaxial region.

18. The method of claim 14 , wherein the etch stop layer is further formed along a sidewall of the gate structure and over the gate structure.

19. The method of claim 14 , wherein the gate structure comprises a gate electrode and a gate spacer along a sidewall of the gate electrode, the spacer material adjoining an exterior sidewall of the gate spacer and adjoining the facet.

20. The method of claim 14 , wherein the spacer material and the etch stop layer are each silicon nitride.