Nanomesh phononic structures for low thermal conductivity and thermoelectric energy conversion materials
A nanomesh phononic structure includes: a sheet including a first material, the sheet having a plurality of phononic-sized features spaced apart at a phononic pitch, the phononic pitch being smaller than or equal to twice a maximum phonon mean free path of the first material and the phononic size being smaller than or equal to the maximum phonon mean free path of the first material.
1. A nanomesh phononic structure comprising:
a mesh comprising a first material, the mesh having a plurality of phononic-sized features spaced apart at a phononic pitch, the phononic pitch being smaller than or equal to twice a maximum phonon mean free path of the first material and the phononic size being smaller than or equal to the maximum phonon mean free path of the first material,
wherein the phononic size is in the range from 5 nm to 100 nm,
wherein the phononic-sized features are discontinuous holes or voids,
wherein the phononic-sized features are filled with a second material different from the first material,
wherein the first material comprises silicon, and
wherein a thermal conductivity of the nanomesh phononic structure is greater than 1 W m −1 K −1 and less than or equal to 2 W m −1 K −1 .
2. The nanomesh phononic structure of claim 1 , wherein the phononic pitch is smaller than twice a dominant phonon mean free path of the first material.
3. The nanomesh phononic structure of claim 1 , wherein the second material comprises a material having lower thermal conductivity than the first material or an acoustic mismatch with the first material.
4. The nanomesh phononic structure of claim 1 , wherein each of the phononic sized features are approximately 15 nanometers across.
5. The nanomesh phononic structure of claim 1 , wherein the phononic pitch is in the range of 10 to 200 nanometers.
6. The nanomesh phononic structure of claim 5 , wherein the phononic sized features are spaced at a pitch of approximately 30 nanometers.
7. The nanomesh phononic structure of claim 1 , wherein the phononic-sized features are round or rectangular.
8. A thermoelectric device comprising:
a sheet comprising a semiconductor material comprising silicon, the sheet having a plurality of discontinuous phononic-sized features spaced apart at a phononic pitch, the phononic pitch being smaller than or equal to twice a maximum phonon mean free path of the semiconductor material and the phonic size being smaller than or equal to the maximum phonon mean free path of the semiconductor material, the sheet comprising an n-doped region and a p-doped region;
a first electrode electrically coupled to a first side of the sheet; and
a second electrode electrically coupled to a second side of the sheet,
wherein the phononic size is in the range from 5 nm to 100 nm,
wherein the phononic-sized features are filled with a material different from the semiconductor material, and
wherein a thermal conductivity of the sheet is greater than 1 W m −1 K −1 and less than or equal to 2 W m −1 K −1 .
9. The nanomesh phononic structure of claim 1 , wherein the second material comprises a material having an acoustic mismatch with the first material.