Method of manufacturing light emitting device

1. A method of manufacturing a light emitting device, comprising:

placing a light emitting element in a recess of a package;

providing powders comprising a fluorescent material and coated with inorganic particles;

mixing the fluorescent powders, fillers, a resin and a diffusing agent having the same specific gravity as the resin;

sealing the light emitting element placed in the recess of the package with the resin having the fluorescent powders and the fillers mixed therein; and

applying a centrifugal force to the sealed package so that the fluorescent powders and the fillers are pushed toward a bottom of the recess.

2. The method of claim 1 , wherein the light emitting element comprises GaN.

3. The method of claim 1 , wherein the fluorescent material comprises YAG-based fluorescent material.

4. The method of claim 1 , wherein the inorganic particles comprise a metal oxide or a metal nitride.

5. The method of claim 4 , wherein the metal of the metal oxide or metal nitride of which the inorganic particles are comprised is at least one metal selected from the group consisting of Al, Si, In, Ga and a rare earth element.

6. The method of claim 1 , wherein the fluorescent powders comprise the fluorescent material coated with a coating of a compound including phosphorus and a further coating of the inorganic particles on the coating of the compound including phosphorus.

7. The method of claim 1 , wherein the resin is a silicone-based resin or an epoxy-based resin.

8. The method of claim 1 , wherein the fillers comprise at least one material selected from the group consisting of silicon dioxide, alumina, titanium oxide and barium sulfate.

9. A method of manufacturing a light emitting device, comprising:

placing a light emitting element in a recess of a package;

providing powders comprising a fluorescent material and coated with inorganic particles;

providing fillers having a specific gravity smaller than the fluorescent material and a resin having a specific gravity smaller than the fillers;

mixing the fluorescent powders, the fillers and the resin;

sealing the light emitting element placed in the recess of the package with the resin having the fluorescent powders and the fillers mixed therein; and

applying a centrifugal force to the sealed package so as to form a layered-stack on a bottom of the recess and a top of the light emitting element, the layered-stack comprising a lower layer primarily made of the fluorescent powders and in contact with the bottom and the top and an upper layer primarily made of the fillers and disposed on the lower layer.

10. The method of claim 9 , wherein the light emitting element comprises GaN.

11. The method of claim 9 , wherein the fluorescent material comprises YAG-based fluorescent material.

12. The method of claim 9 , wherein the inorganic particles comprise a metal oxide or a metal nitride.

13. The method of claim 12 , wherein the metal of the metal oxide or metal nitride of which the inorganic particles are comprised is at least one metal selected from the group consisting of Al, Si, In, Ga and a rare earth element.

14. The method of claim 9 , wherein the fluorescent powders comprise the fluorescent material coated with a coating of a compound including phosphorus and a further coating of the inorganic particles on the coating of the compound including phosphorus.

15. The method of claim 9 , wherein the resin is a silicone-based resin or an epoxy-based resin.

16. The method of claim 9 , wherein the fillers comprise at least one material selected from the group consisting of silicon dioxide, alumina, titanium oxide and barium sulfate.

17. A light emitting device comprising:

a package having a recess;

a light emitting element comprising a light emitting layer and disposed in the recess;

a first lower layer comprising fluorescent particles and disposed on a bottom of the recess;

a second lower layer comprising the fluorescent particles and disposed on a top of the light emitting element;

a first upper layer comprising fillers and disposed on the first lower layer, the first upper layer covering a side edge of the light emitting layer;

a second upper layer comprising the fillers and disposed on the second lower layer; and

a resin sealing the light emitting element, the first and second lower layers and the first and second upper layers in the recess.

18. The light emitting device of claim 17 , further comprising inorganic particles disposed on surfaces of the fluorescent particles.

19. The light emitting device of claim 18 , wherein the inorganic particles comprise a metal oxide or a metal nitride.

20. The light emitting device of claim 19 , wherein the metal of the metal oxide or metal nitride of which the inorganic particles are comprised is at least one metal selected from the group consisting of Al, Si, In, Ga and a rare earth element.

21. The light emitting device of claim 17 , wherein the bottom of the recess is partially raised by placing a submount on the bottom, the light emitting element is disposed on the submount, and part of the first lower layer and part of the first upper layer are disposed on the submount so that the first upper layer covers the side edge of the light emitting layer.

22. The light emitting device of claim 17 , wherein light emitting element comprises GaN.

23. The light emitting device of claim 17 , wherein the fluorescent particles comprise YAG-based fluorescent material.

24. The light emitting device of claim 17 , wherein the fluorescent particles comprise a fluorescent material coated with a coating of a compound including phosphorus and a further coating of inorganic particles on the coating of the compound including phosphorus.

25. The light emitting device of claim 17 , wherein the resin is a silicone-based resin or an epoxy-based resin.

26. The light emitting device of claim 17 , wherein the fillers comprise at least one material selected from the group consisting of silicon dioxide, alumina, titanium oxide and barium sulfate.

27. A method of manufacturing a light emitting device, comprising:

placing a light emitting element in a recess of a package;

providing a resin mixed with fillers, fluorescent powders comprising a fluorescent material and coated with inorganic particles, the fillers having a specific gravity smaller than the fluorescent powders, and a diffusing agent having the same specific gravity as the resin;

sealing the light emitting element placed in the recess of the package with the resin having the fluorescent powders and the fillers mixed therein; and

applying a centrifugal force to the sealed package so that the fluorescent powders and the fillers are pushed toward a bottom of the recess.

28. The method of claim 27 , wherein, during the application of the centrifugal force, a sum of the centrifugal force and gravity has a direction perpendicular to a top surface of the light emitting element.

29. The method of claim 27 , wherein the light emitting element comprises GaN.

30. The method of claim 27 , wherein the fluorescent material comprises YAG-based fluorescent material.

31. The method of claim 27 , wherein the inorganic particles comprise a metal oxide or a metal nitride.

32. The method of claim 31 , wherein the metal of the metal oxide or metal nitride of which the inorganic particles are comprised is at least one metal selected from the group consisting of Al, Si, In, Ga and a rare earth element.

33. The method of claim 27 , wherein the fluorescent powders comprise a the fluorescent material coated with a coating of a compound including phosphorus and a further coating of the inorganic particles on the coating of the compound including phosphorus.

34. The method of claim 27 , wherein the resin is a silicone-based resin or an epoxy-based resin.

35. The method of claim 27 , wherein the fillers comprise at least one material selected from the group consisting of silicon dioxide, alumina, titanium oxide and barium sulfate.