Process feed management for semiconductor substrate processing
View Patent ↗Embodiments related to managing the process feed conditions for a semiconductor process module are provided. In one example, a gas channel plate for a semiconductor process module is provided. The example gas channel plate includes a heat exchange surface including a plurality of heat exchange structures separated from one another by intervening gaps. The example gas channel plate also includes a heat exchange fluid director plate support surface for supporting a heat exchange fluid director plate above the plurality of heat exchange structures so that at least a portion of the plurality of heat exchange structures are spaced from the heat exchange fluid director plate.
1. A heat exchanger for a showerhead volume of a semiconductor process module, comprising:
a heat exchange plenum assembly comprising a heat exchange fluid director plate and a cover plate; and
a gas channel plate including:
a heat exchange surface including a plurality of heat exchange structures separated from one another by intervening gaps, and
a heat exchange fluid director plate support surface for supporting the heat exchange fluid director plate above the plurality of heat exchange structures so that at least a portion of the plurality of heat exchange structures are spaced from the heat exchange fluid director plate,
wherein a heat exchange fluid channel is formed between the heat exchange surface and the heat exchange fluid director plate, and
wherein heat exchange fluid flows from the heat exchange plenum to the heat exchange fluid channel.
2. The heat exchanger of claim 1 , further comprising a blower fluidly coupled to an air inlet of the heat exchange fluid channel.
3. The heat exchanger of claim 2 , where the heat exchange fluid director plate includes an inner wall, an outer wall, and a ring connecting the inner wall and the outer wall, the outer wall including an opening to receive a duct coupled to the blower, and the ring including one or more openings adjacent to the inner wall forming the air inlet so that an annular air flow body is formed between the inner wall and the outer wall when the heat exchange fluid director plate is coupled to a cover plate.
4. The heat exchanger of claim 2 , further comprising an air flow restrictor coupled to the heat exchange fluid director plate, the air flow restrictor including one or more restriction orifices positioned at an air outlet of the heat exchange fluid channel for adjusting air flow within the heat exchange fluid channel.
5. The heat exchanger of claim 1 , where the plurality of heat exchange structures are distributed in an annular region of the gas channel plate.
6. The heat exchanger of claim 1 , where the plurality of heat exchange structures include a plurality of rectangularly-shaped structures spaced at least 6 mm from one another.