IP Library Granted Patent US 8,854,833
Granted Patent B2
US 8,854,833 · App. 13/284,969 · Granted Oct 7, 2014

Serial advanced technology attachment dual in-line memory module

Inventors: Chun-Po Chen (New Taipei, TW); Chia-Ming Yeh (New Taipei, TW)
Assignee: Hon Hai Precision Industry Co., Ltd.
G06F1/185
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Quick Facts
Patent No.
US 8,854,833
App. No.
13/284,969
Granted
Oct 7, 2014
Kind
B2
Abstract

A serial advanced technology attachment (SATA) dual-in-line memory module (DIMM) includes a circuit board. A control chip and a number of storage chips are arranged on the circuit board. First and second extending boards extend from an end of the circuit board and are coplanar with the circuit board. A space is defined between the first and the second extending boards. A first edge connector is arranged on the first extending board and connected to the control chip. A second edge connector is arranged on bottom edges of the second extending board and the circuit board. A third edge connector is arranged on a top edge of the circuit board opposite to the bottom edge of the circuit board.

Claims (10)

1. A serial advanced technology attachment (SATA) dual-in-line memory module (DIMM) comprising:

a circuit board;

a control chip arranged on the circuit board;

a plurality of storage chips arranged on the circuit board and connected to the control chip;

a first extending board extending from a first end of the circuit board, a first edge connector arranged on the first extending board, to be connected to a storage device interface of a motherboard, wherein the first edge connector comprising a pair of signal input pins, a pair of signal output pins, and three first ground pins, the signal input pins and the signal output pins are connected to the control chip;

a second extending board extending from the first end of the circuit board, a space defined between the first and the second extending boards, a bottom edge of the second extending board being in alignment with a bottom edge of the circuit board, a second edge connector arranged on the bottom edges of the second extending board and the circuit board, to be inserted into a first type of expansion slot of the motherboard, wherein the second edge connector comprises a plurality of second power pins connected to the control chip and the storage chips, and a plurality of second ground pins; and

a third edge connector arranged on a top edge of the circuit board opposite to the bottom edge, to be inserted into a second type of expansion slot of the motherboard, wherein the third edge connector comprises a plurality of third power pins connected to the control chip and the storage chips, and a plurality of third ground pins.

2. The SATA DIMM module of claim 1 , wherein the first edge connector accords with SATA standard.

3. The SATA DIMM module of claim 1 , wherein the first edge connector is connected to a first cable interface at a first end of a cable, a second cable interface at a second end of the cable is connected to the storage device interface of the motherboard.

4. The SATA DIMM module of claim 3 , wherein the circuit board is substantially rectangular, a top edge of the first extending board is lower than the top edge of the circuit board, when the first cable interface at the first end of the cable is connected to the first edge connector, a top surface of the first cable interface is lower than the top edge of the circuit board.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 30, 2011
From: CHEN, CHUN-PO; YEH, CHIA-MING
To: HON HAI PRECISION INDUSTRY CO., LTD.
Reel/Frame 027144/0419 →
Priority Claims (1)
TW 100137404 · Oct 14, 2011 · national
Continuity (1)
Related Publication 20130094167A1 · Apr 18, 2013