Lithographic apparatus and device manufacturing method involving a heater
A lithographic apparatus is described having a liquid supply system configured to at least partly fill a space between a projection system of the lithographic apparatus and a substrate with liquid, a barrier member arranged to substantially contain the liquid within the space, and a heater.
1. A lithographic apparatus, comprising:
a projection system configured to project a patterned radiation beam onto a target portion of a substrate;
a table configured to support the substrate and configured to move relative to the projection system and a liquid confinement member;
a liquid supply system configured to at least partly fill a space between the projection system and the substrate with liquid, the liquid supply system comprising the liquid confinement member extending at least partly between the table and an optical element, closest to the table, of the projection system, the liquid confinement member configured to substantially confine the liquid to a cross-sectional area on the substrate smaller than the area of the pattern receiving surface of the substrate;
a table displacement system, arranged to move the table along a predetermined path relative to the liquid confinement member;
a plurality of heaters each configured to locally heat a corresponding part of the table, of the substrate, or of both the table and the substrate;
a heater control system configured to provide a control signal to each respective one or more heaters of the plurality of heaters to control heating of the corresponding part of the table, of the substrate, or of both the table and the substrate; and
a thermally-induced distortion control system configured to determine a thermally-induced distortion profile of the substrate and configured to adjust a lithographic apparatus parameter, that is other than, or in addition to, the control signal and a temperature of the liquid as being supplied to the space by the liquid supply system, based on the thermally-induced distortion profile of the substrate.
2. The apparatus according to claim 1 , wherein the plurality of heaters comprise a plurality of electric heaters, each of the plurality of electric heaters comprising an electrically conductive layer on or at a top surface of the table.
3. The apparatus of claim 1 , further comprising a plurality of temperature sensors configured to measure a local temperature of at least a portion of the substrate, the table, or both the substrate and the table.
4. The apparatus of claim 1 , wherein the heater control system is configured to control the heating by the plurality of heaters based on temperature information at a plurality of locations on or adjacent the substrate, the table, or both the substrate and the table.
5. The apparatus of claim 1 , wherein the heater control system is configured to control the heating by the plurality of heaters based on position, or velocity, or acceleration, or the predetermined path, or any combination selected therefrom, of the substrate and/or the table.
6. The apparatus of claim 1 , further comprising a thermal fluid conditioning channel in the table in addition to the plurality of heaters.
7. The apparatus of claim 1 , wherein the liquid confinement member has a surface that extends around the space, includes an outlet and has an open aperture between the optical element and the substrate to allow fluid connection between the optical element and the substrate.
8. The apparatus of claim 1 , wherein the heater control system is configured to control the respective one or more heaters of the plurality of heaters to heat a part of the table, of the substrate, or of both the table and the substrate, located under and within or at the boundary of the cross-sectional area as the substrate and/or the table moves relative to the cross-sectional area.
9. The apparatus of claim 1 , wherein the heater control system is configured to control a respective heater of the plurality of heaters to heat a part of the table, of the substrate, or of both the table and the substrate, laterally outside of the target portion while the beam is projected on the target portion.
10. The apparatus according to claim 1 , wherein the heater control system comprises a plurality of controllers, each controller configured to control a respective heater of the plurality of heaters.
11. The apparatus according to claim 1 , wherein each of the plurality of heaters is individually controllable and the heater control system is further configured to provide a different control signal to each respective one or more heaters of the plurality of heaters to control heating of the corresponding part of the table, of the substrate, or of both the table and the substrate.
12. The apparatus according to claim 1 , wherein the lithographic apparatus parameter comprises a positional offset and the thermally-induced distortion control system is configured to provide the positional offset based on the thermally-induced distortion profile of the substrate.
13. The apparatus according to claim 1 , wherein the lithographic apparatus parameter comprises a parameter of the patterned radiation beam and the thermally-induced distortion control system is configured to adjust the parameter of the patterned radiation beam based on the thermally-induced distortion profile of the substrate.
14. A lithographic apparatus comprising:
a projection system configured to project a patterned radiation beam onto a portion of a substrate;
a table configured to support the substrate and configured to move relative to the projection system and a liquid confinement member;
a liquid supply system configured to at least partly fill a space between the projection system and the substrate with a liquid, the liquid supply system comprising the liquid confinement member extending at least partly between the table and an optical element, closest to the table, of the projection system, the liquid confinement member configured to substantially confine the liquid to a cross-sectional area on the substrate smaller than the area of the pattern receiving surface of the substrate;
a plurality of heaters, each heater configured to locally heat a corresponding separate part of the table, of the substrate, or of both the table and the substrate, wherein each of the plurality of heaters is individually controllable; and
a controller configured to switch to a heat emitting state a respective heater of the plurality of heaters under a region of the substrate and/or the table over which the liquid confinement member is located or has already passed, and to switch to a non-heat emitting state a respective heater of the plurality of heaters under a region of the substrate and/or the table over which the liquid confinement member has yet to pass.
15. The apparatus of claim 14 , further comprising a plurality of temperature sensors configured to measure a local temperature of at least a portion of the substrate, the table, or both the substrate and the table and the controller is further configured to control the switching of the heat emitting state by the plurality of heaters based on measured local temperature at a plurality of locations on or adjacent the substrate, the table, or both the substrate and the table.
16. The apparatus of claim 14 , further comprising a thermal fluid conditioning channel in the table in addition to the plurality of heaters.
17. The apparatus of claim 14 , wherein the liquid confinement member has a surface that extends around the space, includes an outlet and has an open aperture between the optical element and the substrate to allow fluid connection between the optical element and the substrate.
18. The apparatus of claim 14 , wherein the controller is configured to control the switching of heat emitting state by the plurality of heaters based on position, or velocity, or acceleration, or predetermined path, or any combination selected therefrom, of the substrate and/or the table.
19. The apparatus of claim 14 , wherein the plurality of heaters comprise a plurality of electric heaters, each of the plurality of electric heaters comprising an electrically conductive layer on or at a top surface of the table.
20. The apparatus of claim 19 , wherein each of the heaters is further configured as a temperature sensor.
21. The apparatus according to claim 14 , wherein the heater control system comprises a plurality of controllers, each controller configured to control a respective heater of the plurality of heaters.
22. A lithographic apparatus comprising:
a projection system configured to project a patterned radiation beam onto a portion of an object;
a table configured to support the object and move relative to the projection system;
a liquid supply system configured to at least partly fill a space between the projection system and the table with a liquid;
a plurality of heaters each configured to locally heat a corresponding part of the table, of the object, or of both the table and the object;
a heater control system configured to provide a control signal to each respective heater of the plurality of heaters to control the respective heater to provide a heat transfer with the corresponding part of the table, of the object, or of both the table and the object; and
a thermally-induced distortion control system configured to determine a thermally-induced distortion profile of the object and configured to adjust a lithographic apparatus parameter, that is separate from the different control signals and separate from a temperature of the liquid as being supplied to the space by the liquid supply system, based on the thermally-induced distortion profile of the object.
23. The apparatus of claim 22 , further comprising a plurality of temperature sensors configured to measure a temperature and the heater control system is configured to control the respective heater based on the measured temperature.
24. The apparatus of claim 22 , wherein each of the plurality of heaters comprises an electrically resistive element on or at a top surface of the table.
25. The apparatus according to claim 22 , wherein the heater control system comprises a plurality of controllers, each controller configured to control a respective heater of the plurality of heaters.
26. The apparatus according to claim 22 , wherein each of the plurality of heaters is individually controllable and the heater control system is further configured to provide a different control signal to each respective heater of the plurality of heaters to control the respective heater to provide a different heat transfer than another of the heaters, with the corresponding part of the table, of the object, or of both the table and the object.
27. The apparatus according to claim 22 , wherein the lithographic apparatus parameter comprises a positional offset and the thermally-induced distortion control system is configured to provide the positional offset based on the thermally-induced distortion profile of the substrate.
28. The apparatus according to claim 22 , wherein the lithographic apparatus parameter comprises a parameter of the patterned radiation beam and the thermally-induced distortion control system is configured to adjust the parameter of the patterned radiation beam based on the thermally-induced distortion profile of the substrate.
29. A lithographic apparatus, comprising:
a substrate table configured to hold a substrate;
a projection system configured to project a radiation beam onto a target portion of the substrate;
a liquid supply system configured to at least partly fill a space between the projection system and the substrate and/or the substrate table with liquid;
a heater configured to heat at least a portion of the substrate;
a substrate temperature control system configured to provide a control signal to the heater to control the heater to provide a heat transfer with the substrate table, the substrate, or both the substrate table and the substrate; and
a thermally-induced distortion control system configured to determine a thermally-induced distortion profile of the substrate and configured to adjust a lithographic apparatus parameter, that is other than, or in addition to, the control signal and a temperature of the liquid as being supplied to the space by the liquid supply system, based on the thermally-induced distortion profile of the substrate.
30. The apparatus according to claim 29 , wherein the lithographic apparatus parameter comprises a positional offset and the thermally-induced distortion control system is configured to provide the positional offset based on the thermally-induced distortion profile of the substrate.
31. The apparatus according to claim 29 , wherein the lithographic apparatus parameter comprises a parameter of the patterned radiation beam and the thermally-induced distortion control system is configured to adjust the parameter of the patterned radiation beam based on the thermally-induced distortion profile of the substrate.
32. The apparatus according to claim 29 , further comprising a temperature sensor configured to determine a temperature and wherein the substrate temperature control system is configured to provide the control signal based on the determined temperature to the heater.