Protective device
A protective device includes a substrate, two first electrodes, a low-melting point metal layer and an assisting layer. The first electrodes are respectively arranged at two opposite sides of the substrate. The low melting point metal layer is arranged over the two first electrodes. The assisting layer is formed on the low melting point metal layer. The liquidus temperature of the assisting layer is below the liquidus temperature of the low melting point metal layer, and the liquidus temperature of the assisting layer is not below a predetermined temperature which is below the maximum working temperature of reflow soldering process by 25 degrees.
1. A protective device, comprising:
a substrate having a top surface and a bottom surface opposite to the top surface;
two first electrodes respectively arranged at two opposite sides of the substrate;
a low-melting point metal layer arranged over the two first electrodes and having a first surface facing the top surface of the substrate and a second surface opposite to the first surface;
an assisting layer formed on the second surface of the low-melting point metal layer, and
a bridging structure directly contacting with the assisting layer on the second surface of the low-melting point metal layer,
wherein a first liquidus temperature of the assisting layer is below a second liquidus temperature of the low-melting point metal layer, and the first liquidus temperature of the assisting layer is not below a predetermined temperature, the predetermined temperature is below a maximum temperature of reflow soldering process by 25 degrees Celsius.
2. The protective device as claim 1 , wherein the first liquidus temperature of the assisting layer is not below the maximum temperature of reflow soldering process.
3. The protective device as claim 1 , wherein the assisting layer comprises tin.
4. The protective device as claim 1 , further comprising a third electrode directly disposed on the top surface of the substrate and between the two first electrodes, and sandwiched between the low melting point metal layer and the substrate.
5. The protective device as claim 4 , wherein the bridging structure is atop the third electrode.
6. The protective device as claim 5 , wherein the assisting layer is formed by applying a liquid material between the bridging structure and the low melting point metal layer and solidifying the liquid material.
7. The protective device as claim 1 , further comprising a heating member disposed on the bottom surface of the substrate and two second electrodes respectively arranged at another two opposite sides of the substrate, wherein the two second electrodes are electrically connected to the heating member.
8. The protective device as claim 4 , wherein one of the second electrodes is electrically connected to the third electrode.
9. The protective device as claim 1 , wherein the substrate is made of an inorganic material.
10. The protective device as claim 1 , wherein the assisting layer is made of material comprising tin, silver, copper or an alloy thereof.
11. A protective device, comprising:
a substrate having a top surface and a bottom surface opposite to the top surface;
a low-melting point metal layer arranged over the substrate and having a first surface facing the top surface of the substrate and a second surface opposite to the first surface;
an assisting layer formed on the second surface of the low-melting point metal layer;
a bridging structure crossing the low melting point metal layer and directly contacting with the assisting layer on the second surface of the low-melting point metal layer; and
a heating member disposed on the top surface of the substrate,
wherein a first liquidus temperature of the assisting layer is below a second liquidus temperature of the low-melting point metal layer, and the first liquidus temperature of the assisting layer is not below a predetermined temperature, the predetermined temperature is below a maximum temperature of reflow soldering process by 25 degrees Celsius.
12. The protective device as claim 11 , wherein the first liquidus temperature of the assisting layer is not below the maximum temperature of reflow soldering process.
13. The protective device as claim 11 , wherein the assisting layer comprises tin.
14. The protective device as claim 11 , further comprising two first electrodes respectively arranged at two opposite sides of the substrate and electrically connected to the low-melting point metal layer, and a third electrode disposed between the two first electrodes and sandwiched between the low melting point metal layer and the substrate.
15. The protective device as claim 14 , wherein the bridging structure is connected to the third electrode.
16. The protective device as claim 14 , further comprising two second electrodes respectively arranged at another two opposite sides of the substrate, wherein the two second electrodes are electrically connected to the heating member and one of the second electrodes is electrically connected to the third electrode.
17. The protective device as claim 16 , further comprising an insulating layer located between the heating member and the third electrode, and the two second electrodes respectively arranged at another two opposite sides of the substrate, wherein the two second electrodes are electrically connected to the heating member and one of the second electrodes is electrically connected to the third electrode.
18. The protective device as claim 11 , wherein the assisting layer is made of material comprising tin, silver, copper or an alloy thereof.