Semiconductor device having insulating film with surface modification layer and method for manufacturing the same
Provided is a semiconductor device, which includes an interlayer insulating film formed on a semiconductor substrate, a wiring layer filled in a recess formed in the interlayer insulating film, and a cap insulating film. The interlayer insulating film includes a first SiOCH film and a surface modification layer including an SiOCH film formed by modifying a surface layer of the first SiOCH film, the SiOCH film having a lower carbon concentration and a higher oxygen concentration than the first SiOCH film has. The cap insulating film contacts with surfaces of the metal wiring and the surface modification layer.
1. A manufacturing method for a semiconductor device comprising:
forming a first insulating film including a SiOCH film on a semiconductor substrate;
forming a surface modification layer as a surface layer of the first insulating film by performing plasma treatment using an inert gas;
forming a hard mask on the surface modification layer;
forming a recess in the hard mask and the first insulating film, the recess passing through the hard mask, the surface modification layer, and the first insulating film;
forming a metal wiring to fill in the recess;
exposing the surface modification layer by removing a part of the metal wiring exposed outside the recess and by removing the hard mask; and
forming a second insulating film on surfaces of the exposed surface modification layer and the metal wiring.
2. The manufacturing method for a semiconductor device according to claim 1 , wherein the first insulating film is formed by a plasma polymerization method using, as a material, a compound having a cyclic organic silica structure expressed by the following Formula (1):
where each of R1 and R2 is any one of vinyl radical, allyl radical, methyl radical, ethyl radical, propyl radical, isopropyl radical, and butyl radical.
3. The manufacturing method for a semiconductor device according to claim 2 , wherein the compound having the cyclic organic silica structure is expressed by the following Formula (2):
4. The manufacturing method for a semiconductor device according to claim 2 , wherein the compound having the cyclic organic silica structure is expressed by the following Formula (3):
5. The manufacturing method for a semiconductor device according to claim 1 , wherein the exposing the surface modification layer includes performing chemical mechanical polishing using alkaline slurry as polishing liquid to remove the part of the metal wiring exposed outside the recess and to remove the hard mask for exposing the surface modification layer.
6. The manufacturing method for a semiconductor device according to claim 1 , wherein the hard mask is made of SiO 2 .