Polishing apparatus
A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.
1. A polishing apparatus comprising:
a polishing table configured to support a polishing pad having a polishing surface;
a top ring body configured to press a substrate against the polishing surface;
a retainer ring configured to be movable vertically relative to said top ring body to press the polishing surface, said retainer ring being coupled to a peripheral portion of said top ring body;
an elastic membrane provided at a lower portion of said top ring body, said lower portion of said top ring body and said elastic membrane forming a pressure chamber in which a pressurized fluid is supplied, said elastic membrane being brought into contact with at least a portion of the substrate; and
a seal member connecting said elastic membrane to said retainer ring to cover a gap between said elastic membrane and said retainer ring, said seal member being isolated from said pressure chamber so as to receive a pressure differing from a pressure of the pressurized fluid,
wherein said seal member is integral with said elastic membrane, and
wherein said seal member has an inverted U-shaped cross-section opening in a direction toward the polishing table.
2. The polishing apparatus as recited in claim 1 , wherein said seal member has an inner edge arranged on said elastic membrane and an outer edge arranged on said retainer ring.
3. The polishing apparatus as recited in claim 1 , wherein said seal member is made of a soft material and is deformable according to a vertical movement of said retainer ring.
4. The polishing apparatus as recited in claim 1 , further comprising:
an edge holder configured to secure an edge of said elastic membrane to said top ring body.
5. The polishing apparatus as recited in claim 1 , wherein:
said seal member has an inner edge integrally connected to said elastic membrane and an outer edge secured to said retainer ring; and
said outer edge of said seal member is movable vertically together with said retainer ring relative to said inner edge of said seal member.
6. The polishing apparatus as recited in claim 1 , wherein said seal member includes:
an outer vertical portion in contact with an inner surface of said retainer ring;
an inner vertical portion in contact with an outer surface of said top ring body; and
a rounded portion connecting said outer vertical portion to said inner vertical portion.
7. The polishing apparatus according to claim 1 , wherein:
said pressure chamber comprises a first pressure chamber; and
said polishing apparatus further comprises a second pressure chamber configured to move said retainer ring vertically relative to said top ring body to press said retainer ring against the polishing surface.