Semiconductor device and method for manufacturing same
View Patent ↗A semiconductor device of the present invention includes: a semiconductor layer; a gate insulation film provided on the semiconductor layer and including at least one of Hf and Zr; and a gate electrode provided on the gate insulation film and including a carbonitride which includes at least one of Hf and Zr.
1. A method for manufacturing a semiconductor device, comprising:
forming a gate insulation film, including at least one of Hf and Zr, on a semiconductor layer; and
forming a gate electrode, including least one of Hf and Zr, on the gate insulation film,
wherein both the gate insulation film including at least one of Hf and Zr, and the gate electrode including at least one of Hf and Zr are formed using the same Hf precursor or Zr precursor, and
a concentration of the one of Hf and Zr included in the gate insulation film and a concentration of the one of Hf and Zr included in the gate electrode are about same at an interface between the gate insulating film and the gate electrode.
2. The method according to claim 1 , wherein a precursor including Hf(NR 1 R 2 ) 4 is used as a precursor of Hf and a precursor including SiR 3 R 4 R 5 R 6 is used as a precursor of Si to form the gate electrode as a film including Hf, Si, C, and N, where R 1 and R 2 are selected from H, CH 3 , C 2 H 5 , and C 3 H 7 , and R 3 , R 4 , R 5 , and R 6 are selected from H, NH 2 , N(CH 3 ) 2 , N(C 2 H 5 ) 2 , and N(C 3 H 7 ) 2 .
3. The method according to claim 1 , wherein both the gate electrode including Hf, Si, C, and N and the gate insulation film including Hf, Si, O, and N are formed as films using the same Hf precursor and the same Si precursor.
4. The method according to claim 1 , wherein the forming the gate insulation film includes:
forming an HfSiO film by CVD (chemical vapor deposition); and
forming an HfSiON film by performing plasma nitriding on the HfSiO film.
5. The method according to claim 1 , wherein the forming the gate electrode includes forming an HfSiCN film by CVD (chemical vapor deposition).
6. The method according to claim 5 , wherein hydrogen gas is added to a source gas when forming the HfSiCN film by the CVD.
7. The method according to claim 5 , wherein the forming the gate electrode further includes performing plasma nitriding on the HfSiCN film.
8. The method according to claim 1 , wherein both the gate insulation film including Si and the gate electrode including Si are formed using the same Si precursor.
9. The method according to claim 1 , wherein the gate electrode includes a carbonitride.
10. The method according to claim 1 , wherein the Hf precursor or the Zr precursor includes a carbon.