Method for the simultaneous material-removing processing of both sides of at least three semiconductor wafers
View Patent ↗A method for the simultaneous material-removing processing of both sides of at least three semiconductor wafers includes providing a double-side processing apparatus including two rotating ring-shaped working disks and a rolling apparatus. The carriers are arranged in the double-side processing apparatus and the openings are disposed in the carriers so as to satisfy the inequality: R/e ·sin(π/ N *)− r/e −1≦1.2 where N* denotes a ratio of the round angle and an angle at which adjacent carriers are inserted into the rolling apparatus with the greatest distance with respect to one another, r denotes a radius of each opening for receiving a respective semiconductor wafer, e denotes a radius of a pitch circle around a midpoint of the carrier on which the opening is arranged, and R denotes a radius of the pitch circle on which the carriers move between the working disks by means of the rolling apparatus.
1. A method for the simultaneous material-removing processing of both sides of at least three semiconductor wafers, the method comprising:
providing a double-side processing apparatus including two rotating ring-shaped working disks and a rolling apparatus configured to rotate at least three carriers, each carrier including precisely one opening adapted to receive a respective one of the semiconductor wafers in a freely movable fashion, the carriers being arranged in the double-side processing apparatus and the openings being disposed in the carriers so as to satisfy the inequality:
R/e ·sin(π/ N *)− r/e− 1≦1.2
where N* denotes a ratio of the round angle and an angle at which adjacent carriers are inserted into the rolling apparatus with the greatest distance with respect to one another, r denotes a radius of each opening for receiving a respective semiconductor wafer, e denotes a radius of a pitch circle around a midpoint of the carrier on which the opening is arranged, and R denotes a radius of the pitch circle on which the carriers move between the working disks by means of the rolling apparatus;
disposing the semiconductor wafers between the two rotating ring-shaped working disks; and
rotating the at least three carriers using the rolling apparatus so as to move the semiconductor wafers on a cycloidal trajectory between the working disks.
2. The method as recited in claim 1 , wherein the carriers are arranged in the double-side processing apparatus and the openings are arranged in the carriers so as to satisfy the inequality:
0.05≦ R/e ·sin(π/ N *)− r/e− 1≦0.55.
3. The method as recited in claim 1 , wherein the semiconductor wafers have a diameter of at least 400 mm.
4. The method as recited in claim 2 , wherein the semiconductor wafers have a diameter of at least 400 mm.
5. The method as recited in claim 1 , wherein the openings of the carriers have the same size and the openings of the carriers are arranged in the carriers in the same way.
6. The method as recited in claim 2 , wherein the openings of the carriers have the same size and the openings of the carriers are arranged in the carriers in the same way.
7. The method as recited in claim 3 , wherein the openings of the carriers have the same size and the openings of the carriers are arranged in the carriers in the same way.
8. The method as recited in claim 1 , wherein, on each carrier, an enveloping circular line around the midpoint of the carrier is defined, which precisely completely encompasses the opening for receiving the respective semiconductor wafer, and wherein the carriers are arranged in the rolling apparatus such that a sum of the absolute values of deviations of distances between the enveloping circular lines of adjacent carriers from the average distance between adjacent enveloping circular lines is minimal.
9. The method as recited in claim 8 , wherein the distances between the enveloping circular lines of each adjacent pair of carriers is identical.