Resistance variable memory device with nanoparticle electrode and method of fabrication
View Patent ↗A chalcogenide-based programmable conductor memory device and method of forming the device, wherein a nanoparticle is provided between an electrode and a chalcogenide glass region. The method of forming the nanoparticle utilizes a template over the electrode or random deposition of the nanoparticle.
1. A memory device, comprising:
a first electrode and a second electrode;
a chalcogenide material memory element comprising a chalcogenide glass material between the first electrode and the second electrode; and
a nanoparticle between the first electrode and at least a portion of the chalcogenide material memory element, wherein the nanoparticle has a curved surface contacting the chalcogenide material memory element, and wherein the chalcogenide glass material is in physical contact with both the nanoparticle and the first electrode and the nanoparticle is separated from the second electrode by at least a portion of the chalcogenide glass material.
2. The memory device of claim 1 , wherein the nanoparticle is spherical, semi-spherical, or pebble-like in shape.
3. The memory element of claim 1 , wherein the nanoparticle has a diameter of between about 3 nm and about 20 nm.
4. The memory element of claim 3 , wherein the diameter of the nanoparticle is at least about 10 nm.
5. The memory element of claim 1 , wherein the first electrode has a surface having a roughness of about 0.20 R a μm and the nanoparticle is larger in diameter than said roughness.
6. The memory element of claim 1 , wherein the chalcogenide material memory element is in physical contact with the curved surface of the nanoparticle and a surface of the first electrode.
7. The memory element of claim 1 , wherein the nanoparticle comprises a material selected from the group consisting of tungsten, titanium nitride, platinum, palladium, ruthenium, and alloys of these materials.
8. The memory element of claim 1 , wherein the chalcogenide material memory element comprises germanium selenide.
9. The memory element of claim 8 , wherein the chalcogenide material memory element further comprises a material selected from the group consisting of silver selenide and tin selenide.
10. The memory element of claim 1 , further comprising a conducting channel in the chalcogenide material memory element and originating from the nanoparticle.
11. The memory element of claim 10 , further comprising a conductive pathway along the conducting channel.
12. A memory device, comprising:
a first electrode and a second electrode;
a chalcogenide material memory element comprising a chalcogenide glass material between the first electrode and the second electrode; and
a nanoparticle between the first electrode and at least a portion of the chalcogenide material memory element, wherein the nanoparticle is configured to create a localized electric field in response to an applied voltage, wherein the localized electric field is substantially stronger than an electric field produced by the first electrode in response to the same applied voltage, and wherein the chalcogenide glass material is in physical contact with both the nanoparticle and the first electrode and the nanoparticle is separated from the second electrode by at least a portion of the chalcogenide glass material.
13. The memory device of claim 12 , wherein the strength of the localized electric field depends in part on a curvature of a surface of the nanoparticle.
14. The memory device of claim 12 , wherein the nanoparticle is spherical, semi-spherical, or pebble-like in shape.
15. The memory element of claim 12 , wherein the nanoparticle has a diameter of between about 3 nm and about 20 nm.
16. The memory element of claim 15 , wherein the diameter of the nanoparticle is at least about 10 nm.
17. The memory element of claim 12 , wherein the first electrode has a surface having a roughness of about 0.20 R a μm and the nanoparticle is larger in diameter than said roughness.
18. The memory element of claim 12 , wherein the chalcogenide material memory element is in physical contact with a curved surface of the nanoparticle and a surface of the first electrode.
19. The memory element of claim 12 , wherein the nanoparticle comprises a material selected from the group consisting of tungsten, titanium nitride, platinum, palladium, ruthenium, and alloys of these materials.
20. The memory element of claim 12 , wherein the chalcogenide material memory element comprises germanium selenide.
21. The memory element of claim 20 , wherein the chalcogenide material memory element further comprises a material selected from the group consisting of silver selenide and tin selenide.
22. The memory element of claim 12 , further comprising a conducting channel in the chalcogenide material memory element and originating from the nanoparticle.
23. The memory element of claim 22 , further comprising a conductive pathway along the conducting channel.
24. A memory device, comprising:
a first electrode and a second electrode;
a resistance variable memory element comprising a chalcogenide glass material between the first electrode and the second electrode; and
a nanoparticle between the first electrode and at least a portion of the memory element, wherein the nanoparticle has a curved surface contacting the memory element, and wherein the chalcogenide glass material is in physical contact with both the nanoparticle and the first electrode and the nanoparticle is separated from the second electrode by at least a portion of the chalcogenide glass material.
25. The memory device of claim 24 , wherein the nanoparticle is spherical, semi-spherical, or pebble-like in shape.
26. The memory element of claim 24 , wherein the nanoparticle has a diameter of between about 3 nm and about 20 nm.
27. The memory element of claim 26 , wherein the diameter of the nanoparticle is at least about 10 nm.
28. The memory element of claim 24 , wherein the first electrode has a surface having a roughness of about 0.20 R a μm and the nanoparticle is larger in diameter than said roughness.
29. The memory element of claim 24 , wherein the memory element is in physical contact with the curved surface of the nanoparticle and a surface of the first electrode.
30. The memory element of claim 24 , wherein the nanoparticle comprises a material selected from the group consisting of tungsten, titanium nitride, platinum, palladium, ruthenium, and alloys of these materials.
31. The memory element of claim 24 , wherein the memory element comprises a chalcogenide material.
32. The memory element of claim 31 , wherein the chalcogenide material comprises germanium selenide.
33. The memory element of claim 32 , wherein the chalcogenide material memory element further comprises a material selected from the group consisting of silver selenide and tin selenide.