IP Library › Granted Patent US 9,278,483
Granted Patent B2
US 9,278,483 · App. 13/318,947 · Granted Mar 8, 2016

Additive layer fabrication method

Inventors: Andrew David Wescott (Bristol, GB); Benjamin Richard Moreland (Church Stretton, GB); Jagjit Sidhu (Bristol, GB)
Assignee: BAE SYSTEMS PLC
B29C67/0077B22F3/1055B23K26/32B23K26/342B23K35/0244B22F2003/1056B23K2203/50C23C16/483C23C24/00Y02P10/295
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Quick Facts
Patent No.
US 9,278,483
App. No.
13/318,947
Granted
Mar 8, 2016
Kind
B2
Abstract

A selective layer melting or other additive layer fabrication method in which powdered material is fused by heating it with a pulsed laser, the pulses being modulated while the laser is traversing the substrate so as to control the thickness and/or width of the layer being formed. Initial layers of the fabrication structure may be formed more thickly than subsequent layers, e.g. by means of a CW laser, to reduce distortion. This aspect of the invention may be employed independently of the use of a pulsed laser to form the subsequent layers.

Claims (11)

1. A method of fabricating an object, comprising:

applying heat by at least one laser beam to powdered material so as to fuse the material into a layer on a substantially flat substrate; and

repeating the applying of heat by said at least one laser beam to said powdered material to build up a stack of layers one on top of the other, wherein an application of heat by said at least one laser beam is sufficient to create a local pool of molten material and wherein a layer or layers nearest to the substrate are formed to be thicker than those further from the substrate, whereby to reduce distortion in the substrate.

2. The method of claim 1 , wherein thinner layers are formed by applying heat by a pulsed laser.

3. The method of claim 1 , wherein thicker layers are formed by applying heat by a continuous wave laser.

4. The method of claim 2 , wherein thicker layers are formed by applying heat by operating the pulsed laser at a higher duty cycle than for thinner layers.

5. The method of claim 1 , wherein the thicker layers are formed by traversing the laser beam across the substrate at a lower speed than for thinner layers.

6. Fabrication apparatus configured for performing the method of claim 1 , the apparatus comprising:

a laser device for applying the heat; and

a computer containing a tangible medium programmed to control the laser according to the claim 1 method.

7. A computer program which when installed and operated causes a fabrication apparatus to perform the method of claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 21, 2012
From: WESCOTT, ANDREW DAVID; MORELAND, BENJAMIN RICHARD; SIDHU, JAGJIT
To: BAE SYSTEMS PLC
Reel/Frame 027737/0477 →
Priority Claims (2)
EP 09275030 · Apr 28, 2009 · regional
GB 0907226.5 · Apr 28, 2009 · national
Continuity (1)
Related Publication 20120132631A1 · May 31, 2012