Semiconductor device with buried gates and fabrication method thereof
A semiconductor device includes a substrate having a cell region and a peripheral region, a buried gate formed over the substrate of the cell region, a peripheral gate formed over the substrate of the peripheral region and comprising a conductive layer, an inter-layer dielectric layer that covers the substrate, and a peripheral bit line formed inside the inter-layer dielectric layer and contacting the conductive layer.
1. A method for fabricating a semiconductor device, comprising:
preparing a substrate having a cell region and a peripheral region;
forming a cell gate buried in the substrate of the cell region;
forming a peripheral gate including a conductive layer over a substrate of the peripheral region, wherein the peripheral gate is formed at a different level from the cell gate;
forming an inter-layer dielectric layer that covers the peripheral gate of the peripheral region;
forming a peripheral damascene pattern that exposes the conductive layer by selectively etching the inter-layer dielectric layer and the peripheral gate of the peripheral region; and
forming a peripheral bit line that fills the peripheral damascene pattern of the peripheral region.
2. The method of claim 1 , wherein the forming of the peripheral damascene pattern comprises:
forming a hole pattern that exposes the conductive layer by selectively etching the inter-layer dielectric layer and the peripheral gate; and
forming a line pattern coupled with the hole pattern by selectively etching the inter-layer dielectric layer.
3. The method of claim 1 , wherein the forming of the inter-layer dielectric layer comprises:
forming a first inter-layer dielectric layer over the substrate;
performing a planarization process until the gate is exposed; and
forming a second inter-layer dielectric layer having a higher dielectric constant than the first inter-layer dielectric layer over the first inter-layer dielectric layer.
4. The method of claim 3 , wherein the first inter-layer dielectric layer and the second inter-layer dielectric layer are formed of the same materials.
5. A method for fabricating a semiconductor device, comprising:
preparing a substrate having a cell region and a peripheral region;
forming a buried gate in the substrate of the cell region;
forming a peripheral gate including a conductive layer over the substrate of the peripheral region, wherein the peripheral gate is formed at a different level from the buried gate;
forming a first inter-layer dielectric layer over the substrate;
performing a planarization process until the peripheral gate is exposed;
forming a second inter-layer dielectric layer over the first inter-layer dielectric layer;
forming a peripheral damascene pattern that exposes the conductive layer by selectively etching the peripheral gate and the second inter-layer dielectric layer of the peripheral region; and
forming a peripheral bit line that fills the peripheral damascene pattern.
6. The method of claim 5 , further comprising:
forming a storage node contact plug that penetrates the first inter-layer dielectric layer and the second inter-layer dielectric layer in the cell region before the forming of the peripheral damascene pattern;
forming a cell damascene pattern by selectively etching the first inter-layer dielectric layer and the second inter-layer dielectric layer of the cell region;
forming bit line spacers on sidewalls of the cell damascene pattern;
forming a cell bit line that fills a portion of the cell damascene pattern; and
forming a cell bit line hard mask layer that fills the other portion of the cell damascene pattern,
wherein the peripheral bit line is formed at the same level as the storage node contact plug in the cell region.
7. The method of claim 6 , wherein the forming of the storage node contact plug comprises:
forming a storage node contact hole by selectively etching the first inter-layer dielectric layer and the second inter-layer dielectric layer;
forming a conductive layer over the substrate to fill the storage node contact hole; and
performing a planarization process until the second inter-layer dielectric layer is exposed.
8. The method of claim 7 , wherein the storage node contact hole is formed to have one type selected from the group consisting of a hole type, a bar type, and a line type.
9. The method of claim 5 , wherein the second inter-layer dielectric layer is formed of a material with a higher dielectric constant than the first inter-layer dielectric layer.
10. The method of claim 5 , wherein the first inter-layer dielectric layer and the second inter-layer dielectric layer are formed of the same materials.
11. The method of claim 5 , wherein the forming of the peripheral damascene pattern comprises:
forming a hole pattern that exposes the conductive layer by selectively etching the peripheral gate and the second inter-layer dielectric layer and the gate; and
forming a line pattern coupled with the hole pattern by selectively etching the second inter-layer dielectric layer.
12. The method of claim 5 , further comprising:
forming an etch stop layer over the substrate.
13. The method of claim 1 , further comprising:
forming a storage node contact plug that penetrates the inter-layer dielectric layer in the cell region before the forming of the peripheral damascene pattern, wherein the peripheral bit line is formed at the same level as the storage node contact plug in the cell region.
14. The method of claim 5 , further comprising:
forming a storage node contact plug that penetrates the first inter-layer dielectric layer and the second inter-layer dielectric layer in the cell region before the forming of the peripheral damascene pattern, wherein the peripheral bit line is formed at the same level as the storage node contact plug in the cell region.