Isolation barrier device and methods of use
Systems and methods pertaining to a digital signal isolator device are described. In one embodiment, the device includes an isolation barrier and two metal support paddles. The isolation barrier contains an organic and/or a semi-organic insulating material with at least one capacitor embedded inside. One of the two metal support paddles is located below a first portion of a bottom surface of the isolation barrier to provide support to the isolation barrier, while the other metal support paddle is located below a second portion of a bottom surface of the isolation barrier to provide support to the isolation barrier.
1. A digital signal isolator device comprising:
an isolation barrier comprising at least one of an organic or a semi-organic insulating material;
a capacitor comprising a pair of parallel capacitor plates embedded inside the isolation barrier;
a first metal support paddle located below a first portion of a bottom surface of the isolation barrier to provide support to the isolation barrier; and
a second metal support paddle located below a second portion of a bottom surface of the isolation barrier to provide support to the isolation barrier.
2. The device of claim 1 , wherein the organic insulating material comprises a polyimide.
3. The device of claim 1 , wherein the semi-organic insulating material comprises a silicon-based polymer.
4. The device of claim 1 , further comprising:
a first die mounted at a first location on a major surface of the isolation barrier with a first bonding wire providing a first electrically conductive path between a first terminal of the first die and a first plate of the pair of parallel capacitor plates; and
a second die mounted at a second location on the major surface of the isolation barrier, with a second bonding wire providing a second electrically conductive path between a first terminal of the second die and a second plate of the pair of parallel capacitor plates.
5. The device of claim 4 , further comprising:
a lead frame comprising a plurality of externally-accessible pins of the device;
a third bonding wire providing a third electrically conductive path between a second terminal of the first die and at least one externally-accessible pin of the lead frame; and
a fourth bonding wire providing a fourth electrically conductive path between a second terminal of the second die and at least another externally-accessible pin of the lead frame.
6. The device of claim 1 , wherein the first metal support paddle extends beyond a first edge of the isolation barrier, the second metal support paddle extends beyond a second edge of the isolation barrier, and further comprising:
a first die mounted on an extension portion of the first metal support paddle;
a second die mounted on an extension portion of the second metal support paddle;
a first bonding wire providing a first electrically conductive path between a first terminal of the first die and a first plate of the pair of parallel capacitor plates embedded inside the isolation barrier; and
a second bonding wire providing a second electrically conductive path between a first terminal of the second die and a second plate of the pair of parallel capacitor plates embedded inside the isolation barrier.
7. The device of claim 6 , further comprising:
a lead frame comprising a plurality of externally-accessible pins of the device;
a third bonding wire providing a third electrically conductive path between a second terminal of the first die and at least one externally-accessible pin of the lead frame; and
a fourth bonding wire providing a fourth electrically conductive path between a second terminal of the second die and at least another externally-accessible pin of the lead frame.
8. A digital signal isolator device comprising:
a first metal support paddle;
a second metal support paddle that is electrically isolated from the first metal support paddle;
an isolation barrier comprising at least one of an organic or a semi-organic insulating material, the isolation barrier having a first portion supported by the first metal support paddle and a second portion supported by the second metal support paddle;
a pair of parallel capacitor plates embedded inside the isolation barrier;
a first die mounted at a first location on a major surface of the isolation barrier with a first bonding wire providing a first electrically conductive path between a first terminal of the first die and a first plate of the pair of parallel capacitor plates; and
a second die mounted at a second location on the major surface of the isolation barrier, with a second bonding wire providing a second electrically conductive path between a first terminal of the second die and a second plate of the pair of parallel capacitor plates.
9. The device of claim 8 , wherein the first metal support paddle includes a first externally-accessible pin of the device, and the second metal support paddle includes a second externally-accessible pin of the device.