Semicondcutor device and method for fabricating the same
A semiconductor device includes a pinned layer having a magnetic direction permanently set to a first direction, a tunnel insulating layer arranged on the pinned layer, a free layer arranged on the tunnel insulating layer and having a changeable magnetic direction, and a magnetic induction layer formed to surround the pinned layer and have a magnetic direction permanently set to a second direction different from the first direction.
1. A semiconductor device, comprising:
a pinned layer having a magnetic direction permanently set to a first direction;
a tunnel insulating layer arranged on the pinned layer;
a free layer arranged on the tunnel insulating layer and having a changeable magnetic direction; and
a magnetic induction layer formed to surround the pinned layer, and have a magnetic direction permanently set to a second direction different from the first direction,
wherein a height of the magnetic induction layer is equal to or lower than that of the pinned layer.
2. The semiconductor device as recited in claim 1 , wherein the magnetic induction layer and the pinned layer have the same height from a bottom of a semiconductor substrate.
3. The semiconductor device as recited in claim 1 , wherein the magnetic induction layer has lower height from a bottom of semiconductor substrate than the pinned layer.
4. The semiconductor device as recited in claim 1 , wherein the magnetic induction layer and the pinned layer include different materials, respectively.
5. The semiconductor device as recited in claim 1 , wherein the pinned layer and the magnetic induction layer each include at least one selected from the group of CoFeB, FePt, CoPt, Co/Pd, Co/Pt, Fe/Pd, Fe/Pt, CoFe/Pd and Cofe/Pt.
6. The semiconductor device as recited in claim 1 , wherein the free layer includes at least one selected from the group of CoFeB, FePt, CoPt, Co/Pd, Co/Pt, Fe/Pd, Fe/Pt, CoFe/Pd and Cofe/Pt, or a rare-earth metal.
7. The semiconductor device as recited in claim 1 , wherein at least one of the pinned layer, the magnetic induction layer, and the free layer includes a rare-earth metal.
8. The semiconductor device as recited in claim 1 , wherein the tunnel insulating layer includes MgO.
9. The semiconductor device as recited in claim 1 , further comprising a spacer pattern arranged between the pinned layer and the magnetic induction layer.
10. The semiconductor device as recited in claim 9 , wherein the spacer pattern includes an insulating layer.
11. The semiconductor device as recited in claim 1 , wherein the first and second directions are parallel or perpendicular to each other.
12. A semiconductor device, comprising:
a pinned layer having a magnetic direction permanently set to a first direction;
a tunnel insulating layer arranged on the pinned layer;
a free layer arranged on the tunnel insulating layer;
a magnetic induction layer formed to surround the pinned layer and have a magnetic direction set to a second direction opposite to the first direction; and
a spacer pattern arranged between the pinned layer and the magnetic induction layer, wherein the pinned layer, the tunnel insulating layer and the free layer are surrounded by the spacer pattern,
wherein a height of the magnetic induction layer is equal to or lower than that of the pinned layer.
13. The semiconductor device as recited in claim 12 , wherein the magnetic induction layer and the pinned layer have the same height from a bottom of a semiconductor substrate.
14. The semiconductor device as recited in claim 12 , wherein the magnetic induction layer has a lower height from a bottom of semiconductor substrate than the pinned layer.