Semiconductor device and fabricating method thereof

1. A manufacturing method of a semiconductor device, comprising:

providing a substrate having at least a first semiconductor unit, at least a second semiconductor unit and a first ILD layer formed thereon, wherein the first semiconductor unit has a first sacrificial gate structure formed therein, the second semiconductor unit has a second sacrificial gate structure formed therein, and the first ILD layer is formed on the substrate; and

forming a first gate trench in the first sacrificial gate structure; and

forming a second gate trench in the second sacrificial gate structure; and

forming a first metal layer on the surface of the first gate trench and the second gate trench; and

forming a plurality of first contact holes in the first metal layer and the first ILD layer; and

forming a second metal layer in the first gate trench, the second gate trench and the first contact hole simultaneously.

2. The manufacturing method of the semiconductor device of claim 1 , wherein a conductive type of the first semiconductor is an n-type and a conductive type of the second semiconductor is a p-type.

3. The manufacturing method of the semiconductor device of claim 1 , wherein the first metal layer comprises a second work function metal layer.

4. The manufacturing method of the semiconductor device of claim 1 , wherein the second metal layer comprises a main conductive layer.

5. The manufacturing method of the semiconductor device of claim 1 , further comprising forming a first work function metal layer in the second gate trench before forming the first work function metal layer.

6. The manufacturing method of the semiconductor device of claim 1 , wherein a high-k gate dielectric layer formed in the first gate sacrificial structure and the second gate sacrificial structure, and the high-k gate dielectric layer is formed between the substrate and the first gate layer.

7. The manufacturing method of the semiconductor device of claim 3 , wherein the first contact hole may be formed after the second work function metal layer is formed.

8. The manufacturing method of the semiconductor device of claim 5 , wherein the first contact hole may be formed after the first work function metal layer is formed.

9. The manufacturing method of the semiconductor device of claim 6 , wherein the high dielectric constant (high-k) dielectric layer has a “−” or “U” shaped profile structure.

10. A semiconductor device, comprising:

a substrate;

a first semiconductor unit and a second semiconductor unit disposed on the substrate, wherein the first semiconductor unit comprises a first metal gate structure, and the second semiconductor unit comprises a second metal gate structure;

a first ILD layer disposed on the substrate, and;

a plurality of contact holes, formed in the ILD layer, wherein the first metal gate structure and the second metal gate structure comprise a second work function metal layer and a main conductive layer; and the contact holes comprise the main conductive layer, wherein the main conductive layer is directly connected to the sidewalls of the first contact holes.

11. The semiconductor device of claim 10 , wherein the contact holes do not comprise the second work function metal layer.

12. The semiconductor device of claim 10 , wherein the second metal gate structure further comprises a first work function metal layer disposed between the second work function metal layer and the substrate.

13. The semiconductor device of claim 10 , wherein a conductive type of the first semiconductor unit is an n-type and a conductive type of the second semiconductor unit is a p-type.

14. The semiconductor device of claim 10 , wherein both the first semiconductor unit and the second semiconductor unit comprise a high-k gate dielectric layer.