Solid-state image pickup device
A solid-state image pickup device 1 according to the present invention includes a semiconductor substrate 2 on which a pixel 20 composed of a photodiode 3 and a transistor is formed. The transistor comprising the pixel 20 is formed on the surface of the semiconductor substrate, a pn junction portion formed between high concentration regions of the photodiode 3 is provided within the semiconductor substrate 2 and a part of the pn junction portion of the photodiode 3 is extended to a lower portion of the transistor formed on the surface of the semiconductor substrate 2 . According to the present invention, there is provided a solid-state image pickup device in which a pixel size can be microminiaturized without lowering a saturated electric charge amount (Qs) and sensitivity.
1. A solid-state image pickup device comprising:
a photodiode between a surface side of a semiconductor substrate and a back side of the semiconductor substrate, said photodiode being composed of first conductivity regions and a second conductivity region,
wherein said first conductivity regions are between said surface side and said second conductivity region, one of the first conductivity regions being closer to said back side than another of the first conductivity regions.
2. A solid state image pickup device according to claim 1 , wherein said first conductivity regions and said second conductivity region are is across regions of adjacent unit pixels.
3. A solid state image pickup device according to claim 2 , wherein a pixel separation region is between said adjacent unit pixels.
4. A solid state image pickup device according to claim 1 , wherein said first conductivity regions have a conductivity type opposite to that of said second conductivity region.
5. A solid state image pickup device according to claim 1 , wherein said first conductivity regions are of a p-type, said second conductivity region being of n-type.
6. A solid state image pickup device according to claim 1 , wherein said photodiode is configured to convert light into a signal, said light being incident upon said back side.
7. A solid state image pickup device according to claim 1 , wherein a groove in the semiconductor substrate extends from a surface side toward said back side.