MRAM DEVICE AND METHOD OF ASSEMBLING SAME
A method of packaging a magnetoresistive random access memory (MRAM) die includes providing a lead frame having a die pad and lead fingers. The MRAM die is attached to the die pad with a first die attach adhesive and bond pads of the MRAM die are electrically connected to the lead fingers of the lead frame with wires using a wire bonding process. A pre-formed composite magnetic shield is attached to a top surface of the MRAM die with a second die attach adhesive. The magnetic shield includes a magnetic permeable filler material dispersed within an organic matrix. An encapsulating material is dispensed onto a top surface of the lead frame, MRAM die and magnetic shield such that the encapsulating material covers the MRAM die and the magnetic shield. The encapsulating material is then cured.
1 . A method of packaging a semiconductor die, comprising the steps of:
providing a lead frame having a die pad and lead fingers;
attaching a semiconductor die to the die pad;
electrically connecting bond pads of the semiconductor die to the lead fingers of the lead frame;
attaching a pre-formed magnetic shield to a top surface of the semiconductor die, wherein the magnetic shield is formed of a magnetic permeable filler material embedded in a base matrix; and
dispensing an encapsulating material onto a top surface of the lead frame, die and shield such that the encapsulating material covers the die and the shield.
2 . The method of packaging a semiconductor die of claim 1 , wherein the base matrix comprises at least one of an organic compound and a metal.
3 . The method of packaging a semiconductor die of claim 1 , wherein the magnetic permeable filler material comprises nickel (Ni).
4 . The method of packaging a semiconductor die of claim 1 , wherein the magnetic permeable filler material comprises NiFe.
5 . The method of packaging a semiconductor die of claim 1 , wherein the magnetic permeable filler material comprises NiFeMo.
6 . The method of packaging a semiconductor die of claim 1 , wherein the electrically connecting step comprises connecting the bond pads of the semiconductor die to the lead fingers of the lead frame with wires using a wire bonding process.
7 . The method of packaging a semiconductor die of claim 1 , wherein the electrically connecting step comprises directly connecting the bond pads of the semiconductor die to the lead fingers with flip-chip bumps.
8 . The method of packaging a semiconductor die of claim 1 , wherein the encapsulating material comprises epoxy.
9 . The method of packaging a semiconductor die of claim 1 , wherein the semiconductor die comprises a magnetoresistive random access memory (MRAM) device.
10 . A semiconductor device packaged in accordance with the method of claim 1 .
11 . A semiconductor device, comprising:
a lead frame with a die pad and lead fingers;
a semiconductor die attached to the die pad and electrically coupled to the lead fingers;
a magnetic shield attached to a top surface of the semiconductor die, wherein the magnetic shield comprises a composite material formed a magnetic permeable filler material dispersed within an organic matrix; and
an encapsulating material covering the lead frame, the semiconductor die and the magnetic shield.
12 . The semiconductor device of claim 11 , wherein the semiconductor die comprises a magnetoresistive random access memory (MRAM) die.
13 . The semiconductor device of claim 11 , wherein the magnetic permeable filler material comprises metal particles configured to provide electromagnetic shielding for the semiconductor die.
14 . The semiconductor device of claim 11 , wherein the encapsulating material comprises epoxy.
15 . The semiconductor device of claim 11 , wherein the semiconductor die is electrically coupled to the lead frame via bond wires.
16 . The semiconductor device of claim 11 , wherein the semiconductor die is electrically coupled to the lead frame via a plurality of electrically conductive bumps.
17 . A method of packaging a magnetoresistive random access memory (MRAM) die, comprising the steps of:
providing a lead frame having a die pad and lead fingers;
attaching the MRAM die to the die pad with a first die attach adhesive;
electrically connecting bond pads of the MRAM die to the lead fingers of the lead frame with wires using a wire bonding process;
attaching a pre-formed composite magnetic shield to a top surface of the MRAM die with a second die attach adhesive, wherein the magnetic shield comprises a magnetic permeable filler material dispersed within an organic matrix;
dispensing an encapsulating material onto a top surface of the lead frame, MRAM die and magnetic shield such that the encapsulating material covers the MRAM die and the magnetic shield; and
curing the encapsulating material.
18 . The method of packaging a semiconductor die of claim 17 , further comprising forming a plurality of semiconductor packages on a common substrate, and wherein following the curing step, the plurality of semiconductor packages are singulated to form individual semiconductor packages.
19 . The method of packaging a semiconductor die of claim 17 , wherein the first and second die attach adhesives comprise epoxy.
20 . The method of packaging a semiconductor die of claim 17 , wherein the magnetic filler material comprises metal particles.