Semiconductor device

1. A semiconductor device, comprising:

a semiconductor substrate;

an element-forming region including a semiconductor element formed on the semiconductor substrate;

a buried electrode plug formed so as to penetrate through the semiconductor substrate; and

a trench-type electrode buried in a trench within the semiconductor substrate positioned between the element-forming region and the buried electrode plug,

wherein the element-forming region comprises:

an active region defined by an isolation region; and

a MOS transistor including the active region, and

wherein the trench comprises:

a first portion deeper than the isolation region; and

a second portion having the same depth as depth of the isolation region and communicating with the first portion.

2. The semiconductor device according to claim 1 ,

wherein the trench is positioned so as to surround the element-forming region.

3. The semiconductor device according to claim 2 , further comprising an additional trench surrounding the trench within the semiconductor substrate.

4. The semiconductor device according to claim 1 , further comprising an additional trench within the semiconductor substrate, each of the additional trench and the trench located between the element-forming region and the buried electrode plug.

5. The semiconductor device according to claim 1 ,

wherein the trench is positioned so as to surround the buried electrode plug.

6. The semiconductor device according to claim 1 ,

wherein the trench-type electrode is continuously provided in the first and second portions of the trench,

the semiconductor device further comprises a contact plug connected to the trench-type electrode positioned in the second portion, and

a potential is applicable to the contact plug.

7. The semiconductor device according to claim 6 ,

wherein the trench-type electrode positioned in the second portion is shallower than the isolation region.

8. A semiconductor device comprising a plurality of semiconductor chips,

wherein each semiconductor chip comprises:

a semiconductor substrate;

an element-forming region including a semiconductor element formed on the semiconductor substrate;

a buried electrode plug formed so as to penetrate through the semiconductor substrate; and

a trench-type electrode buried in a trench within the semiconductor substrate positioned between the element-forming region and the buried electrode plug,

wherein the semiconductor chips are connected to each other through the buried electrode plugs,

wherein the element-forming region comprises:

an active region defined by an isolation region; and

a MOS transistor including the active region, and

wherein the trench comprises:

a first portion deeper than the isolation region; and

a second portion having the same depth as depth of the isolation region and communicating with the first portion.

9. The semiconductor device according to claim 8 ,

wherein the trench of each semiconductor chip is positioned so as to surround the element-forming region.

10. The semiconductor device according to claim 9 ,

wherein a plurality of the trenches are positioned so as to surround the element-forming region in each semiconductor chip.

11. The semiconductor device according to claim 8 ,

wherein a plurality of the trenches segmentalized from each other are positioned between the element-forming region and the buried electrode plug in each semiconductor chip.

12. The semiconductor device according to claim 8 ,

wherein the trench of each semiconductor chip is positioned so as to surround the buried electrode plug.

13. The semiconductor device according to claim 8 ,

wherein the trench-type electrode is continuously provided in the first and second portions of the trench,

the semiconductor device further comprises a contact plug connected to the trench-type electrode positioned in the second portion, and

a potential is applicable to the contact plug.

14. The semiconductor device according to claim 13 ,

wherein the trench-type electrode positioned in the second portion is shallower than the isolation region.

15. A semiconductor device, comprising:

a semiconductor substrate having a trench;

an element-forming region including a semiconductor element on the semiconductor substrate;

an isolation region included in the element-forming region;

an active region surrounded with the isolation region;

a field effect transistor included in the active region;

a buried electrode plug penetrating through the semiconductor substrate;

a trench-shape electrode buried in the trench and located between the element-forming region and the buried electrode plug; and

first and second portions included in the trench-shape electrode and extending each other continuously, the first portion extending below a bottom of the isolation region, the second portion positioned above the bottom of the isolation region.

16. The semiconductor device according to claim 15 ,

wherein the trench-shape electrode surrounds the element-forming region.

17. The semiconductor device according to claim 16 ,

further comprising an additional trench-shape electrode surrounding the trench-shape electrode in the semiconductor substrate.

18. The semiconductor device according to claim 15 ,

further comprising an additional trench-shape electrode, each of the additional trench-shape electrode and the trench-shape electrode located between the element-forming region and the buried electrode plug.

19. The semiconductor device according to claim 15 ,

wherein the trench-shape electrode surrounds the buried electrode plug.

20. The semiconductor device according to claim 15 , further comprising:

a contact plug connected to the second portion of the trench-shape electrode; and

a wiring connected to the contact plug.