Space-saving high-density modular data pod systems and energy-efficient cooling systems
A space-saving, high-density modular data center and an energy-efficient cooling system for a modular data center are disclosed. The modular data center includes a first cooling circuit including a primary cooling device and a plurality of modular data pods. Each modular data pod includes a plurality of servers, a heat exchange member coupled to the first cooling circuit and a second cooling circuit coupled to the heat exchange member and configured to cool the plurality of servers, the second cooling circuit including a secondary cooling device configured to cool fluid flowing through the second cooling circuit. Each modular data pod also includes an auxiliary enclosure containing at least a portion of a distributed mechanical cooling system, which is configured to trim the cooling performed by a central free-cooling system.
1. A modular data center, comprising:
a first cooling circuit including a primary cooling device;
a plurality of modular data pods, each modular data pod comprising:
a plurality of servers;
a heat exchange member coupled to the first cooling circuit; and
a second cooling circuit coupled to the heat exchange member and configured to cool the plurality of servers, the second cooling circuit including a secondary cooling device configured to cool fluid flowing through the second cooling circuit.
2. The modular data center according to claim 1 , wherein each modular data pod further comprises primary cooling coils in thermal communication with the plurality of servers.
3. The modular data center according to claim 1 , wherein the secondary cooling device is a mechanical cooling device configured to operate when the wet bulb temperature of the atmosphere associated with the modular data center exceeds a predetermined wet bulb temperature.
4. The modular data center according to claim 3 , wherein the mechanical cooling device includes a compression device configured to compress fluid flowing through the second cooling circuit.
5. The modular data center according to claim 1 , wherein the fluid flowing through the first cooling circuit is a glycol solution or water and wherein the fluid flowing through the second cooling circuit is a refrigerant.
6. The modular data center according to claim 1 , wherein each modular data pod further comprises:
a second heat exchange member coupled to the first cooling circuit; and
a third cooling circuit coupled to the second heat exchange member and configured to cool the plurality of servers, the third cooling circuit including a second secondary cooling device configured to cool fluid flowing through the third cooling circuit.
7. The modular data center according to claim 6 , wherein each modular data pod further comprises secondary cooling coils in thermal communication with the plurality of computer racks.
8. The modular data center according to claim 1 , wherein the primary cooling device is a free cooling device.
9. The modular data center according to claim 8 , wherein the free cooling device includes a fluid cooler or a cooling tower.
10. The modular data center according to claim 1 , further comprising a third cooling circuit coupled to the second cooling circuit, the third cooling circuit including a cooling fluid source and an expansion tank.
11. The modular data center according to claim 1 , wherein the heat exchange member is a condenser.
12. The modular data center according to claim 1 , wherein the first cooling circuit includes two supply lines and two return lines in a reverse-return configuration.
13. A cooling system for a modular data center, comprising:
a first cooling circuit including a primary cooling device;
a plurality of modular data pods, each modular data pod comprising:
an enclosure including a plurality of server racks;
a heat exchange member coupled to the first cooling circuit; and
a second cooling circuit coupled to the heat exchange member and configured to cool the enclosure, the second cooling circuit including a secondary cooling device configured to cool fluid flowing through the second cooling circuit.
14. The cooling system according to claim 13 , wherein the secondary cooling device is configured to cool a portion of a heat load within the enclosure that the primary cooling device cannot cool.
15. The cooling system according to claim 13 , wherein the secondary cooling device is configured to cool the portion of the heat load within the enclosure as a function of the atmospheric conditions.
16. The cooling system according to claim 13 , wherein the first and second cooling circuits are independent cooling circuits.
17. A modular data center, comprising:
a central cooling system;
a plurality of modular data pods, each modular data pod comprising:
a plurality of servers;
a heat exchange assembly coupled to the central cooling system, the heat exchange assembly configured to cool the plurality of servers; and
a distributed cooling system coupled to the heat exchange assembly.
18. The modular data center according to claim 17 , wherein the central cooling system is a free-cooling system and the distributed cooling system is a mechanical cooling system.
19. The modular data center according to claim 18 , wherein the distributed cooling system is configured to cool a portion of a heat load of the modular data pod that exceeds the cooling capacity of the free-cooling system.
20. The modular data center according to claim 17 , wherein the heat exchange assembly includes a heat exchange member and a cooling circuit in thermal communication with the heat exchange member, the cooling circuit further in thermal communication with the plurality of servers.