IP Library Granted Patent US 8,725,095
Granted Patent B2
US 8,725,095 · App. 13/339,139 · Granted May 13, 2014

Planar inverted-F antennas, and modules and systems in which they are incorporated

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Quick Facts
Patent No.
US 8,725,095
App. No.
13/339,139
Granted
May 13, 2014
Kind
B2
Abstract

An embodiment of an antenna includes a radiation frame and a planar inverted-F antenna (PIFA). The radiation frame has a frame shape that defines a central opening. The PIFA includes an antenna arm, a feed arm, and a shorting arm. A distal end of the shorting arm is conductively coupled with the radiation frame. The antenna may be coupled to a substrate of an RF module. The RF module may be included in a system that also includes a non-RF component that produces a signal for transmission. In such a system, the RF module is configured to receive the signal, convert the signal to an RF signal, and radiate the RF signal over an air interface.

Claims (46)

1. An antenna comprising:

a radiation frame having a frame shape that defines a central opening, wherein the radiation frame is formed from a first portion of a first metal layer;

a planar inverted-F antenna (PIFA) that includes an antenna arm, a feed arm, and a shorting arm, wherein the PIFA is formed from a second metal layer, and wherein a distal end of the shorting arm is conductively coupled with the radiation frame; and

a conductive structure formed from a second portion of the first metal layer, wherein the conductive structure is located within the central opening, and wherein the conductive structure comprises routing that provides at least a portion of a conductive path between the PIFA and an electrical component.

2. An antenna comprising:

a radiation frame having a frame shape that defines a central opening;

a planar inverted-F antenna (PIFA) that includes an antenna arm, a feed arm, and a shorting arm, wherein a distal end of the shorting arm is conductively coupled with the radiation frame;

a dielectric substrate suitable for mounting an electrical component, wherein the dielectric substrate has a first surface and an opposed, second surface, the radiation frame is formed on the first surface, the PIFA is formed on the second surface, and a size of the central opening is large enough for the electrical component to be coupled to a portion of the dielectric substrate that coincides with the central opening in the radiation frame; and

a conductive structure between the first surface and the second surface, which conductively couples the distal end of the shorting arm with the radiation frame.

3. The antenna of claim 1 , wherein the radiation frame has a rectangular frame shape.

4. The antenna of claim 1 , wherein the radiation frame has a non-rectangular frame shape.

5. The antenna of claim 1 , wherein the radiation frame including the central opening occupies a total area, and wherein a central opening area is in a range of about 20 percent to about 80 percent of the total area.

6. The antenna of claim 1 , wherein the radiation frame has a frame width in a range of about 5 percent to about 30 percent of a length of the radiation frame.

7. The antenna of claim 1 , wherein the radiation frame is formed from conductive material that is continuous around an entirety of the radiation frame.

8. The antenna of claim 1 , wherein the radiation frame is non-continuous in that the radiation frame includes a non-conductive gap.

9. The antenna of claim 1 , wherein the radiation frame has a dimension that is less than about one quarter of an operating wavelength (λ/4).

10. An antenna comprising:

a radiation frame having a frame shape that defines a central opening, wherein the radiation frame is completely closed and is formed from a conductive material that is continuous around an entirety of the radiation frame; and

a planar inverted-F antenna (PIFA) that includes an antenna arm, a feed arm, and a shorting arm, wherein a distal end of the shorting arm is conductively coupled with the radiation frame, wherein the radiation frame and the PIFA are formed in a same metal layer.

11. A radio frequency (RF) module comprising:

a substrate;

an antenna coupled to the substrate, and having

a radiation frame with a frame shape that defines a central opening, wherein the radiation frame forms a first portion of a first metal layer of the module, and

a planar inverted-F antenna that includes an antenna arm, a feed arm, and a shorting arm, wherein the planar inverted-F antenna is formed from a second metal layer, and wherein a distal end of the shorting arm is conductively coupled with the radiation frame; and

a conductive structure formed from a second portion of the first metal layer, wherein the conductive structure is located within the central opening, and wherein the conductive structure comprises routing that provides at least a portion of a conductive path between the planar inverted-F antenna and an electrical component.

12. The module of claim 11 , further comprising:

a conductive via between the conductive structure and the second metal layer of the module.

13. A radio frequency (RF) module comprising:

a substrate;

an antenna coupled to the substrate, and having

a radiation frame with a frame shape that defines a central opening, wherein the radiation frame forms a first portion of a first metal layer of the module, and

a planar inverted-F antenna that includes an antenna arm, a feed arm, and a shorting arm, wherein a distal end of the shorting arm is conductively coupled with the radiation frame;

a first conductive structure in the central opening, wherein the first conductive structure forms a second portion of the first metal layer;

a first electrical component coupled to a portion of the substrate that coincides with the central opening; and

a second electrical component, and

wherein the first conductive structure comprises routing that provides at least a portion of a conductive path between the first electrical component and the second electrical component.

14. The module of claim 13 , wherein the first electrical component is coupled to a second conductive structure on a first surface of the substrate, and the substrate includes at least one dielectric layer between the first surface and the first metal layer, wherein the module further comprises:

a conductive via between the first conductive structure and the second conductive structure.

15. The module of claim 13 , wherein the first electrical component is selected from a group comprising a transmitter, a receiver, and a transceiver.

16. A system comprising:

a non-RF component that produces a signal for transmission; and

an RF module electrically coupled to but physically distinct from the non-RF component, wherein the module is configured to receive the signal, convert the signal to an RF signal, and radiate the RF signal over an air interface, and wherein the module includes a substrate, a conductive structure, and an antenna coupled to the substrate, and wherein the antenna includes

a radiation frame with a frame shape that defines a central opening, wherein the radiation frame forms a first portion of a first metal layer of the module, and

a planar inverted-F antenna that includes an antenna arm, a feed arm, and a shorting arm, wherein the planar inverted-F antenna is formed from a second metal layer of the module, and wherein a distal end of the shorting arm is conductively coupled with the radiation frame, and

wherein the conductive structure is formed from a second portion of the first metal layer, the conductive structure is located within the central opening, and the conductive structure comprises routing that provides at least a portion of a conductive path between the planar inverted-F antenna and an electrical component.

17. The system of claim 16 , wherein the non-RF component and the module are coupled to a printed circuit board.

Assignments (31)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0241. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 5, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041260/0850 →
MERGER Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040652/0241 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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SECURITY AGREEMENT Recorded Nov 6, 2013
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SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 12, 2012
From: LI, QIANG; ADAMS, JON T.; HARTIN, OLIN L.
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