Extendable-arm antennas, and modules and systems in which they are incorporated
View Patent ↗Embodiments of antennas and radio frequency (RF) modules include a substrate, a first antenna arm coupled to the substrate, and a first conductive structure between a distal end of the first antenna arm and a bottom surface of the substrate. An embodiment of a system includes a first substrate, a first conductive structure on a top surface of the first substrate, and an antenna coupled to the top surface of the first substrate. The antenna includes a second substrate, a first antenna arm coupled to the second substrate, and a second conductive structure having a proximal end and a distal end. The proximal end of the second conductive structure is coupled to a distal end of the first antenna arm, and the distal end of the second conductive structure extends to a bottom surface of the second substrate and is coupled to the first conductive structure on the first substrate.
1. A radio frequency (RF) module comprising:
a substrate; and
a planar, inverted-F antenna including
a first antenna arm formed on a top surface of the substrate,
a first conductive structure coupled to a distal end of the first antenna arm at the top surface of the substrate and extending to a bottom surface of the substrate, wherein a portion of the first conductive structure at the bottom surface of the substrate is configured to be coupled to a second conductive structure on a separate substrate,
a feed arm coupled to a proximal end of the first antenna arm,
a ground structure, and
a shorting arm coupled between the first antenna arm and the ground structure.
2. The module of claim 1 , wherein the first antenna arm has a length in a range of about 10 millimeters to about 50 millimeters.
3. The module of claim 1 , wherein the first conductive structure comprises:
one or more conductive vias extending through the substrate.
4. The module of claim 1 , wherein the first conductive structure comprises:
a planar conductive interconnect at an edge of the substrate.
5. The module of claim 1 , wherein the module further comprises:
encapsulation material overlying the first antenna arm and the top surface of the substrate.
6. A radio frequency (RF) module comprising:
a substrate; and
a dipole antenna including
a first antenna arm formed on a top surface of the substrate,
a first conductive structure coupled to a distal end of the first antenna arm at the top surface of the substrate and extending to a bottom surface of the substrate,
a second antenna arm formed on the top surface of the substrate, and
a second conductive structure coupled to a distal end of the second antenna arm at the top surface of the substrate and extending to the bottom surface of the substrate.
7. The module of claim 6 , wherein the first conductive structure is selected from a group consisting of a via, a plurality of vias, a planar conductive interconnect, and a combination thereof.
8. The module of claim 6 , wherein the module further comprises: an electrical component coupled to the top surface of the substrate, wherein the electrical component is selected from a group comprising a transmitter, a receiver, and a transceiver.
9. The module of claim 8 , wherein the module further comprises:
encapsulation material overlying the first antenna arm, the electrical component, and the top surface of the substrate.
10. A system comprising:
a first substrate;
a first conductive structure on a top surface of the first substrate; and
an antenna formed on a second substrate that is distinct from the first substrate and coupled to the top surface of the first substrate, wherein the antenna includes
a first antenna arm coupled to the second substrate, and
a second conductive structure having a proximal end and a distal end, wherein the proximal end of the second conductive structure is coupled to a distal end of the first antenna arm, and the distal end of the second conductive structure extends to a bottom surface of the second substrate and is coupled to the first conductive structure on the first substrate.
11. The system of claim 10 , wherein the first conductive structure is configured to increase an electrical length of the first antenna arm.
12. The system of claim 10 , wherein the first conductive structure comprises a planar conductive structure.
13. The system of claim 10 , wherein the second conductive structure is selected from a group consisting of a via, a plurality of vias, a planar conductive structure, and a combination thereof.
14. The system of claim 10 , wherein the antenna is a planar, inverted-F antenna, and the antenna further comprises:
a ground structure;
a feed arm coupled to the first antenna arm; and
a shorting arm coupled between the first antenna arm and the ground structure.
15. The system of claim 10 , further comprising:
a non-RF component coupled to the first substrate that produces a signal for transmission; and
a set of electrical components coupled to the second substrate and to the first antenna arm, wherein the set of electrical components is configured to receive the signal, convert the signal to an RF signal, and provide the RF signal to the first antenna arm for radiation over an air interface.
16. A system comprising:
a first substrate;
a first conductive structure on a top surface of the first substrate;
a second conductive structure on the top surface of the first substrate; and
a dipole antenna coupled to the top surface of the first substrate, wherein the dipole antenna includes
a second substrate,
a first antenna arm coupled to the second substrate,
a third conductive structure having a proximal end and a distal end, wherein the proximal end of the third conductive structure is coupled to a distal end of the first antenna arm, and the distal end of the third conductive structure extends to a bottom surface of the second substrate and is coupled to the first conductive structure on the first substrate,
a second antenna arm coupled to the second substrate, and
a fourth conductive structure having a proximal end and a distal end, wherein the proximal end of the fourth conductive structure is coupled to a distal end of the second antenna arm, and the distal end of the fourth conductive structure extends to the bottom surface of the second substrate and is coupled to the second conductive structure on the first substrate.
17. A system comprising:
a dipole antenna that includes
a first substrate,
a first antenna arm formed on a surface of the first substrate,
a second antenna arm formed on the surface of the first substrate, and
a dielectric layer formed over the surface of the first substrate and covering the first antenna arm and the second antenna arm and having a first opening that exposes a distal end of the first antenna arm, and a second opening that exposes a distal end of the second antenna arm;
a second substrate; and
a first conductive structure on the top surface of the second substrate, wherein the distal end of the first antenna arm is coupled to the first conductive structure through the first opening in the dielectric layer.
18. The system of claim 17 , further comprising:
a second conductive structure on a top surface of the second substrate, and
wherein the distal end of the second antenna arm is coupled to the second conductive structure through the second opening in the dielectric layer.
19. A system comprising:
an antenna that includes
a first substrate,
a first antenna arm formed on a surface of the first substrate, and
a dielectric layer formed over the surface of the first substrate and covering the first antenna arm and having a first opening that exposes a distal end of the first antenna arm, wherein the antenna is a planar, inverted-F antenna, and the antenna further comprises:
a ground structure;
a feed arm coupled to the first antenna arm; and
a shorting arm coupled between the first antenna arm and the ground structure.