IP Library › Granted Patent US 9,076,706
Granted Patent B2
US 9,076,706 · App. 13/343,976 · Granted Jul 7, 2015

Image sensor based on depth pixel structure

Inventors: Seong Jin Kim (Seoul, KR); Sang Wook Han (Busan, KR); Albert Theuwissen (Bree, BE)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H01L27/14641H01L27/14603H01L27/14612
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Quick Facts
Patent No.
US 9,076,706
App. No.
13/343,976
Granted
Jul 7, 2015
Kind
B2
Abstract

An image sensor based on a depth pixel structure is provided. The image sensor may include a pixel including a photodiode, and the photodiode may include a transfer gate to transfer, to a floating diffusion node, an electron generated by a light reflected from an object.

Claims (79)

1. An image sensor comprising:

a pixel structure including

a photodiode, and

transfer gates located in each side of the photodiode,

wherein the transfer gate include a first transfer gate and a second transfer gate,

wherein the first transfer gate is configured to transfer an electron generated during a first time interval to a first floating diffusion node, and the second transfer gate is configured to transfer an electron generated during a second time interval to a second floating diffusion node, and

wherein the first time interval and the second time interval have difference phases.

2. The image sensor of claim 1 , wherein the transfer gates comprise the first transfer gate located in one half of the sides of the photodiode, and the second transfer gate located in the other half of the sides of the photodiode.

3. The image sensor of claim 2 , wherein

the first transfer gate is adjacent to the first floating diffusion node used to accumulate an electron generated by a light reflected from an object, and

the second transfer gate is adjacent to the second floating diffusion node used to accumulate an electron generated by a light reflected from an object.

4. The image sensor of claim 1 , wherein

a phase difference between the first time interval and the second time interval is 180° .

5. The image sensor of claim 1 , wherein the photodiode comprises a pinned photodiode.

6. An image sensor comprising:

a pixel structure comprising

a photodiode, and

different transfer gates respectively located in two sides of the photodiode,

wherein the different transfer gates include a first transfer gate and a second transfer gate, and

wherein the first transfer gate is configured to transfer an electron to a first floating diffusion node or the second transfer gate is configured to transfer the electron to a second floating diffusion node, based on whether the first transfer gate and the second transfer gate are turned on or off.

7. The image sensor of claim 6 , wherein the different transfer gates comprise the first transfer gate located in one side of the two sides, and the second transfer gate located in the other side of the two sides.

8. The image sensor of claim 7 , wherein

the first transfer gate is adjacent to the first floating diffusion node used to accumulate an electron generated by a light reflected from an object, and

the second transfer gate is adjacent to the second floating diffusion node used to accumulate an electron generated by a light reflected from an object.

9. The image sensor of claim 6 , wherein

the electron is generated by a light reflected from an object.

10. An image sensor comprising:

a pixel structure comprising

a photodiode, and

different transfer gates respectively located in two facing sides of the photodiode,

wherein the different transfer gates include a first transfer gate and a second transfer gate, and

wherein the first transfer gate is configured to transfer an election to a first floating diffusion node or the second transfer gate is configured to transfer the electron to a second floating diffusion node, based on whether the first transfer gate and the second transfer gate are turned on or off.

11. The image sensor of claim 10 , wherein

the different transfer gates comprise the first transfer gate located in one side of the two facing sides, and the second transfer gate located in the other side of the two facing sides, and

the first transfer gate and the second transfer gate are formed to protrude to a center portion of the photodiode.

12. The image sensor of claim 11 , wherein

the first transfer gate is adjacent to the first floating diffusion node used to accumulate an electron generated by a light reflected from an object, and

the second transfer gate is adjacent to the second floating diffusion node used to accumulate an electron generated by a light reflected from an object.

13. The image sensor of claim 10 , wherein

the electron is generated by a light reflected from an object, and is moved to the center portion of the photodiode.

14. An image sensor comprising:

a pixel structure including

a photodiode, and

a transfer gate and a floating diffusion node dividing the photodiode into at least two segments,

wherein pixel structures sharing a floating diffusion node are deviated from each other so that pixel structures have difference phases.

15. The image sensor of claim 14 , wherein the floating diffusion node is smaller in size by a preset ratio than the transfer gate.

16. The image sensor of claim 14 , wherein

the image sensor comprises a plurality of the pixel structures that share floating diffusion nodes.

17. The image sensor of claim 16 , wherein

the image sensor is configured to individually operates the plurality of pixel structures in a color mode in which a color image is sensed, and

the image sensor is configured to operates the plurality of pixel structures as a single pixel in a depth mode in which a depth image is sensed.

18. The image sensor of claim 16 , wherein pixel structures sharing a floating diffusion node are deviated from each other by ½ pixel so that a phase difference is 180°.

19. The image sensor of claim 14 , wherein either a same floating diffusion node or different floating diffusion nodes are located in a boundary of a pixel comprising the pixel structure.

20. An image sensor, comprising:

a plurality of pixel structures to enable a transfer gate to transfer, to a floating diffusion node, an electron generated by a light reflected from an object,

wherein the plurality of pixel structures each include a photodiode, and share the floating diffusion node with each other,

wherein the transfer gate include a first transfer gate and a second transfer gate,

wherein the first transfer gate is configured to transfer an electron generated during a first time interval to a first floating diffusion node, and the second transfer gate is configured to transfer an electron generated during a second time interval to a second floating diffusion node, and

wherein the first time internal and the second time have difference phases.

21. An image sensor, comprising:

pixels corresponding to an odd row, and pixels corresponding to an even row, the pixels enabling a transfer gate to transfer, to a floating diffusion node, an electron generated by a light reflected from an object,

wherein the pixels each include a photodiode, and the pixels corresponding to the odd row and the pixels corresponding to the even row share the floating diffusion node with each other.

22. The image sensor of claim 21 , wherein a floating diffusion node shared with a pixel on a left side of each of the pixels is different from a floating diffusion node shared with a pixel on a right side of each of the pixels.

23. An apparatus comprising:

a pixel structure including a photodiode having first and second sides, and transfer gates located in the first and second sides,

wherein the transfer gate include a first transfer gate and a second transfer gate,

wherein the first transfer gate is configured to transfer an electron generated during a first time interval to a first floating diffusion node, and the second transfer gate is configured to transfer an electron generated during a second time interval to a second floating diffusion node, and

wherein the first time internal and the second time have difference phases.

24. An apparatus as in claim 23 , wherein the transfer gates include the first transfer gate located in the first side and the second transfer gate located in the second side.

25. An apparatus as in claim 24 , wherein the pixel structure is a diamond-type pixel structure.

26. An apparatus as in claim 23 , wherein

the photodiode includes third and fourth sides, and

transfer gates located in the third and fourth sides.

27. An apparatus as in claim 23 , wherein the photodiode includes third and fourth sides, and the transfer gates include a first transfer gate located in the first and second sides, and a second transfer gate located in the third and fourth sides.

28. An apparatus as in claim 27 , wherein the first and second sides are adjacent to each other, and the third and fourth sides are adjacent to each other.

29. An apparatus as in claim 27 , wherein the pixel structure is a cover-type pixel structure.

30. An apparatus as in claim 23 , wherein the pixel structure is a cover-type pixel structure or a diamond-type pixel structure.

31. An apparatus as in claim 30 , wherein the apparatus is an image sensor.

32. An apparatus as in claim 23 , wherein the apparatus is an image sensor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 16, 2012
From: KIM, SEONG JIN; HAN, SANG WOOK; THEUWISSEN, ALBERT
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 027976/0104 →
Priority Claims (2)
KR 10-2011-0001758 · Jan 7, 2011 · national
KR 10-2011-0146125 · Dec 29, 2011 · national
Continuity (2)
Provisional Application 61493038 · Jun 3, 2011
Related Publication 20120175685A1 · Jul 12, 2012