IP Library Granted Patent US 8,728,964
Granted Patent B2
US 8,728,964 · App. 13/348,073 · Granted May 20, 2014

Glass composition with low coefficient of thermal expansion, and glass fiber produced from same

Inventors: Sudhendra V. Hublikar (Martinez, GA); Robert L. Hausrath (Aiken, SC); Anthony V. Longobardo (Johnston, SC)
Assignee: AGY Holding Corp.
C03C3/091C03C13/00H05K1/0306
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Quick Facts
Patent No.
US 8,728,964
App. No.
13/348,073
Granted
May 20, 2014
Kind
B2
Abstract

The present disclosure relates to a glass composition having a low thermal expansion coefficient, specifically, a glass composition comprising about 55 to less than 64 weight percent of silicon oxide, about 15 to about 30 weight percent of aluminum oxide, about 5 to about 15 weight percent of magnesium oxide, about 3 to about 10 weight percent boron oxide, about 0 to about 11 weight percent calcium oxide, and about 0 to about 2 weight percent of alkali oxide, the remainder being trace compounds of less than about 1 weight percent, is provided. Glass fibers and composite articles formed therefrom are also provided.

Claims (87)

1. A glass composition comprising the following compounds in the listed weight percent:

SiO 2

  60-62.9

Al 2 O 3

22.0-23.7

MgO

 8.6-10.0

B 2 O 3

4.2-10 

Li 2 O

<2

Na 2 O

<0.1

CaO

<1

K 2 O

<0.1

with the residual elemental composition being less than 1 weight percent.

2. The glass composition of claim 1 , wherein the weight percent ratio of Al 2 O 3 /MgO is greater than 2.3.

3. The glass composition of claim 1 , wherein the glass composition has a liquids temperature between 1320° C. to 1370° C.

4. The glass composition of claim 1 , wherein a glass produced therefrom has a CTE of between 3.0 and 3.6×10 −6 /° C.

5. A glass fiber product manufactured by using the glass composition of claim 1 , being substantially hollow-filament free.

6. An insulating polymer binder or matrix for a printed circuit board assembly comprising a polymer binder or matrix comprising a glass fiber of the glass composition of claim 1 .

7. A printed circuit board comprising an insulating polymer binder or matrix comprising a glass fiber of the glass composition of claim 1 and a circuit pattern formed thereon.

8. A windshield, windscreen, canopy, or transparency comprising the glass fiber of claim 1 .

9. A glass composition comprising the following compounds in the listed weight percent:

SiO 2

>60 and <62

Al 2 O 3

>17 and <23

MgO

>8.5 and <10 

B 2 O 3

 >5 and <10

Li 2 O

<2

Na 2 O

<0.05

CaO

<1

K 2 O

<0.05

with the residual elemental cot position being less than 1 weight percent.

10. A glass fiber product manufactured by using the glass composition of claim 9 , being substantially hollow-filament free.

11. An insulating polymer binder or matrix for a printed circuit board assembly comprising a polymer binder or matrix comprising a glass fiber of the glass composition of claim 9 .

12. A printed circuit board comprising an insulating polymer binder or matrix comprising a glass fiber of the glass composition of claim 9 and a circuit pattern formed thereon.

13. A transparent fiberglass reinforced composite article comprising a glass fiber composition comprising the following compounds in the listed weight percent:

SiO 2

  60-62.9

Al 2 O 3

22.0-23.7

MgO

 8.6-10.0

B 2 O 3

4.2-10 

Li 2 O

<2

Na 2 O

<0.1

CaO

<1

K 2 O

<0.1

the remainder of said glass fiber composition being trace compounds of less than 1 weight percent; and

a polymer matrix.

14. The transparent fiberglass reinforced composite article of claim 13 , wherein the weight percent ratio of Al 2 O 3 /MgO is greater than 2.3.

15. A windshield, windscreen, canopy, or transparency comprising the transparent fiberglass reinforced composite article of claim 13 .

16. The transparent fiberglass reinforced composite article of claim 13 wherein the glass fiber composition has an index of refraction that differs from that of the polymer matrix by less than 0.005.

17. The transparent fiberglass reinforced composite article comprising a class fiber composition comprising the following compounds in the listed weight percent:

SiO 2

>60 and <62

Al 2 O 3

>17 and <23

MgO

>8.5 and <10 

B 2 O 3

 >5 and <10

Li 2 O

<2

Na 2 O

<0.05

CaO

<1

K 2 O

<0.05

with the residual elemental composition being less than 1 weight percent; and

a polymer matrix.

Assignments (11)
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2020
From: WELLS FARGO BANK, NATIONAL ASSOCIATION
To: AGY HOLDING CORP.
Reel/Frame 053836/0520 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2020
From: U.S. BANK NATIONAL ASSOCIATION
To: AGY HOLDING CORP.
Reel/Frame 053836/0470 →
SECURITY INTEREST Recorded Sep 21, 2020
From: AGY HOLDING CORP.
To: TCW ASSET MANAGEMENT COMPANY LLC
Reel/Frame 053836/0429 →
PATENT SECURITY AGREEMENT Recorded Jul 24, 2015
From: AGY HOLDING CORP.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 036180/0047 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEES' AND ASSIGNOR'S NAME PREVIOUSLY RECORDED ON REEL 035904 FRAME 0070. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST IN PATENTS. Recorded Jun 26, 2015
From: UBS AG
To: AGY HOLDING CORP.; AGY AIKEN LLC; AGY PA OPERATIONS LLC F/K/A AGY HUNTINGDON LLC
Reel/Frame 036080/0313 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Jun 12, 2015
From: AGY HOLDING CORP.; AGY AIKEN LLC; AGY PA OPERATIONS LLC F/K/A AGY HUNTINGDON LLC
To: UBS AG
Reel/Frame 035904/0070 →
RELEASE OF SECURITY INTEREST Recorded Jun 10, 2015
From: UBS AG, STAMFORD BRANCH, AS AGENT
To: AGY HOLDING CORP.; AGY AIKEN LLC; AGY HUNTINGDON LLC
Reel/Frame 035880/0051 →
PATENT SECURITY AGREEMENT Recorded Jul 1, 2013
From: AGY HOLDING CORP.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 030744/0838 →
PATENT SECURITY AGREEMENT Recorded Jul 1, 2013
From: AGY HOLDING CORP.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 030744/0823 →
SECURITY AGREEMENT Recorded May 13, 2013
From: AGY HOLDING CORP.; AGY AIKEN LLC; AGY HUNTINGDON LLC
To: UBS AG, STAMFORD BRANCH, AS AGENT
Reel/Frame 030406/0847 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 3, 2012
From: HUBLIKAR, SUDHENDRA V.; HAUSRATH, ROBERT L.; LONGOBARDO, ANTHONY V.
To: AGY HOLDING CORPORATION
Reel/Frame 029067/0286 →
Continuity (2)
Provisional Application 61431712 · Jan 11, 2011
Related Publication 20120178610A1 · Jul 12, 2012