LED Package with Slanting Structure and Method of the Same
The LED package comprises a substrate with a first conductive type through-hole and a second conductive type through-hole through the substrate; a reflective layer formed on an upper surface of the substrate; a LED die having first conductive type pad and second conductive type pad, wherein the first conductive type pad is aligned with the first conductive type through-hole; a slanting structure of dielectric layer formed adjacent at least one side of the LED die for carrying conductive traces; a conductive trace formed on upper surface of the slanting structure to offer path between the second conductive type pad and the conductive type through-hole; and a refilling material within the first conductive type through-hole and second conductive type through-hole.
1 . A LED package comprising:
a substrate with a first conductive type through-hole and a second conductive type through-hole through said substrate;
a reflective layer formed on an upper surface of said substrate;
a LED die having first conductive type pad and second conductive type pad, wherein said first conductive type pad is aligned with said first conductive type through-hole, wherein said first conductive type pad and said second conductive type pad are respectively formed on lower and upper surfaces of said LED die;
a slanting structure formed adjacent at least one side of said LED die for carrying conductive traces; and
a conductive trace formed on upper surface of said slanting structure to offer path between said second conductive type pad of said LED die and said second conductive type through-hole of said substrate.
2 . The LED package of claim 1 , further comprising a refilling material within said first conductive type through-hole and said second conductive type through-hole.
3 . The LED package of claim 1 , further comprising a lens formed over said upper surface of said substrate to cover said LED die and said lens having phosphor material.
4 . The LED package of claim 1 , further comprising a first conductive type terminal pad under said substrate and coupled to said first conductive type pad; a second type terminal pad under said substrate and coupled to said second conductive type pad.
5 . The LED package of claim 1 , wherein said LED die comprises a P/N film formed over said LED die substrate.
6 . The LED package of claim 1 , wherein said reflective layer includes organic film, metal or alloy.
7 . The LED package of claim 6 , wherein said reflective layer comprises Ag, Al or Au.
8 . The LED package of claim 1 , wherein said LED die includes sapphire, Si, SiC or AlN substrate.
9 . The LED package of claim 2 , wherein said refilling material for said first conductive type through-hole and said second conductive type through-hole comprises Alumina, Titanium, Copper, Nickel or Silver.
10 . The LED package of claim 9 , wherein said refilling material comprises Cu/Ni/Au.