Biosensor capacitor
A biosensor capacitor, including a dielectric layer; a first metal layer in the dielectric layer; a passivation layer over the dielectric layer and the first metal layer; an isolation layer over the passivation layer; a probe DNA electrode connected to the first metal layer; a counter electrode connected to the first metal layer wherein the counter electrode forms an enclosure around the probe DNA electrode; and a bond pad connected to the first metal layer.
1. A biosensor capacitor, comprising:
a dielectric layer;
a first metal layer in the dielectric layer;
a first diffusion barrier including a refractory metal over the first metal layer;
a passivation layer over the dielectric layer and the first metal layer;
an isolation layer over the passivation layer;
a probe DNA electrode connected to the first metal layer;
a counter electrode connected to the first metal layer wherein the counter electrode forms an enclosure around the probe DNA electrode; and
a bond pad connected to the first metal layer.
2. The biosensor capacitor of claim 1 , wherein the probe DNA electrode includes a second metal layer and the counter electrode and the bond pad include aluminum, and wherein the second metal layer comprises one of gold, platinum, palladium, nickel, chromium, platinum palladium alloy, and nickel chromium alloy.
3. The biosensor capacitor of claim 1 , wherein the probe DNA electrode and the counter electrode include a second metal layer and the bond pad includes aluminum, and wherein the second metal layer comprises one of gold, platinum, palladium, nickel, chromium, platinum palladium alloy, and nickel chromium alloy.
4. The biosensor capacitor of claim 1 , wherein the probe DNA electrode includes a second metal layer and the counter electrode and the bond pad include copper, and wherein the second metal layer comprises one of gold, platinum, palladium, nickel, chromium, platinum palladium alloy, and nickel chromium alloy.
5. The biosensor capacitor of claim 4 , further comprising:
a second diffusion barrier including a refractory metal over the counter electrode; and
a third metal layer over the second diffusion barrier, wherein the third metal layer comprises one of gold, platinum, palladium, nickel, chromium, platinum palladium alloy, and nickel chromium alloy.
6. The biosensor capacitor of claim 1 , further comprising:
a wire bond or solder ball connection to the bond pad.
7. A method, comprising:
forming a bond pad via, a counter electrode via, and a probe DNA electrode via through an isolation layer and a passivation layer to a first metal layer in a dielectric layer;
forming a first diffusion barrier in each via over the first metal layer;
forming a probe DNA electrode by forming a second metal layer over the first diffusion barrier in the probe DNA electrode via;
forming a counter electrode in the counter electrode via, wherein the counter electrode forms an enclosure around the probe DNA electrode via; and
forming a bond pad in the bond pad via.
8. The method of claim 7 , wherein the first diffusion barrier comprises cobalt-tungsten-phosphide, tantalum, tantalum nitride, molybdenum, and nickel or alloys thereof.
9. The method of claim 7 , wherein the second metal layer comprises one of gold, platinum, palladium, nickel, chromium, platinum palladium alloy, and nickel chromium alloy and the counter electrode and the bond pad include aluminum.
10. The method of claim 7 , wherein the second metal layer comprises one of gold, platinum, palladium, nickel, chromium, platinum palladium alloy, and nickel chromium alloy and the counter electrode includes gold and the bond pad includes aluminum.
11. The method of claim 7 , wherein the second metal layer comprises one of gold, platinum, palladium, nickel, chromium, platinum palladium alloy, and nickel chromium alloy and the counter electrode and the bond pad include copper.
12. The method of claim 11 , further comprising:
forming a second diffusion barrier over the counter electrode; and
forming a third metal layer over the second diffusion barrier, wherein the third metal layer one of gold, platinum, palladium, nickel, chromium, platinum palladium alloy, and nickel chromium alloy.
13. The method of claim 7 , further comprising:
forming a wire bond or a solder ball connection to the bond pad.
14. A biosensor capacitor, comprising:
a dielectric layer;
a first metal layer in the dielectric layer;
a passivation layer over the dielectric layer and the first metal layer;
an isolation layer over the passivation layer
a probe DNA electrode including copper connected to the first metal layer;
a counter electrode including copper connected to the first metal layer;
a first diffusion barrier including a refractory metal over the counter electrode and the probe DNA electrode;
a second metal layer over the first diffusion barrier; and
a bond pad including copper connected to the first metal layer.
15. The biosensor capacitor of claim 14 , wherein the first diffusion barrier comprises cobalt-tungsten-phosphide, tantalum, tantalum nitride, molybdenum, and nickel or alloys thereof.
16. The biosensor capacitor of claim 14 , further comprising:
a diffusion barrier including a refractory metal over the counter electrode, the probe DNA electrode, and the bond pad; and
a third metal layer over the diffusion barrier.
17. The biosensor capacitor of claim 16 , wherein the diffusion barrier comprises cobalttungsten-phosphide, tantalum, tantalum nitride, molybdenum, and nickel or alloys thereof.
18. The biosensor capacitor of claim 14 , further comprising:
a wire bond or solder ball connection to the bond pad.