IP Library › Granted Patent US 9,396,975
Granted Patent B2
US 9,396,975 · App. 13/355,877 · Granted Jul 19, 2016

Liquid treatment apparatus and method

Inventors: Jiro Higashijima (Koshi, JP); Norihiro Itoh (Koshi, JP)
Assignee: Tokyo Electron Limited
H01L21/67051H01L21/68707H01L21/68728H01L21/68785H01L21/68792
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Quick Facts
Patent No.
US 9,396,975
App. No.
13/355,877
Granted
Jul 19, 2016
Kind
B2
Abstract

A liquid treatment apparatus includes a substrate retaining unit, a rotational driving unit configured to rotate the substrate retaining unit; and a nozzle disposed below a lower surface of the substrate, the nozzle having first ejection ports provided to eject a chemical liquid and second ejection ports provided to eject a rinsing fluid towards the lower surface of the substrate. The nozzle comprises a first portion and a second portion each extending from a position opposing to a peripheral portion of the substrate towards a position opposing to a central portion of the substrate. At least part of the first ejection ports are arranged in the first portion. At least part of the second ejection ports are arranged in the second portion. The first portion and the second portion are arranged to form a V-shaped figure.

Claims (13)

1. A liquid treatment apparatus comprising:

a substrate retaining unit comprising a retaining member configured to hold a peripheral edge of a substrate to retain the substrate horizontally;

a rotational driving unit configured to rotate the substrate retaining unit; and

a nozzle disposed below a lower surface of the substrate retained by the substrate retaining unit, the nozzle comprising a plurality of first ejection ports provided to eject a chemical liquid towards the lower surface of the substrate retained by the substrate retaining unit and a plurality of second ejection ports provided to eject a rinsing fluid towards the lower surface of the substrate retained by the substrate retaining unit;

wherein:

the nozzle comprises a first portion extending from a position opposing to a peripheral portion of the substrate towards a position opposing to a central portion of the substrate retained by the substrate retaining unit, the plurality of first ejection ports are arranged between a position opposing to a peripheral portion of the substrate towards a position opposing to a central portion of the substrate retained by the substrate retaining unit, and at least part of the plurality of first ejection ports are arranged in the first portion;

the nozzle comprises a second portion extending from a position opposing to a peripheral portion of the substrate towards a position opposing to a central portion of the substrate retained by the substrate retaining unit, the plurality of second ejection ports are arranged between a position opposing to a peripheral portion of the substrate towards a position opposing to a central portion of the substrate retained by the substrate retaining unit, and at least part of the plurality of second ejection ports are arranged in the second portion;

the first portion and the second portion are arranged to form a V-shaped figure; and

the first portion is disposed at an angular position advanced through an angle from the second portion in a rotating direction of the substrate rotated by the rotational driving unit.

2. The liquid treatment apparatus according to claim 1 , wherein the angle is an acute angle.

3. The liquid treatment apparatus according to claim 1 , wherein each of the first ejection ports is configured to eject the chemical liquid towards the lower substrate surface in a direction inclined to the rotating direction of the substrate rotated by the rotation driving unit.

4. The liquid treatment apparatus according to claim 1 , wherein each of the second ejection ports is configured to eject, as the rinsing fluid, at least one of deionized water (DIW) and droplets of a mixture of DIW and an inert gas, towards the substrate.

5. The liquid treatment apparatus according to claim 4 , wherein each of the second ejection ports is configured to eject the DIW towards the lower surface of the substrate in a direction inclined to the rotating direction of the substrate rotated by the rotation driving unit, when the second ejection ports eject the DIW as the rinsing fluid.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 23, 2012
From: HIGASHIJIMA, JIRO; ITOH, NORIHIRO
To: TOKYO ELECTRON LIMITED
Reel/Frame 027575/0801 →
Priority Claims (1)
JP 2011-013458 · Jan 25, 2011 · national
Continuity (1)
Related Publication 20120186744A1 · Jul 26, 2012