FLEXIBLE CIRCUITS AND SUBSTRATES COMPRISING VOLTAGE SWITCHABLE DIELECTRIC MATERIAL
Embodiments described herein provide for flexible circuits and flexible substrates comprising VSD material that has superior characteristics for its use as an integral structural component of a device.
1 . A flexible circuit comprising a layer of voltage switchable dielectric (VSD) material, at least a portion of the layer of VSD material being adapted to provide electrostatic (ESD) protection.
2 . The flexible circuit of claim 1 , wherein the ESD protection is provided to the flexible circuit itself, to at least one circuit element attached to the flexible circuit, to at least one circuit element formed on the flexible circuit, to at least one electronic component attached to the flexible circuit, or to another portion of an electronic device in which the flexible circuit is disposed.
3 . The flexible circuit of claim 1 , wherein the flexible circuit is a single-sided flex circuit, a double access flex circuit, a or back bared flex circuit, sculptured flex circuit, a double-sided flex circuit, a multilayer flex circuit, a rigid-flex circuit, a rigidized flex circuit, a stiffened flex circuit, or a polymer thick film flex circuit.
4 . The flexible circuit of claim 1 , wherein the flexible circuit is disposed in an electronic device.
5 . The flexible circuit of claim 4 , wherein the electronic device is a mobile phone, smartphone, personal communication device, electronic tablet, electronic reader, mobile computer, desktop computer, server computer, television set, video display, music player, personal health management device, light emitting diode (LED), device comprising at least one LED, or lighting module.
6 . A flexible substrate comprising a voltage switchable dielectric material formation (VSDM formation) adapted to switch across a gap to provide electrostatic (ESD) protection.
7 . The flexible substrate of claim 6 , wherein the VSDM formation is a horizontal switching VSDM formation adapted to switch across a horizontal gap formed by the voltage switchable dielectric material, or a vertical switching VSDM formation adapted to switch across a vertical gap formed by the thickness of the voltage switchable dielectric material.
8 . The flexible substrate of claim 6 , wherein the flexible substrate is a single layer PCB, a multiple layer PCB, a single layer package, a multilayer package of a semiconductor device, a multilayer package of a semiconductor device, an LED substrate, an integrated circuit (IC) substrate, an interposer, a platform that connects two or more electronic components, devices or substrates, a stacked packaging format, a wafer-level package, a package-in-package, a system-in-package, or a stacked combination of at least two packages or substrates.
9 . The flexible substrate of claim 8 , wherein the flexible substrate is comprised in an electronic device.
10 . The flexible substrate of claim 9 , wherein the electronic device is a mobile phone, smartphone, personal communication device, electronic tablet, electronic reader, mobile computer, desktop computer, server computer, television set, video display, music player, personal health management device, light emitting diode (LED), device comprising at least one LED, or lighting module.
11 . An electronic device comprising a flexible circuit, the flexible circuit comprising a layer of voltage switchable dielectric (VSD) material, at least a portion of the layer of VSD material being adapted to provide electrostatic (ESD) protection to at least a portion of the electronic device.
12 . The electronic device of claim 11 , wherein the electronic device is a mobile phone, smartphone, personal communication device, electronic tablet, electronic reader, mobile computer, desktop computer, server computer, television set, video display, music player, personal health management device, light emitting diode (LED), device comprising at least one LED, or lighting module.
13 . The electronic device of claim 11 , wherein the VSD material has (i) a peel strength that is greater than 3, (ii) a coefficient of thermal expansion that is less than or equal to 100, and (iii) a glass transition temperature that is greater than 100 Celsius.