Method for using a stacked integrated component media insert in an ophthalmic device
This invention discloses methods and apparatus for providing a media insert with an energy source to an ophthalmic lens. The energy source is capable of powering a component included within the ophthalmic lens. In some embodiments, an ophthalmic lens is cast molded from a silicone hydrogel and the component includes an electro-optical lens portion.
1. A Stacked Integrated Component Media Insert for a contact lens, comprising:
at least three substrate layers assembled into a non-planar, three-dimensional stacked form sized consistent for inclusion within the contact lens; and
at least one material that may be bonded within a body of a molded contact lens encapsulating the non-planar, three-dimensional stacked form,
wherein each of the substrate layers comprise at least one element selected from an electrical component, an electromechanical component, an energy source, a wireless communication device, and an interconnection connecting the various elements on the substrate layers, and each of said substrate layers are located entirely outside of the optical zone of the lens, and
wherein each substrate layer only partially overlaps the substrate layer below it in the stack.
2. The Stacked Integrated Component Media Insert of claim 1 , wherein at least one of the substrate layers comprises a solid state energy source.
3. The Stacked Integrated Component Media Insert of claim 2 , additionally comprising a variable focus lens placed in proximity to the substrate layers.
4. The Stacked Integrated Component Media Insert of claim 3 , wherein the variable focus lens is fixed to the substrate layers.
5. The Stacked Integrated Component Media Insert of claim 1 , additionally comprising a battery.
6. The Stacked Integrated Component Media Insert of claim 1 , wherein each of the substrate layers comprise an arcuate shape, and wherein the arcuate shape is formed by a plurality of portions.
7. The Stacked Integrated Component Media Insert of claim 1 , wherein at least a portion of the substrate layers comprises an adhesive film.
8. The Stacked Integrated Component Media Insert of claim 7 , wherein at least two of the substrate layers are adhered to one another through the adhesive film.
9. The Stacked Integrated Component Media Insert of claim 1 , wherein the material encapsulating the non-planar, three-dimensional stacked form comprises a polysilicone based polymer.
10. The Stacked Integrated Component Media Insert of claim 1 , wherein at least one of the substrate layers comprises a semiconductor substrate with electronic circuitry in proximity to its first surface.
11. The Stacked Integrated Component Media Insert of claim 10 , wherein at least one of the plurality of substrate layers comprises an electrochemical energizing component.
12. The Stacked Integrated Component Media Insert of claim 10 , wherein at least one of the substrate layers comprises a semiconductor component with electronic circuitry capable to control electric current flow from one or more electrochemical cells in electrical communication with the electronic circuitry.
13. The Stacked Integrated Component Media Insert of claim 12 , additionally comprising an electroactive lens component.
14. The Stacked Integrated Component Media Insert of claim 13 , wherein the electronic circuitry is electrically connected to the electroactive lens.
15. The Stacked Integrated Component Media Insert of claim 1 , wherein at least one of the substrate layers comprises an antenna.
16. The Stacked Integrated Component Media Insert of claim 1 , wherein the substrate layers are assembled into one of an annular shape or a portion of an annular shape.
17. The Stacked Integrated Component Media Insert of claim 1 , wherein substrate layers are separated by insulating layers in the non-planar, three-dimensional stacked form.
18. The Stacked Integrated Component Media Insert of claim 1 , wherein at least one of the substrate layers is shaped into at least a portion of an annulus.
19. The Stacked Integrated Component Media Insert of claim 1 , wherein at least two of the substrate layers are electrically connected with at least one solder ball located between them.
20. The Stacked Integrated Component Media Insert of claim 1 , wherein at least two of the substrate layers are electrically connected with at least a wire bond and a contact pad located between them.
21. The Stacked Integrated Component Media Insert of claim 1 , wherein the substrate layers are shaped into at least a portion of an annulus.
22. The Stacked Integrated Component Media Insert of claim 21 , wherein each substrate layer has an external radius smaller than the substrate layer below it in the stack.
23. The Stacked Integrated Component Media Insert of claim 1 , wherein at least one of the substrate layers comprises a metallic material.
24. The Stacked Integrated Component Media Insert of claim 23 , wherein solder film is placed upon a surface of the metallic material.
25. The Stacked Integrated Component Media Insert of claim 1 , wherein at least one of the substrate layers comprises at least one of CMOS technology, BiCMOS technology, and BiPolar technology.