Granted Patent B2

US 9,131,325 · App. 13/360,920 · Granted Sep 8, 2015

Abstract

Claims (22)

1. A method of making a microelectromechanical systems (MEMS) device package comprising:

forming a MEMS device on a front side of a first substrate;

removing a portion of said substrate partially surrounding an active region of said MEMS device to form a cantilevered substrate platform at which said active region resides;

attaching a back side of said first substrate to a second substrate, said attaching operation including forming a clearance space between said cantilevered substrate platform and said second substrate so that said cantilevered substrate platform is suspended above said second substrate;

positioning a plug member overlying said cantilevered substrate platform;

following said attaching and positioning operations, applying a molding compound to encapsulate said MEMS device; and

following said applying operation, removing said plug member and coupling a cap to said first substrate overlying said cantilevered substrate platform, said cap including an interior volume to provide a gap between said cap and said active region of said MEMS device.

2. A method as claimed in claim 1 wherein said forming said clearance space comprises producing a cutout in said second substrate underlying said cantilevered substrate platform.

3. A method as claimed in claim 1 wherein said second substrate is an integrated circuit die, said attaching operation couples said MEMS device with said integrated circuit die such that said MEMS device is vertically stacked with said integrated circuit die and said clearance space is formed between said cantilevered substrate platform and said integrated circuit die.

4. A method as claimed in claim 1 wherein:

said forming operation includes forming bondwire pads on said first substrate, said bondwire pads being electrically coupled with said MEMS device via traces;

said method further includes electrically interconnecting said bondwire pads with an integrated circuit die via conductive interconnects; and

said applying operation concurrently encapsulates said integrated circuit die, said conductive interconnects, said bondwire pads, and said MEMS device with said molding compound.

5. A method as claimed in claim 1 further comprising providing a port extending through said cap so that said active region is exposed to an external environment via said port.

6. A method of making a microelectromechanical systems (MEMS) device package comprising:

forming a MEMS device and bondwire pads on a first substrate, said bondwire pads being electrically coupled with said MEMS device via traces;

removing a portion of said first substrate partially surrounding an active region of said MEMS device to form a cantilevered substrate platform at which said active region resides;

attaching a back side of said first substrate to a second substrate, said attaching operation including forming a clearance space between said cantilevered substrate platform and said second substrate so that said cantilevered substrate platform is suspended above said second substrate;

electrically interconnecting said bondwire pads with an integrated circuit die via conductive interconnects;

positioning a plug member overlying said cantilevered substrate platform;

following said positioning, applying a molding compound to encapsulate said integrated circuit die, said conductive interconnects, said bondwire pads, and said MEMS device; and

following said applying operation, removing said plug member and coupling a cap to said first substrate overlying said cantilevered substrate platform, said cap including an interior volume to provide a gap between said cap and said active region of said MEMS device.

Assignments (29)