Patent Assignment
Reel/Frame 037357/0476
Patent Release
Recorded: 2015-12-21
Pages: 14
Assignor
CITIBANK, N.A., AS COLLATERAL AGENT
Executed: 2015-12-07
Assignee
FREESCALE SEMICONDUCTOR, INC.
6501 WILLIAM CANNON DRIVE WEST, AUSTIN, TEXAS, 78735
Covered Properties
(93)
Process of Forming an Electronic Device Including a Plurality of Singulated Die
Application:
13/343,207 →
Publication:
US 2012/0104626
Semiconductor Wafer Plating Bus
Non-Volatile Memory (Nvm) and Logic Integration
Self-Tracking Adaptive Bandwidth Phase-Locked Loop
Patent:
8,432,200 →
Application:
13/343,719 →
Capacitance-To-Voltage Interface Circuits
Transistors and Semiconductor Devices with Oxygen-Diffusion Barrier Layers
Semiconductor Devices with Nonconductive Vias
Semiconductor Devices with Compliant Interconnects
Digital to Analog Converter for Phase Locked Loop
Skewed Sram Cell
Fully Decoupled Lateral Axis Gyroscope with Thickness-Insensitive Z-Axis Spring and Symmetric Teeter Totter Sensing Element
Pipelined Analog-to-Digital Converter Having Reduced Power Consumption
Localized Alloying for Improved Bond Reliability
Circuit for Generating Multi-Phase Non-Overlapping Clock Signals
Digital Voltage Level Shifter
Patent:
8,432,189 →
Application:
13/356,615 →
Single Supply Digital Voltage Level Shifter
Patent:
8,350,592 →
Application:
13/356,626 →
Method for Dual Edge Clock and Buffer Tree Synthesis
Patent:
8,448,114 →
Application:
13/356,636 →
Method for Driving a Ptc Electrical Load Element
Semiconductor Device Having a Nanotube Layer and Method for Forming
Method of Forming a Semiconductor Structure
Delay Line Phase Shifter with Selectable Phase Shift
Adjustable Power Splitter and Corresponding Methods & Apparatus
Mems Device Assembly and Method of Packaging Same
Encapsulant with Corosion Inhibitor
Structure and Method for Healing Tunnel Dielectric of Non-Volatile Memory Cells
Packaged Integrated Circuit Using Wire Bonds
Semiconductor Device Having Different Non-Volatile Memories Having Nanocrystals of Differing Densities and Method Therefor
Systems and Methods for Reducing Branch Misprediction Penalty
Vibration Robust X-Axis Ring Gyro Transducer
Mems Device with Stress Isolation and Method of Fabrication
Cellular Modem Processing
Charge Pump Voltage Regulator
Stack-Based Trace Message Generation for Debug and Device Thereof
Power Supply Circuit for Reduced Wake-Up Time
Data Processing System Operable in Single and Multi-Thread Modes and Having Multiple Caches and Method of Operation
Low Voltage CMOS Power on Reset Circuit
Method and Apparatus for High Pressure Sensor Device
Diversity Antenna System and Transmission Method
Data Administration Unit, Data Access Unit, Network Element, Network, and Method for Updating a Data Structure
Integrated Circuit, Transceiver and Method for Leakage Cancellation in a Receive Path
Signal Processing System and Integrated Circuit Comprising a Prefetch Module and Method Therefor
Diversity Receiver and Transceiver
Signal Processing System, Integrated Circuit Comprising Buffer Control Logic and Method Therefor
Controller System, Integrated Circuit and Method Therefor
Electronic Device with Protection Circuit
Transistor Power Switch Device and Method of Measuring Its Characteristics
Encoding Module, Apparatus and Method for Determining a Position of a Data Bit Within an Interleaved Data Stream
Device and Method for Turbo-Encoding a Block of Data
Software Probe Minimization
Duty Cycle Corrector and Duty Cycle Correction Method
Device and Method for Performing Conditional Bitwise Set/Clear/Toggle Manipulations in a General Purpose Register
System and Method for Filtering Received Data Units
Distributed Debug System
Semiconductor Device Package Having Backside Contact and Method for Manufacturing
Data Processing System with Latency Tolerance Execution
Transistor-Level Layout Synthesis
Semiconductor Devices and Methods of Assembling Same
Method of Packaging Semiconductor Die with Cap Element
Lead Frame with Coined Inner Leads
Application:
13/398,824 →
Publication:
US 2012/0248589
Lead Frame Sulfur Removal
Patent:
8,440,507 →
Application:
13/400,405 →
Mems Pressure Transducer Assembly and Method of Packaging Same
System for Testing Electronic Circuits
Embedded Electrical Component Surface Interconnect
Non-Volatile Memory Cell and Logic Transistor Integration
Single Period Phase to Digital Converter
Patent:
8,390,347 →
Application:
13/402,844 →
Method for Forming Die Assembly with Heat Spreader
Recoverable and Reconfigurable Pipeline Structure for State-Retention Power Gating
Metal-Insulator-Metal Capacitor
Successive Approximation Analog-to-Digital Converter
Patent:
8,487,805 →
Application:
13/403,945 →
Inter-Partition Communication in Multi-Core Processor
Application:
13/403,964 →
Publication:
US 2013/0227243
Data Processor with Asynchronous Reset
Application:
13/403,969 →
Publication:
US 2013/0227257
Embedded Electronic Component
Hierarchical Error Correction
Combined Environmental Parameter Sensor
Voltage Clamping Circuit
Patent:
8,493,122 →
Application:
13/410,267 →
Bipolar Primary Sense Amplifier
Method for Implementing Security of Non-Volatile Memory
Semiconductor Device with Composite Drift Region
Semiconductor Package and Lead Frame Therefor
Method for Testing Comparator and Device Therefor
Multiple Page Size Memory Management Unit
Circuit and Method for Measuring Voltage
Data Processing System with Latency Tolerance Execution
Sample and Hold Circuit and Differential Sample and Hold Circuit
Patent:
8,513,982 →
Application:
13/424,064 →
Microelectromechanical System Package and Method of Testing
Integrated Circuit Having a Staggered Heterojunction Bipolar Transistor Array
Application:
13/431,506 →
Publication:
US 2013/0256756
Method of Reading Memory Cell
Phase Locked Loop with Adaptive Biasing
Patent:
8,487,677 →
Application:
13/434,946 →
Phase Locked Loop with Adaptive Loop Filter
Fully Complementary Self-Biased Differential Receiver with Startup Circuit
Systems with Multiple Port Random Number Generators and Methods of Their Operation
Random Value Production Methods and Systems
Microelecronic Assembly with an Embedded Waveguide Adapter and Method for Forming the Same
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement
Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
Patent Release
Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0521 →
Patent Release
Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0455 →
Assignment and Assumption of Security Interest in Patents
Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
Assignment and Assumption of Security Interest in Patents
Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
Assignment of Assignor's Interest
Feb 4, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NORTH STAR INNOVATIONS INC.
Reel/Frame 037694/0264 →
Security Agreement Supplement
Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
Supplement to the Security Agreement
Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
Corrective Assignment to Correct the Remove Application 12092129 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement.
Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
Patent Release
Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
Release of Security Interest
Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
Release of Security Interest
Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
Change of Name
Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040632/0001 →
Merger
Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040652/0241 →
Change of Name
Nov 8, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040652/0180 →
Merger
Jan 3, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041144/0363 →
Corrective Assignment to Correct the Nature of Conveyance Previously Recorded at Reel: 040652 Frame: 0241. Assignor(S) Hereby Confirms the Merger and Change of Name.
Jan 5, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041260/0850 →
Corrective Assignment to Correct the Nature of Conveyance Listed Change of Name Should Be Merger and Change Previously Recorded at Reel: 040652 Frame: 0180. Assignor(S) Hereby Confirms the Merger and Change of Name.
Jan 12, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 041354/0148 →
Corrective Assignment to Correct the Remove Patents 8108266 and 8062324 and Replace Them with 6108266 and 8060324 Previously Recorded on Reel 037518 Frame 0292. Assignor(S) Hereby Confirms the Assignment and Assumption of Security Interest in Patents.
Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
Assignment of Assignor's Interest
Feb 15, 2017
From: NORTH STAR INNOVATIONS INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 041717/0736 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 039361 Frame 0212. Assignor(S) Hereby Confirms the Security Agreement Supplement.
May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement.
May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
Assignment of Assignor's Interest
Sep 5, 2017
From: GUILLOT, LAURENT; ABOUDA, KAMEL; ROSADO, PHILIPPE; JOOS, ULI
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 043491/0127 →
Corrective Assignment to Correct the Nature of Conveyance Previously Recorded at Reel: 040632 Frame: 0001. Assignor(S) Hereby Confirms the Merger and Change of Name.
Sep 21, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 044209/0047 →
Corrective Assignment to Correct the to Correct the Application No. from 13,883,290 to 13,833,290 Previously Recorded on Reel 041703 Frame 0536. Assignor(S) Hereby Confirms the the Assignment and Assumption of Security Interest in Patents..
Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →