Encapsulant with corrosion inhibitor
View Patent ↗A packaged electronic device including an electronic device, a conductive structure, and an encapsulant. The encapsulant has chlorides and a negatively-charged corrosion inhibitor for preventing corrosion of the conductive structure.
1. A packaged electronic device, comprising:
an electronic device;
a conductive structure;
an encapsulant encapsulating the conductive structure, wherein the encapsulant includes chlorides and a negatively-charged corrosion inhibitor, wherein the negatively charged inhibitor includes at least one negative ion selected from the group consisting of negative acetate ions, negative formate ions, negative tartarate ions, and negative nitrite ions, at a concentration of at least 150 parts per million of the encapsulant.
2. The packaged electronic device of claim 1 , wherein the negatively-charged corrosion inhibitor has a concentration of at least five times that of a concentration of the chlorides in the encapsulant.
3. The packaged electronic device of claim 1 wherein the electronic device includes a bond pad and the conductive structure includes a wire bond, the wire bond includes conductive bonding material attached to the bond pad and a wire extending from the conductive bonding material.
4. The packaged electronic device of claim 3 , wherein an intermetallic layer comprising copper and aluminum is formed between the bond pad and the conductive bonding material.
5. The packaged electronic device of claim 4 , wherein a concentration of the negatively-charged corrosion inhibitor is sufficient to prevent corrosion of the intermetallic layer by the chlorides when the conductive bonding material and bond pad are positively charged.
6. The packaged electronic device of claim 1 wherein the negatively charged inhibitor includes negative nitrite ions at a concentration of at least 150 parts per million of the encapsulant.
7. The packaged electronic device of claim 1 wherein the negatively charged inhibitor includes negative acetate ions at a concentration of at least 150 parts per million of the encapsulant.
8. The packaged electronic device of claim 1 wherein the negatively charged inhibitor includes negative formate ions at a concentration of at least 150 parts per million of the encapsulant.
9. The packaged electronic device of claim 1 wherein the negatively charged inhibitor includes negative tartarate ions at a concentration of at least 150 parts per million of the encapsulant.
10. A packaged electronic device, comprising:
an electronic device including a bond pad having an upper surface comprising aluminum;
a wire bond including a copper ball bond attached to the bond pad so as to have an intermetallic layer of copper and aluminum between the bond pad and the wire bond, the wire bond including a wire;
an encapsulant encapsulating the wire bond, wherein the encapsulant includes chlorides and a negatively-charged corrosion inhibitor, wherein the negatively charged inhibitor includes at least one negative ion selected from the group consisting of negative acetate ions, negative formate ions, negative tartarate ions, and negative nitrite ions, at a concentration of at least 150 parts per million of the encapsulant.
11. The packaged electronic device of claim 10 wherein the negatively charged inhibitor includes negative nitrite ions at a concentration of at least 150 parts per million of the encapsulant.
12. The packaged electronic device of claim 10 wherein the negatively charged inhibitor includes negative acetate ions at a concentration of at least 150 parts per million of the encapsulant.
13. The packaged electronic device of claim 10 wherein the negatively charged inhibitor includes negative formate ions at a concentration of at least 150 parts per million of the encapsulant.
14. The packaged electronic device of claim 10 wherein the negatively charged inhibitor includes negative tartarate ions at a concentration of at least 150 parts per million of the encapsulant.
15. A packaged electronic device, comprising:
an electronic device including a bond pad having an upper surface comprising aluminum;
a wire bond including a copper ball bond attached to the bond pad so as to have an intermetallic layer of copper and aluminum between the bond pad and the wire bond, the wire bond including a wire;
an encapsulant encapsulating the wire bond, wherein the encapsulant includes chlorides and a negatively-charged corrosion inhibitor, wherein the negatively-charged corrosion inhibitor comprises negative hippurate ions.
16. The packaged device of claim 15 , wherein the negative hippurate ions have a concentration of at least 150 parts per million of the encapsulant.
17. The packaged electronic device of claim 15 , wherein the negative hippurate ions have a concentration of at least five times that of a concentration of the chlorides in the encapsulant.
18. The packaged electronic device of claim 15 , wherein a concentration of the negative hippurate ions is sufficient to prevent corrosion of the intermetallic layer by the chlorides when the conductive bonding material and bond pad are positively charged.