Microelectromechanical system package and method of testing
View Patent ↗A microelectromechanical system (MEMS) package is disclosed herein. The MEMS package includes a movable mass. The MEMS package further includes a first and second sense electrodes spaced apart from the movable mass. The first and second sense electrodes are configured to be electrically coupled with a controller. The MEMS package further includes a first test electrode and a second test electrode spaced apart from the movable mass. The first and the second test electrodes are configured to be electrically connected to first and second external electrical connectors, respectively. The first and second test electrodes are biased at a first voltage and a second voltage, respectively, when the first and second external electrical connectors are connected to external voltage sources.
1. A microelectromechanical system package comprising:
a movable mass connected to a substrate;
a first sense electrode spaced apart from the movable mass at a first location and configured to be electrically coupled with a controller;
a second sense electrode spaced apart from the movable mass at a second location and configured to be electrically coupled with the controller;
a first test electrode spaced apart from the movable mass and mounted to the substrate at a third location, the first test electrode being electrically isolated from the controller, and the first test electrode being configured to be electrically connected to a first external electrical connecter and to be biased at a first voltage when the first external electrical connector is connected to a first electric power source; and
a second test electrode spaced apart from the movable mass and mounted to the substrate at a fourth location, the second test electrode being electrically isolated from the controller, and the second test electrode being configured to be electrically connected to a second external electrical connector and to be biased at a second voltage when the second external electrical connector is connected to a second electric power source,
wherein the controller is configured to detect a differential between a first capacitance existing between the movable mass and the first sense electrode and a second capacitance existing between the movable mass and the second sense electrode, and wherein the first test electrode and the second test electrode are configured to generate a net electrostatic force to move the movable mass with respect to the first sense electrode and the second sense electrode to create the differential between the first capacitance and the second capacitance when the first external electrical connector or the second external electrical connector are electrically connected to the first electric power source or the second electric power source, respectively.
2. The microelectromechanical system package of claim 1 , wherein the first test electrode and the second test electrode are configured to operate at a higher voltage range than a voltage of the controller.
3. The microelectromechanical system package of claim 1 , wherein the first test electrode and the second test electrode are on opposite sides of the movable mass.
4. The microelectromechanical system package of claim 1 , wherein the movable mass is configured to be electrically coupled with the controller.
5. The microelectromechanical system package of claim 1 , wherein the movable mass comprises a first portion and a second portion, and wherein the first portion is electrically insulated from the second portion yet still mechanically connected.
6. The microelectromechanical system package of claim 5 , wherein the first portion is configured to be electrically coupled to the controller.
7. The microelectromechanical system package of claim 5 , wherein the second portion is configured to be electrically coupled to a third external electrical connector.
8. The microelectromechanical system package of claim 6 , wherein the first test electrode and the second test electrode are disposed proximate the second portion.
9. The microelectromechanical system package of claim 1 , wherein the first sense electrode and the second sense electrode are substantially equidistant from the movable mass.
10. The microelectromechanical system package of claim 1 , wherein the first test electrode and the second test electrode are substantially equidistant from the movable mass.
11. A package assembly comprising:
a controller die;
a first external electrical connector configured for electrical coupling to a first electric power source, the first external electrical connector being electrically isolated from the controller die;
a second external electrical connector configured for electrical coupling to a second electric power source, the second external electrical connector being electrically isolated from the controller die;
a microelectromechanical system die electrically coupled with the controller die and further electrically coupled with the first external electrical connector and the second external electrical connector, the microelectromechanical system die including:
a movable mass connected to a substrate,
a first sense electrode spaced apart from the movable mass at a first location and electrically coupled with the controller die,
a second sense electrode spaced apart from the movable mass at a second location and electrically coupled with the controller die,
a first test electrode spaced apart from the movable mass and mounted to the substrate at a third location, the first test electrode being electrically isolated from the controller die and electrically coupled to the first external electrical connector, and the first test electrode being biased at a first voltage when the first external electrical connector is electrically connected to the first electric power source, and
a second test electrode spaced apart from the movable mass and mounted to the substrate at a fourth location, the second test electrode being electrically isolated from and controller die and electrically coupled to the second external electrical connector, and the second test electrode being biased at a second voltage when the second external electrical connector is electrically connected to the second electric power source,
wherein the controller die is configured to detect a differential between a first capacitance existing between the movable mass and the first sense electrode and a second capacitance existing between the movable mass and the second sense electrode, and wherein the first test electrode and the second test electrode are configured to generate a net electrostatic force to move the movable mass with respect to the first sense electrode and the second sense electrode to create the differential between the first capacitance and the second capacitance when the first external electrical connector or the second external electrical connector are electrically connected to the first electric power source or the second electric power source, respectively.
12. The package assembly of claim 11 , wherein the movable mass is electrically coupled with the controller die.
13. The package assembly of claim 11 , wherein the movable mass is divided into a first portion and a second portion and wherein the first portion is electrically insulated from the second portion.
14. The package assembly of claim 13 , wherein the first portion is configured to be electrically coupled to the controller die.
15. The package assembly of claim 13 , further comprising a third external electrical connector configured for electrical connection to a third electric power source, wherein the second portion is electrically coupled to the third external electrical connector and wherein the second portion is maintained at a substantially constant voltage when the third external electrical connector is electrically connected to the third electric power source.