Embedded electronic component
View Patent ↗Forming an embedded electronic component includes attaching an electronic component to a first conductive layer and forming a layer stack with a first partially cured dielectric layer having a first opening and a substrate having a second opening. The partially cured dielectric layer is located over the first conductive layer and the substrate is located over the first partially cured dielectric layer such that the first and second openings surround the electronic component. Heat and pressure are applied to the layer stack such that the first partially cured dielectric layer flows for filling gaps within the first and second openings and becomes fully cured.
1. A method for forming an embedded electronic component, the method comprising:
attaching an electronic component to a first conductive layer;
providing a partially cured dielectric layer, wherein the partially cured dielectric layer includes a first opening;
providing a patterned conductive layer, wherein the patterned conductive layer includes a second opening;
forming a layer stack including the first conductive layer, the partially cured dielectric layer, and the patterned conductive layer wherein the partially cured dielectric layer is located over the first conductive layer such that the first opening surrounds the electronic component and the patterned conductive layer is located over the partially cured dielectric layer such that the second opening surrounds the electronic component; and
applying pressure and heat to the layer stack such that the partially cured dielectric layer flows for filling gaps within the first and second openings and becomes fully cured, wherein the electronic component is located in the layer stack during the applying pressure and heat.
2. The method of claim 1 wherein the patterned conductive layer is attached to a fully cured dielectric layer, wherein the fully cured dielectric layer includes a third opening, wherein the layer stack includes the fully cured dielectric layer located over the partially cured dielectric layer such that the third opening surrounds the electronic component, wherein the applying pressure and heat includes applying pressure and heat to the fully cured dielectric layer, wherein during the applying pressure and heat, the fully cured dielectric layer remains solid.
3. The method of claim 2 , wherein the patterned conductive layer is located between the partially cured dielectric layer and fully cured dielectric layer in the layer stack, wherein a second patterned conductive layer is attached to the fully cured dielectric layer on an opposite side to the patterned conductive layer, wherein the second patterned conductive layer includes a fourth opening, wherein the forming the layer stack includes forming the layer stack with the second patterned conductive layer such that the fourth opening surrounds the electronic component.
4. The method of claim 1 , further comprising:
providing a second partially cured dielectric layer, wherein the second partially cured dielectric layer includes a third opening; and
the forming the layer stack includes forming the layer stack with the second partially cured dielectric layer over the patterned conductive layer such that the third opening surrounds the electronic component.
5. The method of claim 4 , wherein the applying the pressure and heat is performed such that the partially cured dielectric layer and the second partially cured dielectric layer flow for filling gaps within the first, second, and third openings and become fully cured.
6. The method of claim 4 , wherein the forming the layer stack includes forming the layer stack with a second conductive layer located over the second partially cured dielectric layer and the electronic component.
7. The method of claim 1 wherein the forming the layer stack includes forming the layer stack with a second conductive layer located over the patterned conductive layer and the electronic component.
8. The method of claim 7 , further comprising:
after the applying pressure and heat, forming plated through vias which extend from the second conductive layer to the first conductive layer.
9. The method of claim 7 , further comprising:
after the applying the pressure and heat, patterning the first conductive layer and patterning the second conductive layer.
10. The method of claim 9 further comprising:
after patterning the first conductive layer, forming a first solder mask attached to the first conductive layer; and
after patterning the second conductive layer, forming a second solder mask attached to the second conductive layer.
11. The method of claim 9 , wherein the patterning the second conductive layer comprises forming a third opening in the second conductive layer which overlies the electronic component, wherein the electronic component comprises a protective layer over a top surface of the electronic component, wherein after forming the third opening, the method further comprises:
removing the protective layer through the third opening.
12. The method of claim 9 wherein the patterning the second conductive layer forms a wire bond pad, the method comprising:
wire bonding the wire bond pad to a bond pad of the electronic component.
13. A method for forming an embedded electronic component, the method comprising:
attaching a first major surface of an electronic component to a first conductive layer;
providing a first partially cured dielectric layer, wherein the first partially cured dielectric layer includes a first opening;
providing a fully cured dielectric layer with a first patterned metal layer on a first major surface of the fully cured dielectric layer and a second patterned metal layer on a second major surface of the fully cured dielectric layer, wherein the fully cured dielectric layer includes a second opening;
providing a second partially cured dielectric layer, wherein the second partially cured dielectric layer includes a third opening;
providing a second conductive layer;
forming a layer stack with the first conductive layer, the first partially cured dielectric layer, the fully cured dielectric layer, the second partially cured dielectric layer, and the second conductive layer wherein the first partially cured dielectric layer is located over the first conductive layer such that the first opening surrounds the electronic component, the fully cured dielectric layer is located over the first partially cured dielectric layer such that the second opening surrounds the electronic component, the second partially cured dielectric layer is located over the fully cured dielectric layer such that the third opening surrounds the electronic component, and the second conductive layer is located over the second partially cured dielectric layer and the electronic component;
applying pressure and heat to the layer stack such that the first and second partially cured dielectric layers flow for filling gaps within the first, second, and third openings and become fully cured, wherein during the applying pressure and heat, the fully cured dielectric layer remains solid.
14. The method of claim 13 , further comprising:
after the applying pressure and heat, patterning the first conductive layer and the second conductive layer.
15. The method of claim 14 , wherein a second major surface of the electronic component comprises a protective film, wherein patterning the second conductive layer comprises:
opening the second conductive layer to expose the protective film; and
forming wire bond pads from the second conductive layer.
16. The method of claim 15 , further comprising:
removing the protective film through an opening in the second conductive layer to expose at least one bond pad of the electronic component;
wire bonding a wire bond pad formed form the second conductive layer to a bond pad of the electronic component.
17. The method of claim 14 , wherein patterning the first conductive layer comprises leaving a portion of the first conductive layer attached to the electronic component.
18. The method of claim 14 , further comprising:
after the patterning, forming a first solder mask layer attached to the first conductive layer, forming a second solder mask layer attached to the second conductive layer, wherein the first solder mask layer comprises a first plurality of openings and the second solder mask layer comprises a second plurality of openings;
forming a metal within the first and second plurality of openings.
19. The method of claim 13 , further comprising:
after the applying pressure and heat, forming plated through vias which extend from the second conductive layer to the first conductive layer.
20. A method for forming an embedded electronic component, the method comprising:
attaching a first major surface of an electronic component to a first conductive layer;
providing a first partially cured dielectric layer, wherein the first partially cured dielectric layer includes a first opening;
providing a metal layer that includes a second opening;
providing a second partially cured dielectric layer, wherein the second partially cured dielectric layer includes a third opening;
providing a second conductive layer;
forming a layer stack with the first conductive layer, the first partially cured dielectric layer, the metal layer, the second partially cured dielectric layer, and the second conductive layer wherein the first partially cured dielectric layer is located over the first conductive layer such that the first opening surrounds the electronic component, the metal layer is located over the first partially cured dielectric layer such that the second opening surrounds the electronic component, the second partially cured dielectric layer is located over the metal layer such that the third opening surrounds the electronic component, and the second conductive layer is located over the second partially cured dielectric layer and the electronic component;
applying pressure and heat to the layer stack such that the first and second partially cured dielectric layers flow for filling gaps within the first, second, and third openings and become fully cured, wherein the electronic component is located in the layer stack during the applying pressure and heat.