MEMS device with stress isolation and method of fabrication
A MEMS device ( 20 ) with stress isolation includes elements ( 28, 30, 32 ) formed in a first structural layer ( 24 ) and elements ( 68, 70 ) formed in a second structural layer ( 26 ), with the layer ( 26 ) being spaced apart from the first structural layer ( 24 ). Fabrication methodology ( 80 ) entails forming ( 92, 94, 104 ) junctions ( 72, 74 ) between the layers ( 24, 26 ). The junctions ( 72, 74 ) connect corresponding elements ( 30, 32 ) of the first layer ( 24 ) with elements ( 68, 70 ) of the second layer ( 26 ). The fabrication methodology ( 80 ) further entails releasing the structural layers ( 24, 26 ) from an underlying substrate ( 22 ) so that all of the elements ( 30, 32, 68, 70 ) are suspended above the substrate ( 22 ) of the MEMS device ( 20 ), wherein attachment of the elements ( 30, 32, 68, 70 ) with the substrate ( 22 ) occurs only at a central area ( 46 ) of the substrate ( 22 ).
1. A microelectromechanical systems (MEMS) device comprising:
a substrate;
a first element and a second element formed in a first structural layer, both of said first and second elements being suspended over a portion of said substrate, said second element being immovably coupled with said substrate, and attachment of said second element with said substrate occurs only at a central area on said substrate relative to a location of said first and second elements over said substrate;
a third element formed in a second structural layer over said first structural layer and spaced apart from said first structural layer; and
a junction formed between said second and third elements, said junction coupling said third element with said second element.
2. The MEMS device as claimed in claim 1 further comprising a material layer overlying said central area of said substrate between said substrate and said first structural layer, said material layer being absent from said portion of said substrate over which said first and second elements are suspended, so that said first and second elements are spaced apart from said portion of said substrate.
3. The MEMS device as claimed in claim 1 further comprising:
a first anchor attached to said substrate;
a compliant member interconnected between said first element and said first anchor to allow movement of said first element substantially parallel to a plane of said substrate; and
a second anchor at said central area of said substrate and coupled with said second element so that said second element is immovable relative to said first element.
4. The MEMS device as claimed in claim 3 further comprising:
a fourth element formed in said first structural layer and suspended over said portion of said substrate; and
a third anchor at said central area of said substrate and coupled with said fourth element so that said fourth element is immovable relative to said first element and is spaced apart from said portion of said substrate.
5. The MEMS device as claimed in claim 3 wherein said compliant member allows movement of said first element in a first direction and in a second direction that is perpendicular to said first direction, each of said first and second directions being substantially parallel to said plane of said substrate.
6. The MEMS device as claimed in claim 1 wherein:
said first element includes projections extending substantially parallel to a plane of said substrate;
said second element includes fingers interleaved with said projections;
said third element is formed in said second structural layer as a beam; and
said MEMS device further comprises multiple junctions extending between said first and second structural layers and coupling said beam with said fingers of said second element, said junction being one of said multiple junctions, said beam being coupled to said junctions so that said fingers are interconnected with one another via said beam, and said projections are not connected to said beam.
7. The MEMS device as claimed in claim 6 wherein at least one of said projections is interposed between a pair of said fingers, said beam is oriented across a location of said at least one of said projections, and said beam is attached to each of said pair of said fingers via said junctions.
8. The MEMS device as claimed in claim 6 wherein said first and second elements formed in said first structural layer are thicker than said beam formed in said second structural layer.
9. The MEMS device as claimed in claim 6 wherein said fingers are first fingers, said junctions are first junctions, said beam is a first beam, and said MEMS device further comprises:
a fourth element formed in said first structural layer and suspended over said portion of said substrate, said fourth element including second fingers interleaved with said projections;
a fifth element formed in said second structural layer, said fifth element being formed as a second beam; and
multiple second junctions extending between said first and second structural layers and coupling said second beam with said second fingers of said fourth element, said second beam being coupled to said second junctions so that said second fingers of said fourth element are interconnected with one another via said second beam, and said projections and said first fingers are not connected to said second beam.
10. The MEMS device as claimed in claim 1 wherein:
said first element is formed in said first structural layer as a beam;
said third element formed in said second structural layer includes fingers; and
said MEMS device further comprises:
a movable element formed in said second structural layer and suspended over said portion of said substrate, said movable element including projections extending substantially parallel to a plane of said substrate, wherein said fingers of said third element are interleaved with said projections; and
multiple junctions extending between said first and second structural layers and coupling said beam with said fingers of said third element, said junction being one of said multiple junctions, said beam being coupled to said junctions so that said fingers of said third element are interconnected with one another via said beam, and said projections are not connected to said beam.
11. The MEMS device as claimed in claim 10 wherein said second structural layer is thicker than said first structural layer.
12. The MEMS device as claimed in claim 10 further comprising:
a first anchor attached to said substrate;
a compliant member interconnected between said movable element and said first anchor to allow movement of said movable element substantially parallel to a plane of said substrate; and
a second anchor at said central area of said substrate and coupled with said third element so that said first and third elements are immovable relative to said movable element.
13. The MEMS device as claimed in claim 10 wherein said fingers are first fingers, said junctions are first junctions, said beam is a first beam, said second element is formed in said first structural layer as a second beam, and said MEMS device further comprises:
a fourth element formed in said second structural layer and suspended over said portion of said substrate, said fourth element including second fingers that are interleaved with said projections of said movable element; and
multiple second junctions extending between said first and second structural layers and coupling said second beam with said second fingers of said fourth element, said second beam being coupled to said second junctions so that said second fingers of said fourth element are interconnected with one another via said second beam, and said projections are not connected to said second beam.
14. A microelectromechanical systems (MEMS) device comprising:
a substrate;
a first element and a second element formed in a first structural layer, both of said first and second elements being suspended over a portion of said substrate, said second element being immovably coupled with said substrate, and attachment of said second element with said substrate occurs only at a central area on said substrate relative to a location of said first and second elements over said substrate, wherein said first element includes projections extending substantially parallel to a plane of said substrate, and said second element includes fingers interleaved with said projections;
a material layer overlying said central area of said substrate between said substrate and said first structural layer, said material layer being absent from said portion of said substrate over which said first and second elements are suspended, so that said first and second elements are spaced apart from said portion of said substrate;
a third element formed in a second structural layer over said first structural layer and spaced apart from said first structural layer, said third element being formed as a beam; and
multiple junctions extending between said first and second structural layers and coupling said beam with said fingers of said second element, said beam being coupled to said junctions so that said fingers of said second element are interconnected with one another via said beam, and said projections are not connected to said beam.
15. The MEMS device as claimed in claim 14 further comprising:
a first anchor attached to said substrate;
a compliant member interconnected between said first element and said first anchor to allow movement of said first element substantially parallel to a plane of said substrate; and
a second anchor at said central area of said substrate and coupled with said second element so that said fingers of said second element are immovable relative to said first element.
16. The MEMS device as claimed in claim 14 wherein said first and second elements formed in said first structural layer are thicker than said beam formed in said second structural layer.
17. The MEMS device as claimed in claim 14 wherein said fingers are first fingers, said junctions are first junctions, said beam is a first beam, and said MEMS device further comprises:
a fourth element formed in said first structural layer and suspended over said portion of said substrate, said fourth element including second fingers interleaved with said projections;
a fifth element formed in said second structural layer, said fifth element being formed as a second beam; and
multiple second junctions extending between said first and second structural layers and coupling said second beam with said second fingers of said fourth element, said second beam being coupled to said second junctions so that said second fingers of said fourth element are interconnected with one another via said second beam, and said projections are not connected to said second beam.
18. A microelectromechanical systems (MEMS) device comprising:
a substrate;
a first element and a second element formed in a first structural layer, both of said first and second elements being suspended over a portion of said substrate, said first element being immovably coupled with said substrate, and attachment of said first element with said substrate occurs only at a central area on said substrate relative to a location of said first and second elements over said substrate, wherein said first element is formed in said first structural layer as a beam;
a material layer overlying said central area of said substrate between said substrate and said first structural layer, said material layer being absent from said portion of said substrate over which said first and second elements are suspended, so that said first and second elements are spaced apart from said portion of said substrate;
a third element formed in a second structural layer over said first structural layer and spaced apart from said first structural layer, said third element including fingers;
a movable element formed in said second structural layer and suspended over said portion of said substrate, said movable element including projections extending substantially parallel to a plane of said substrate, wherein said fingers of said third element are interleaved with said projections; and
multiple junctions extending between said first and second structural layers and coupling said beam with said fingers of said third element, said beam being coupled to said junctions so that said fingers of said third element are interconnected with one another via said beam, and said projections are not connected to said beam.
19. The MEMS device as claimed in claim 18 wherein said second structural layer is thicker than said first structural layer.
20. The MEMS device as claimed in claim 18 further comprising:
a first anchor attached to said substrate;
a compliant member interconnected between said movable element and said first anchor to allow movement of said movable element substantially parallel to a plane of said substrate; and
a second anchor at said central area of said substrate and coupled with said third element so that said first and third elements are immovable relative to said movable element.