IP Library Granted Patent US 9,184,505
Granted Patent B2
US 9,184,505 · App. 13/362,776 · Granted Nov 10, 2015

Dielectric cavity antenna

Inventors: Myeong Woo Han (Gyunggi-do, KR); Jung Aun Lee (Gyunggi-do, KR); Nam Heung Kim (Gyunggi-do, KR)
Assignee: Samsung Electro-Mechanics Co., Ltd.
H01Q9/0485
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Quick Facts
Patent No.
US 9,184,505
App. No.
13/362,776
Granted
Nov 10, 2015
Kind
B2
Abstract

There is provided a dielectric cavity antenna including: a multilayer substrate having an opening formed in at least a portion of a predetermined surface thereof; a dielectric cavity inserted into the multilayer substrate to radiate an electromagnetic wave signal through the opening; a feed line feeding power to the dielectric cavity; and at least one metal pattern formed in an inner portion of the dielectric cavity or on a surface thereof to thereby be electromagnetically coupled to the feed line.

Claims (29)

1. A dielectric cavity antenna comprising:

a multilayer substrate having an opening formed in at least a portion of a predetermined surface of the multilayer substrate;

a dielectric cavity inserted into the multilayer substrate to radiate an electromagnetic wave signal through the opening;

a feed line feeding power to the dielectric cavity;

an impedance determining via connecting an uppermost layer and a conductor plate among the plurality of conductor plates, the conductor plate being immediately adjacent to the uppermost layer, to each other, the impedance determining via determining impedance of the feed line; and

at least one metal pattern formed in an inner portion of the dielectric cavity or on a surface of the dielectric cavity to be electromagnetically coupled to the feed line,

wherein the metal pattern electromagnetically coupled to the feed line is changed, such that impedance formed by the feed line and the metal pattern is changed, and

the feed line and an entire portion of the at least one metal pattern are disposed on the same layer of the multilayer substrate.

2. The dielectric cavity antenna of claim 1 , further comprising a plurality of metal vias arranged along a circumference of the opening to be spaced apart from each other by predetermined intervals and vertically penetrating the multilayer substrate.

3. The dielectric cavity antenna of claim 1 , wherein the dielectric cavity has a rectangular parallelepiped shape or a cylindrical shape.

4. The dielectric cavity antenna of claim 1 , wherein the feed line is extended from any one layer of the multilayer substrate to the surface of the dielectric cavity or the inner portion of the dielectric cavity.

5. The dielectric cavity antenna of claim 1 , wherein the feed line is a strip line, a micro-strip line, or a coplanar waveguide (CPW) line.

6. The dielectric cavity antenna of claim 1 , wherein the metal pattern is spaced apart from the feed line by a predetermined interval.

7. The dielectric cavity antenna of claim 1 , wherein a distance between the metal pattern and the opening is smaller than a distance between the feed line and the metal pattern.

8. A dielectric cavity antenna comprising:

a multilayer substrate formed by alternately laminating a plurality of dielectric layers and a plurality of conductor plates, including uppermost and lowermost layers as conductor plates, and having an opening formed in at least a portion of a predetermined surface of the multilayer substrate;

a dielectric cavity inserted in the multilayer substrate to radiate an electromagnetic wave signal through the opening;

a plurality of metal vias arranged along a circumference of the opening to be spaced apart from each other by predetermined intervals, and vertically penetrating the multilayer substrate to electrically connect the plurality of conductor plates to each other;

a feed line feeding power to the dielectric cavity;

an impedance determining via connecting an uppermost layer and a conductor plate among the plurality of conductor plates, the conductor plate being immediately adjacent to the uppermost layer, to each other, the impedance determining via determining impedance of the feed line; and

at least one metal pattern formed in an inner portion of the dielectric cavity or on a surface of the dielectric cavity to be electromagnetically coupled to the feed line,

wherein the plurality of metal vias determine a size of the dielectric cavity,

wherein the metal pattern electromagnetically coupled to the feed line is changed, such that impedance formed by the feed line and the metal pattern is changed, and

the feed line and an entire portion of the at least one metal pattern are disposed on the same layer of the multilayer substrate.

9. The dielectric cavity antenna of claim 8 , wherein the dielectric cavity has a rectangular parallelepiped shape or a cylindrical shape.

10. The dielectric cavity antenna of claim 8 , wherein the feed line is extended from any one layer of the multilayer substrate to the surface of the dielectric cavity or the inner portion of the dielectric cavity.

11. The dielectric cavity antenna of claim 8 , wherein the feed line is a strip line, a micro-strip line, or a CPW line.

12. The dielectric cavity antenna of claim 8 , wherein the metal pattern is spaced apart from the feed line by a predetermined interval.

13. The dielectric cavity antenna of claim 8 , wherein a distance between the metal pattern and the opening is smaller than a distance between the feed line and the metal pattern.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2012
From: HAN, MYEONG WOO; LEE, JUNG AUN; KIM, NAM HEUNG
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 027627/0167 →
Priority Claims (1)
KR 10-2011-0120944 · Nov 18, 2011 · national
Continuity (1)
Related Publication 20130127669A1 · May 23, 2013