IP Library Granted Patent US 8,501,304
Granted Patent B2
US 8,501,304 · App. 13/366,134 · Granted Aug 6, 2013

Methods and compositions for forming patterns with isolated or discrete features using block copolymer materials

Inventors: Mark P. Stoykovich (Dover, NH); Huiman Kang (Madison, WI); Konstantinos C. Daoulas (Goettingen, DE); Juan J. De Pablo (Madison, WI); Marcus Muller (Goettingen, DE); Paul Franklin Nealey (Madison, MI)
Assignee: Wisconsin Alumni Research Foundation
B41M5/52B41M5/5254B41M5/5218D04H13/007B32B5/26B32B27/12
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,501,304
App. No.
13/366,134
Granted
Aug 6, 2013
Kind
B2
Abstract

Methods of directing the self assembly of block copolymers on chemically patterned surfaces to pattern discrete or isolated features needed for applications including patterning integrated circuit layouts are described. According to various embodiments, these features include lines, t-junctions, bends, spots and jogs. In certain embodiments a uniform field surrounds the discrete feature or features. In certain embodiments, a layer contains two or more distinct regions, the regions differing in one or more of type of feature, size, and/or pitch. An example is an isolated spot at one area of the substrate, and a t-junction at another area of the substrate. These features or regions of features may be separated by unpatterned or uniform fields, or may be adjacent to one another. Applications include masks for nanoscale pattern transfer as well as the fabrication of integrated circuit device structures.

Claims (27)

1. A structure comprising:

a) a chemically patterned substrate; and

b) a copolymer layer on said substrate; the layer comprising one or more isolated features registered with the underlying substrate, wherein the one or more isolated features are isolated by an unpatterned region and/or by a uniform region of the copolymer layer.

2. The structure in claim 1 , wherein the one or more isolated features are selected from at least one of the following: a periodic array of spots, an isolated spot, a t-junction, a jog, an isolated line, periodic line segments, and a bend.

3. The structure of claim 1 , wherein the layer comprises a nested array of one or more features.

4. The structure of claim 1 , wherein the layer comprises an isolated feature embedded in lamella.

5. The structure of claim 1 , wherein the copolymer layer comprises two or more of isolated features.

6. The structure of claim 5 , wherein at least two of the two or more isolated features are of different sizes and/or pitches.

7. A structure comprising:

a patterned substrate;

a first region comprising one or more perpendicular-oriented domains of a block copolymer material overlying the patterned substrate, wherein said perpendicular-oriented domains are registered with the underlying substrate; and

a second region comprising one or more parallel-oriented domains of the block copolymer material.

8. The structure of claim 7 , wherein one or more parallel-oriented domains are configured to act as an etch mask.

9. The structure of claim 7 , wherein the one or more perpendicular-oriented domains comprise at least one of the following features: a periodic array of spots, an isolated spot, a t-junction, a jog, an isolated line, periodic line segments, and a bend.

10. The structure of claim 7 , wherein the pattern comprises one or more regions in which the scale L s of the pattern is at least twice the scale L B of the block copolymer material in the bulk and one or more regions in which the scale L s of the pattern is commensurate with the scale L B of the block copolymer material in the bulk.

11. The structure of claim 7 , wherein the substrate is a chemically patterned substrate.

12. The structure of claim 1 , wherein the layer comprises a first patterned region comprising one or more patterned features and a second patterned region comprising one or more patterned features, wherein the first and second patterned regions differ in one or more of feature geometry, feature size, or feature pitch.

13. A structure comprising:

a substrate pattern having a first patterned region comprising one or more patterned features and a second patterned region comprising one or more patterned features, wherein the first and second patterned regions differ in one or more of feature geometry, feature size, or feature pitch; and

a copolymer material overlying the substrate pattern, wherein the patterned features of the first patterned region and the patterned features of the second patterned region are replicated in the copolymer material.

14. The structure of claim 13 , wherein each of the first and second patterned regions comprises two adjacent differently activated areas.

15. The structure of claim 13 , wherein each of the first and second patterned regions comprises two adjacent areas having different surface chemistries.

16. The structure of claim 13 , wherein the first and second patterned regions are separated by are separated by a uniformly patterned or unpatterned region.

17. The structure of claim 13 , wherein the feature geometry of the first patterned region is selected from the following: a jog, a bend, a t-junction, a line segment, a single spot, and an array of spots.

18. A structure comprising a thin film of a block copolymer material, the thin film including first and second ordered regions, the first ordered region comprising linear domains of the block copolymer material having a first direction and a second ordered region comprising linear domains of the block copolymer material having a second direction, wherein said first direction is different from said second direction.

19. The structure of claim 18 , wherein the domains of the first and second ordered regions of the copolymer structure are registered with a patterned substrate.

20. The structure of claim 19 , wherein the substrate is a chemically patterned substrate.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 16, 2013
From: NEALEY, PAUL F.; DEPABLO, JUAN J.; KANG, HUIMAN; STOYKOVICH, MARK P.; DAOULAS, KONSTANTINOS C.; MUELLER, MARCUS
To: WISCONSIN ALUMNI RESEARCH FOUNDATION
Reel/Frame 031210/0127 →
CONFIRMATORY LICENSE Recorded May 16, 2012
From: WISCONSIN ALUMNI RESEARCH FOUNDATION
To: NATIONAL SCIENCE FOUNDATION
Reel/Frame 028222/0099 →
Continuity (5)
Division 11879758 · Jul 17, 2007
Continuation In Part 11286260 · Nov 22, 2005
Provisional Application 60831736 · Jul 17, 2006
Provisional Application 60630484 · Nov 22, 2004
Related Publication 20120164392A1 · Jun 28, 2012